JPH0171475U - - Google Patents
Info
- Publication number
- JPH0171475U JPH0171475U JP1987167244U JP16724487U JPH0171475U JP H0171475 U JPH0171475 U JP H0171475U JP 1987167244 U JP1987167244 U JP 1987167244U JP 16724487 U JP16724487 U JP 16724487U JP H0171475 U JPH0171475 U JP H0171475U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive layer
- circuit board
- wiring pattern
- nickel film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167244U JPH0171475U (enExample) | 1987-10-31 | 1987-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167244U JPH0171475U (enExample) | 1987-10-31 | 1987-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171475U true JPH0171475U (enExample) | 1989-05-12 |
Family
ID=31455361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987167244U Pending JPH0171475U (enExample) | 1987-10-31 | 1987-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171475U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159592A (ja) * | 1983-03-03 | 1984-09-10 | オ−ケ−プリント配線株式会社 | セラミツク基板の製造方法 |
| JPS62104075A (ja) * | 1985-10-30 | 1987-05-14 | Toshiba Corp | 固体撮像装置 |
-
1987
- 1987-10-31 JP JP1987167244U patent/JPH0171475U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159592A (ja) * | 1983-03-03 | 1984-09-10 | オ−ケ−プリント配線株式会社 | セラミツク基板の製造方法 |
| JPS62104075A (ja) * | 1985-10-30 | 1987-05-14 | Toshiba Corp | 固体撮像装置 |