JPH0165860U - - Google Patents
Info
- Publication number
- JPH0165860U JPH0165860U JP1987161946U JP16194687U JPH0165860U JP H0165860 U JPH0165860 U JP H0165860U JP 1987161946 U JP1987161946 U JP 1987161946U JP 16194687 U JP16194687 U JP 16194687U JP H0165860 U JPH0165860 U JP H0165860U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plating
- cup
- shaped
- plating tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 10
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161946U JPH0730687Y2 (ja) | 1987-10-22 | 1987-10-22 | バンプめっき装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161946U JPH0730687Y2 (ja) | 1987-10-22 | 1987-10-22 | バンプめっき装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0165860U true JPH0165860U (sv) | 1989-04-27 |
| JPH0730687Y2 JPH0730687Y2 (ja) | 1995-07-12 |
Family
ID=31445327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161946U Expired - Lifetime JPH0730687Y2 (ja) | 1987-10-22 | 1987-10-22 | バンプめっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730687Y2 (sv) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003326419A (ja) * | 2002-05-09 | 2003-11-18 | Sony Corp | めっき方法、めっき装置、及び研磨方法、研磨装置、並びに半導体装置の製造方法 |
| JP2016108601A (ja) * | 2014-12-04 | 2016-06-20 | 株式会社オジックテクノロジーズ | 治具及び治具生産方法 |
| CN106471162A (zh) * | 2014-06-26 | 2017-03-01 | 株式会社村田制作所 | 电镀用夹具 |
-
1987
- 1987-10-22 JP JP1987161946U patent/JPH0730687Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003326419A (ja) * | 2002-05-09 | 2003-11-18 | Sony Corp | めっき方法、めっき装置、及び研磨方法、研磨装置、並びに半導体装置の製造方法 |
| CN106471162A (zh) * | 2014-06-26 | 2017-03-01 | 株式会社村田制作所 | 电镀用夹具 |
| JP2016108601A (ja) * | 2014-12-04 | 2016-06-20 | 株式会社オジックテクノロジーズ | 治具及び治具生産方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0730687Y2 (ja) | 1995-07-12 |