JPS63197334U - - Google Patents
Info
- Publication number
- JPS63197334U JPS63197334U JP1987089270U JP8927087U JPS63197334U JP S63197334 U JPS63197334 U JP S63197334U JP 1987089270 U JP1987089270 U JP 1987089270U JP 8927087 U JP8927087 U JP 8927087U JP S63197334 U JPS63197334 U JP S63197334U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- conductor layer
- layer pattern
- copper foil
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089270U JPS63197334U (enExample) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089270U JPS63197334U (enExample) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197334U true JPS63197334U (enExample) | 1988-12-19 |
Family
ID=30948110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987089270U Pending JPS63197334U (enExample) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197334U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024069963A1 (ja) * | 2022-09-30 | 2024-04-04 | ファナック株式会社 | プリント基板および実装品の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5034170A (enExample) * | 1973-07-27 | 1975-04-02 | ||
| JPS61222138A (ja) * | 1985-03-27 | 1986-10-02 | Toshiba Corp | 混成集積回路 |
| JPS6226831A (ja) * | 1985-07-29 | 1987-02-04 | Oki Electric Ind Co Ltd | 厚膜回路パタ−ン |
-
1987
- 1987-06-10 JP JP1987089270U patent/JPS63197334U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5034170A (enExample) * | 1973-07-27 | 1975-04-02 | ||
| JPS61222138A (ja) * | 1985-03-27 | 1986-10-02 | Toshiba Corp | 混成集積回路 |
| JPS6226831A (ja) * | 1985-07-29 | 1987-02-04 | Oki Electric Ind Co Ltd | 厚膜回路パタ−ン |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024069963A1 (ja) * | 2022-09-30 | 2024-04-04 | ファナック株式会社 | プリント基板および実装品の製造方法 |