JPH0176054U - - Google Patents
Info
- Publication number
- JPH0176054U JPH0176054U JP1987171798U JP17179887U JPH0176054U JP H0176054 U JPH0176054 U JP H0176054U JP 1987171798 U JP1987171798 U JP 1987171798U JP 17179887 U JP17179887 U JP 17179887U JP H0176054 U JPH0176054 U JP H0176054U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- high thermal
- pin
- semiconductor device
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987171798U JPH0176054U (fr) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987171798U JPH0176054U (fr) | 1987-11-10 | 1987-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0176054U true JPH0176054U (fr) | 1989-05-23 |
Family
ID=31463809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987171798U Pending JPH0176054U (fr) | 1987-11-10 | 1987-11-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0176054U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0316247A (ja) * | 1989-06-14 | 1991-01-24 | Hitachi Ltd | 半導体素子用パツケージ |
-
1987
- 1987-11-10 JP JP1987171798U patent/JPH0176054U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0316247A (ja) * | 1989-06-14 | 1991-01-24 | Hitachi Ltd | 半導体素子用パツケージ |