JPH0187539U - - Google Patents
Info
- Publication number
- JPH0187539U JPH0187539U JP18346687U JP18346687U JPH0187539U JP H0187539 U JPH0187539 U JP H0187539U JP 18346687 U JP18346687 U JP 18346687U JP 18346687 U JP18346687 U JP 18346687U JP H0187539 U JPH0187539 U JP H0187539U
- Authority
- JP
- Japan
- Prior art keywords
- push
- view
- pellets
- sheet
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18346687U JPH0187539U (enrdf_load_html_response) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18346687U JPH0187539U (enrdf_load_html_response) | 1987-11-30 | 1987-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0187539U true JPH0187539U (enrdf_load_html_response) | 1989-06-09 |
Family
ID=31474887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18346687U Pending JPH0187539U (enrdf_load_html_response) | 1987-11-30 | 1987-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0187539U (enrdf_load_html_response) |
-
1987
- 1987-11-30 JP JP18346687U patent/JPH0187539U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0184434U (enrdf_load_html_response) | ||
KR102388056B1 (ko) | 냉각 시트 접합 방법 및 그 접합 장치 | |
JPH0187539U (enrdf_load_html_response) | ||
TWI641070B (zh) | 晶片頂針裝置 | |
JP3611962B2 (ja) | チップの突き上げ装置 | |
JP3509538B2 (ja) | チップの突き上げ装置 | |
JP3213273B2 (ja) | チップのピックアップ装置 | |
JPS5989538U (ja) | ペレツトピツクアツプ装置 | |
JPS611842U (ja) | ボンデイング装置のプランジアツプヘツド | |
JPS6468938A (en) | Removal of defective semiconductor element | |
KR100346482B1 (ko) | 다이본딩의이젝팅장치 | |
JP2710251B2 (ja) | 電子部品装着方法 | |
JPS6027610B2 (ja) | 可撓性板状体の分離方法 | |
JPS58123827U (ja) | パレタイザ− | |
JPH0465704U (enrdf_load_html_response) | ||
JPH03229430A (ja) | 半導体ダイボンディング装置 | |
JPS6382999U (enrdf_load_html_response) | ||
JPH02120465U (enrdf_load_html_response) | ||
JPH0252343U (enrdf_load_html_response) | ||
JPH05160331A (ja) | ダイボンディング方法及びリードフレーム | |
JPH0415848U (enrdf_load_html_response) | ||
JPS6230342U (enrdf_load_html_response) | ||
JPH01127242U (enrdf_load_html_response) | ||
JPH04117492U (ja) | チツプ状回路部品デイストリビユーター | |
JPS59190727U (ja) | 薄板材供給装置 |