JPH0189752U - - Google Patents

Info

Publication number
JPH0189752U
JPH0189752U JP15957688U JP15957688U JPH0189752U JP H0189752 U JPH0189752 U JP H0189752U JP 15957688 U JP15957688 U JP 15957688U JP 15957688 U JP15957688 U JP 15957688U JP H0189752 U JPH0189752 U JP H0189752U
Authority
JP
Japan
Prior art keywords
conductor
circuit board
brazed
conductor pin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15957688U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0536275Y2 (el
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988159576U priority Critical patent/JPH0536275Y2/ja
Publication of JPH0189752U publication Critical patent/JPH0189752U/ja
Application granted granted Critical
Publication of JPH0536275Y2 publication Critical patent/JPH0536275Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988159576U 1988-12-08 1988-12-08 Expired - Lifetime JPH0536275Y2 (el)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988159576U JPH0536275Y2 (el) 1988-12-08 1988-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988159576U JPH0536275Y2 (el) 1988-12-08 1988-12-08

Publications (2)

Publication Number Publication Date
JPH0189752U true JPH0189752U (el) 1989-06-13
JPH0536275Y2 JPH0536275Y2 (el) 1993-09-14

Family

ID=31440912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988159576U Expired - Lifetime JPH0536275Y2 (el) 1988-12-08 1988-12-08

Country Status (1)

Country Link
JP (1) JPH0536275Y2 (el)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device
JPS5743452A (en) * 1980-08-28 1982-03-11 Mitsubishi Electric Corp Mounting structure for integrated circuit substrate
JPS5791586A (en) * 1980-11-29 1982-06-07 Tokyo Shibaura Electric Co Hybrid integrated circuit device
JPS57121256A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Ceramic multilayer wiring structure
JPS57181144A (en) * 1981-05-01 1982-11-08 Toshiba Corp Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559746A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Semiconductor device and its mounting circuit device
JPS5743452A (en) * 1980-08-28 1982-03-11 Mitsubishi Electric Corp Mounting structure for integrated circuit substrate
JPS5791586A (en) * 1980-11-29 1982-06-07 Tokyo Shibaura Electric Co Hybrid integrated circuit device
JPS57121256A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Ceramic multilayer wiring structure
JPS57181144A (en) * 1981-05-01 1982-11-08 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法

Also Published As

Publication number Publication date
JPH0536275Y2 (el) 1993-09-14

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