JPH0183368U - - Google Patents

Info

Publication number
JPH0183368U
JPH0183368U JP1987178716U JP17871687U JPH0183368U JP H0183368 U JPH0183368 U JP H0183368U JP 1987178716 U JP1987178716 U JP 1987178716U JP 17871687 U JP17871687 U JP 17871687U JP H0183368 U JPH0183368 U JP H0183368U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
grid
holes
hole located
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987178716U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987178716U priority Critical patent/JPH0183368U/ja
Publication of JPH0183368U publication Critical patent/JPH0183368U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示すプリント基板
の平面図、第2図は第1図のA―A′線に沿つて
切断した斜視図、第3図は本考案のプリント基板
の配線例を示す平面図である。 1……プリント基板、2……ビアスルホール領
域、3……メインスルホール、4a,4b,4c
,4d……サブスルホール、5,7,8……第1
層の既配線、6……第2層の既配線、9……(A
―B)間の第1層配線、10……(A―B)間の
第2層配線、11……(C―D)間の第1層配線
、12……(C―D)間の第2層配線。
Fig. 1 is a plan view of a printed circuit board showing an embodiment of the present invention, Fig. 2 is a perspective view taken along line A-A' in Fig. 1, and Fig. 3 is a wiring diagram of the printed circuit board of the present invention. FIG. 3 is a plan view showing an example. 1... Printed circuit board, 2... Via through hole area, 3... Main through hole, 4a, 4b, 4c
, 4d... Sub-through hole, 5, 7, 8... 1st
Already wired in the layer, 6... Already wired in the second layer, 9... (A
-B), 10...2nd layer wiring between (A-B), 11...(C-D), 12...(C-D) 2nd layer wiring.

Claims (1)

【実用新案登録請求の範囲】 導体層間を電気的に接続するためのスルホール
を備えたプリント基板において、 前記スルホールとして格子上に位置するメイン
スルホールと格子上以外の場所に位置するサブス
ルホールとを備えたことを特徴とするプリント基
板。
[Claims for Utility Model Registration] A printed circuit board equipped with through holes for electrically connecting conductor layers, the through holes comprising a main through hole located on the grid and a sub through hole located at a location other than the grid. A printed circuit board characterized by:
JP1987178716U 1987-11-24 1987-11-24 Pending JPH0183368U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987178716U JPH0183368U (en) 1987-11-24 1987-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987178716U JPH0183368U (en) 1987-11-24 1987-11-24

Publications (1)

Publication Number Publication Date
JPH0183368U true JPH0183368U (en) 1989-06-02

Family

ID=31470323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987178716U Pending JPH0183368U (en) 1987-11-24 1987-11-24

Country Status (1)

Country Link
JP (1) JPH0183368U (en)

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