JPH0165135U - - Google Patents

Info

Publication number
JPH0165135U
JPH0165135U JP1987161504U JP16150487U JPH0165135U JP H0165135 U JPH0165135 U JP H0165135U JP 1987161504 U JP1987161504 U JP 1987161504U JP 16150487 U JP16150487 U JP 16150487U JP H0165135 U JPH0165135 U JP H0165135U
Authority
JP
Japan
Prior art keywords
bonding pad
metal layer
internal
internal bonding
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987161504U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161504U priority Critical patent/JPH0165135U/ja
Publication of JPH0165135U publication Critical patent/JPH0165135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/90
    • H10W72/536
    • H10W72/59
    • H10W72/934
    • H10W72/983

Landscapes

  • Wire Bonding (AREA)
JP1987161504U 1987-10-21 1987-10-21 Pending JPH0165135U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161504U JPH0165135U (cg-RX-API-DMAC10.html) 1987-10-21 1987-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161504U JPH0165135U (cg-RX-API-DMAC10.html) 1987-10-21 1987-10-21

Publications (1)

Publication Number Publication Date
JPH0165135U true JPH0165135U (cg-RX-API-DMAC10.html) 1989-04-26

Family

ID=31444496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161504U Pending JPH0165135U (cg-RX-API-DMAC10.html) 1987-10-21 1987-10-21

Country Status (1)

Country Link
JP (1) JPH0165135U (cg-RX-API-DMAC10.html)

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