JPH0183355U - - Google Patents
Info
- Publication number
- JPH0183355U JPH0183355U JP17891687U JP17891687U JPH0183355U JP H0183355 U JPH0183355 U JP H0183355U JP 17891687 U JP17891687 U JP 17891687U JP 17891687 U JP17891687 U JP 17891687U JP H0183355 U JPH0183355 U JP H0183355U
- Authority
- JP
- Japan
- Prior art keywords
- led
- wiring board
- molded body
- disposed
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Facsimile Scanning Arrangements (AREA)
Description
第１図ａは本考案に係るＬＥＤアレイの要部断
面図、第１図ｂは第１図ａをＡ―Ａ線で切断した
図、第２図ａは従来のＬＥＤアレイの要部断面図
、第２図ｂは第２図ａをＡ―Ａ線で切断した図で
ある。
Figure 1a is a cross-sectional view of the main part of the LED array according to the present invention, Figure 1b is a cross-sectional view of the main part of the conventional LED array, Figure 1b is a cross-sectional view of the main part of the conventional LED array , FIG. 2b is a diagram obtained by cutting FIG. 2a along the line AA.
Claims (1)
線層と、この配線層に一直線状に接続するＬＥＤ
素子と、このＬＥＤ素子に対向して覆う位置にも
配置し前記配線基板に一体に取付けるレンズ効果
を持つ透明成形体を具備するＬＥＤアレイにおい
て、この透明成形体の端部に設置する透孔を利用
して前記配線基板の他表面に配置する前記ＬＥＤ
アレイ用応用機器間を固定することを特徴とする
ＬＥＤアレイ。 A wiring board, a wiring layer formed on the surface of this wiring board, and an LED connected in a straight line to this wiring layer.
In an LED array comprising an element and a transparent molded body having a lens effect, which is also disposed at a position facing and covering the LED element and is integrally attached to the wiring board, a through hole is installed at an end of the transparent molded body. the LED disposed on the other surface of the wiring board;
An LED array characterized by fixing between array application devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17891687U JPH0183355U (en) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17891687U JPH0183355U (en) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183355U true JPH0183355U (en) | 1989-06-02 |
Family
ID=31470512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17891687U Pending JPH0183355U (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183355U (en) |
-
1987
- 1987-11-26 JP JP17891687U patent/JPH0183355U/ja active Pending