JPH0173931U - - Google Patents

Info

Publication number
JPH0173931U
JPH0173931U JP1987169556U JP16955687U JPH0173931U JP H0173931 U JPH0173931 U JP H0173931U JP 1987169556 U JP1987169556 U JP 1987169556U JP 16955687 U JP16955687 U JP 16955687U JP H0173931 U JPH0173931 U JP H0173931U
Authority
JP
Japan
Prior art keywords
metal plate
metal
soldering
semiconductor
main surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987169556U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987169556U priority Critical patent/JPH0173931U/ja
Publication of JPH0173931U publication Critical patent/JPH0173931U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1987169556U 1987-11-05 1987-11-05 Pending JPH0173931U (US07655688-20100202-C00086.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987169556U JPH0173931U (US07655688-20100202-C00086.png) 1987-11-05 1987-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987169556U JPH0173931U (US07655688-20100202-C00086.png) 1987-11-05 1987-11-05

Publications (1)

Publication Number Publication Date
JPH0173931U true JPH0173931U (US07655688-20100202-C00086.png) 1989-05-18

Family

ID=31459726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987169556U Pending JPH0173931U (US07655688-20100202-C00086.png) 1987-11-05 1987-11-05

Country Status (1)

Country Link
JP (1) JPH0173931U (US07655688-20100202-C00086.png)

Similar Documents

Publication Publication Date Title
JPH0183331U (US07655688-20100202-C00086.png)
JPH0173931U (US07655688-20100202-C00086.png)
JPH0187547U (US07655688-20100202-C00086.png)
JPS5820536U (ja) 半導体装置
JPS6117759U (ja) 発光器
JPH0183356U (US07655688-20100202-C00086.png)
JPH03122548U (US07655688-20100202-C00086.png)
JPS5866690U (ja) ハイブリツド集積回路
JPH02148569U (US07655688-20100202-C00086.png)
JPS6279368U (US07655688-20100202-C00086.png)
JPS61171247U (US07655688-20100202-C00086.png)
JPS60129141U (ja) 半導体装置
JPS63167742U (US07655688-20100202-C00086.png)
JPS6112260U (ja) 半導体レ−ザアレイ装置
JPS58116234U (ja) 厚膜モジユ−ル放熱板
JPS59145055U (ja) 半導体レ−ザ用ヒ−トシンク
JPS6015299U (ja) ズボンプレス器
JPH01104029U (US07655688-20100202-C00086.png)
JPS6183041U (US07655688-20100202-C00086.png)
JPH0479427U (US07655688-20100202-C00086.png)
JPS6424834U (US07655688-20100202-C00086.png)
JPS6448027U (US07655688-20100202-C00086.png)
JPH0173963U (US07655688-20100202-C00086.png)
JPH0192142U (US07655688-20100202-C00086.png)
JPS6185158U (US07655688-20100202-C00086.png)