JPH0173951U - - Google Patents
Info
- Publication number
- JPH0173951U JPH0173951U JP1987169802U JP16980287U JPH0173951U JP H0173951 U JPH0173951 U JP H0173951U JP 1987169802 U JP1987169802 U JP 1987169802U JP 16980287 U JP16980287 U JP 16980287U JP H0173951 U JPH0173951 U JP H0173951U
- Authority
- JP
- Japan
- Prior art keywords
- rectifiers
- electrode body
- series
- columnar body
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Description
第１図は、本考案の一実施例の高電圧整流用半
導体装置の模式的断面図、第２図は従来例の高電
圧整流用半導体装置の模式的断面図である。 ２…整流体、３…電極体、４…リード線、５…
ガラス、６…樹脂、８…接続導体。
導体装置の模式的断面図、第２図は従来例の高電
圧整流用半導体装置の模式的断面図である。 ２…整流体、３…電極体、４…リード線、５…
ガラス、６…樹脂、８…接続導体。
Claims (1)
- 直列に接続された複数個の半導体整流片からな
る整流体がさらに接続導体を介して複数個直列接
続されて柱状体に形成され、この柱状体の両端に
は他端にリード線を有する電極体が接続され、さ
らに前記各整流体にはその側面を絶縁被覆するガ
ラスが設けられると共に前記電極体近傍のリード
線を含めた全体に樹脂封止がされていることを特
徴とする高電圧整流用半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169802U JPH0173951U (ja) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169802U JPH0173951U (ja) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173951U true JPH0173951U (ja) | 1989-05-18 |
Family
ID=31460182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169802U Pending JPH0173951U (ja) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173951U (ja) |
-
1987
- 1987-11-06 JP JP1987169802U patent/JPH0173951U/ja active Pending