JPH0351870U - - Google Patents
Info
- Publication number
- JPH0351870U JPH0351870U JP11290289U JP11290289U JPH0351870U JP H0351870 U JPH0351870 U JP H0351870U JP 11290289 U JP11290289 U JP 11290289U JP 11290289 U JP11290289 U JP 11290289U JP H0351870 U JPH0351870 U JP H0351870U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- package
- electrode
- ceramic
- chip carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11290289U JPH0351870U (el) | 1989-09-27 | 1989-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11290289U JPH0351870U (el) | 1989-09-27 | 1989-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0351870U true JPH0351870U (el) | 1991-05-20 |
Family
ID=31661337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11290289U Pending JPH0351870U (el) | 1989-09-27 | 1989-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351870U (el) |
-
1989
- 1989-09-27 JP JP11290289U patent/JPH0351870U/ja active Pending