JPH0170380U - - Google Patents
Info
- Publication number
- JPH0170380U JPH0170380U JP1987166093U JP16609387U JPH0170380U JP H0170380 U JPH0170380 U JP H0170380U JP 1987166093 U JP1987166093 U JP 1987166093U JP 16609387 U JP16609387 U JP 16609387U JP H0170380 U JPH0170380 U JP H0170380U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounted component
- circuit
- component
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166093U JPH0170380U (en, 2012) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166093U JPH0170380U (en, 2012) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170380U true JPH0170380U (en, 2012) | 1989-05-10 |
Family
ID=31453171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166093U Pending JPH0170380U (en, 2012) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170380U (en, 2012) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61188957A (ja) * | 1985-02-18 | 1986-08-22 | Toshiba Corp | 回路モジユ−ルの製造方法 |
| JPS62162322A (ja) * | 1986-01-13 | 1987-07-18 | アルプス電気株式会社 | ネツトワ−ク電子部品の製造方法 |
| JPS633154B2 (en, 2012) * | 1979-03-28 | 1988-01-22 | Hitachi Ltd |
-
1987
- 1987-10-29 JP JP1987166093U patent/JPH0170380U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS633154B2 (en, 2012) * | 1979-03-28 | 1988-01-22 | Hitachi Ltd | |
| JPS61188957A (ja) * | 1985-02-18 | 1986-08-22 | Toshiba Corp | 回路モジユ−ルの製造方法 |
| JPS62162322A (ja) * | 1986-01-13 | 1987-07-18 | アルプス電気株式会社 | ネツトワ−ク電子部品の製造方法 |