JPH0171471U - - Google Patents
Info
- Publication number
- JPH0171471U JPH0171471U JP1987166513U JP16651387U JPH0171471U JP H0171471 U JPH0171471 U JP H0171471U JP 1987166513 U JP1987166513 U JP 1987166513U JP 16651387 U JP16651387 U JP 16651387U JP H0171471 U JPH0171471 U JP H0171471U
- Authority
- JP
- Japan
- Prior art keywords
- coating roll
- printed wiring
- wiring boards
- showing
- groove pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案のプリント配線板用コーテイン
グロールを示す斜視図、第２図ａ，ｂはその製造
方法を説明するための斜視図、第３図はコーテイ
ングロールによりプリント配線板にソルダーレジ
ストインクを塗布するところを示す斜視図、第４
図ａは従来のコーテイングロールを示す斜視図、
第４図ｂは従来のコーテイングロールの溝を拡大
して示す断面図である。
１……プリント配線板、２……ソルダーレジス
トインク、３……溝、４……コーテイングロール
、５……バイト、６……溝パターン、７……感光
性ゴムシート、８……マスクフイルム。
Figure 1 is a perspective view showing the coating roll for printed wiring boards of the present invention, Figures 2a and b are perspective views for explaining the manufacturing method thereof, and Figure 3 shows solder resist ink applied to printed wiring boards by coating rolls. Perspective view showing the application of the 4th
Figure a is a perspective view showing a conventional coating roll;
FIG. 4b is an enlarged sectional view showing the grooves of a conventional coating roll. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Solder resist ink, 3... Groove, 4... Coating roll, 5... Bit, 6... Groove pattern, 7... Photosensitive rubber sheet, 8... Mask film.
Claims (1)
ゴム凸版で表面層が構成されていることを特徴と
するプリント配線板用コーテイングロール。 A coating roll for printed wiring boards, characterized in that the surface layer is composed of a photosensitive rubber letterpress plate on which a groove pattern is formed by exposure and development.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166513U JPH0171471U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166513U JPH0171471U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171471U true JPH0171471U (en) | 1989-05-12 |
Family
ID=31453960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166513U Pending JPH0171471U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171471U (en) |
-
1987
- 1987-10-30 JP JP1987166513U patent/JPH0171471U/ja active Pending
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