JPH0158675B2 - - Google Patents
Info
- Publication number
- JPH0158675B2 JPH0158675B2 JP56049311A JP4931181A JPH0158675B2 JP H0158675 B2 JPH0158675 B2 JP H0158675B2 JP 56049311 A JP56049311 A JP 56049311A JP 4931181 A JP4931181 A JP 4931181A JP H0158675 B2 JPH0158675 B2 JP H0158675B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetoresistive
- substrate
- detection piece
- sensing element
- magnetoresistive sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 18
- 230000000694 effects Effects 0.000 claims description 8
- 239000000696 magnetic material Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
Description
【発明の詳細な説明】
本発明は磁気抵抗検出素子、特に防耐湿性を向
上させた磁気抵抗検出素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magnetoresistive sensing element, and particularly to a magnetoresistive sensing element with improved moisture resistance.
従来、磁気抵抗効果を利用した磁気抵抗検出素
子としては、第１図、第２図に要部断面図で示し
たように基板１０の片面に磁気抵抗検出片２が被
着形成され、この磁気抵抗検出片２の表面に例え
ばSiO2もしくは耐湿性樹脂を被着形成して保護
膜３を設け、この保護膜３により磁気抵抗検出片
２の防耐湿性を維持すると共に損傷の防止をはか
つていた。なお、これらの図において、４は磁気
抵抗検出片２の信号取り出し用端子、５は信号の
外部引き出し用リード線、６は端子４とリード線
５の芯線とを電気的に接続する半田、７は磁気抵
抗検出片２と端子４とを電気的に接続するボンデ
イングワイヤ、８は端子４および基板１０を接着
剤９を介して固定する基板である。 Conventionally, as a magnetoresistive sensing element using magnetoresistive effect, a magnetoresistive sensing piece 2 is formed on one side of a substrate 10, as shown in the cross-sectional views of main parts in FIG. 1 and FIG. A protective film 3 is provided on the surface of the resistance detection piece 2 by depositing, for example, SiO 2 or moisture-resistant resin, and this protection film 3 maintains the moisture resistance of the magnetoresistive detection piece 2 and prevents damage. there was. In these figures, 4 is a signal extraction terminal of the magnetic resistance detection piece 2, 5 is a lead wire for external signal extraction, 6 is solder that electrically connects the terminal 4 and the core wire of the lead wire 5, and 7 is a 8 is a bonding wire that electrically connects the magnetoresistive detection piece 2 and the terminal 4, and 8 is a board that fixes the terminal 4 and the board 10 via an adhesive 9.
しかしながら上記構成による磁気抵抗検出素子
において、防耐湿性の保護膜３は磁気抵抗検出片
２の上方で多くとも数10μm程度の膜厚しか形成
できないため、完全な防耐湿処理を得ることが難
かしく、また損傷からの防護の点でも十分ではな
く、しかも長期間の使用において磁気抵抗検出片
２が変質して磁気抵抗効果が劣化するという欠点
があつた。 However, in the magnetoresistive sensing element having the above configuration, the moisture-proof protective film 3 can only be formed in a thickness of several tens of μm at most above the magnetoresistive sensing piece 2, making it difficult to obtain complete moisture-proofing. Moreover, it is not sufficient in terms of protection from damage, and furthermore, the magnetoresistive detection piece 2 deteriorates in quality during long-term use, resulting in deterioration of the magnetoresistive effect.
したがつて本発明は、磁気抵抗検出片が形成さ
れた基板の対向面をパツケージで覆うことによつ
て、磁気抵抗検出片の防耐湿性の向上及び損傷の
防止をはかつた磁気抵抗検出素子を提供すること
を目的としている。以下図面を用いて本発明の実
施例を詳細に説明する。 Therefore, the present invention provides a magnetoresistive sensing element that improves the moisture resistance and prevents damage to the magnetoresistive sensing piece by covering the facing surface of the substrate on which the magnetic resistance sensing piece is formed with a package. is intended to provide. Embodiments of the present invention will be described in detail below with reference to the drawings.
第３図は本発明による磁気抵抗検出素子の一実
施例を示す要部断面構成図である。同図におい
て、非磁性体でかつ電気伝導性のない例えば基板
１０の中央部分には磁気抵抗効果を有する磁気抵
抗検出片２が被着形成されており、この基板１０
の磁気抵抗検出片２形成面には、対向辺に導体部
１１およびこの導体部１１に電気的に接続された
信号取り出し用のリード１２を設けた例えばセラ
ミツクなどからなる枠状のリードサポート１３が
接着配置されている。そして、磁気抵抗検出片２
の端子部とリードサポート１３上の導体部１１と
が例えば金線などのボンデイングワイヤ１４で電
気的に接続されている。また、このリードサポー
ト１３のボンデイングワイヤ１４形成面には断面
が凹形状を有する例えばセラミツクまたは樹脂な
どの成形体からなるパツケージ１５が接着配置さ
れている。 FIG. 3 is a cross-sectional configuration diagram of essential parts showing an embodiment of the magnetoresistive sensing element according to the present invention. In the same figure, a magnetoresistive detection piece 2 having a magnetoresistive effect is adhered to the center portion of a substrate 10, which is made of a non-magnetic material and has no electrical conductivity, for example.
On the surface on which the magnetoresistive detection piece 2 is formed, there is a frame-shaped lead support 13 made of, for example, ceramic, which has a conductor part 11 and a signal extraction lead 12 electrically connected to the conductor part 11 on opposite sides. Adhesive is placed. And magnetic resistance detection piece 2
The terminal portion and the conductor portion 11 on the lead support 13 are electrically connected by a bonding wire 14 such as a gold wire. Further, on the surface of the lead support 13 on which the bonding wire 14 is formed, a package 15 made of a molded body such as ceramic or resin and having a concave cross section is adhered and arranged.
このような構成によれば、磁気抵抗検出片２
は、基板１０とパツケージ１５とから構成される
筐体内に収納して封止されるので、外気から確実
に遮断されて湿気による腐触を防止すると共に損
傷から保護することができる。 According to such a configuration, the magnetic resistance detection piece 2
Since it is housed and sealed in a housing made up of the substrate 10 and the package 15, it is reliably isolated from the outside air, preventing corrosion due to moisture and protecting it from damage.
第４図は本発明による磁気抵抗検出素子の他の
実施例を示す要部断面図であり、第３図と同記号
は同一要素となるのでその説明は省略する。第４
図において、基板１０の中央部には磁気抵抗検出
片２が被着形成されており、この磁気抵抗検出片
２の出力端側が基板１０の端部まで延長して形成
されている。そして、この基板１０の磁気抵抗検
出片２形成面には、端面にリード１２を接着固定
させたパツケージ１５が接着剤９で接着固定さ
れ、さらに磁気抵抗検出片２の出力端とリード１
２のパツケージ１５側とが半田もしくは導電性接
着剤１６を介して電気的に接続されている。 FIG. 4 is a sectional view of a main part showing another embodiment of the magnetoresistive sensing element according to the present invention, and since the same symbols as in FIG. 3 represent the same elements, the explanation thereof will be omitted. Fourth
In the figure, a magnetoresistive detection piece 2 is attached to the center of a substrate 10, and the output end side of this magnetoresistive detection piece 2 is formed to extend to the end of the substrate 10. Then, a package 15 having a lead 12 adhesively fixed to the end face thereof is adhesively fixed to the surface of the substrate 10 on which the magnetoresistive detection piece 2 is formed, and the output end of the magnetoresistive detection piece 2 and the lead 1
2 and the package 15 side are electrically connected via solder or conductive adhesive 16.
このような構成においても前述と全く同様の効
果が得られるとともに、磁気抵抗検出片２とリー
ド１２との間を電気的に接続するボンデイングワ
イヤ１４（第３図参照）およびそのボンデイング
作業が不用となるので、接続性における信頼性が
向上し、さらには生産コストが安価となるなどの
効果が得られる。 In such a configuration, the same effect as described above can be obtained, and the bonding wire 14 (see FIG. 3) that electrically connects the magnetoresistive detection piece 2 and the lead 12 and the bonding work therefor are unnecessary. As a result, reliability in connectivity is improved, and furthermore, effects such as lower production costs can be obtained.
なお、上記実施例においては、基板１０および
パツケージ１５の材料として非磁性材でかつ電気
絶縁性を有するガラスおよびセラミツクを用いた
場合について説明したが、本発明はこれに限定さ
れるものではなく、非磁性材からなる金属材料を
用いても、また併用して用いても前述と同様の効
果が得られることは勿論である。ただしこの場
合、磁気抵抗検出片２，リード１２の金属材料に
対する電気的絶縁性を施す必要がある。また、前
述した保護膜３と組合せれば、基板とパツケージ
との接合は気密性の高いものでなくてもよいこと
は勿論である。 In the above embodiments, the substrate 10 and the package 15 are made of glass and ceramic, which are non-magnetic and have electrical insulation properties, but the present invention is not limited thereto. Of course, the same effect as described above can be obtained even if a metal material made of a non-magnetic material is used or used in combination. However, in this case, it is necessary to provide electrical insulation to the metal materials of the magnetoresistive detection piece 2 and the lead 12. Furthermore, in combination with the above-mentioned protective film 3, it goes without saying that the bond between the substrate and the package does not have to be highly airtight.
以上説明したように本発明による磁気抵抗検出
素子によれば、磁気抵抗検出片が外気から隔離さ
れて筐体内に収納されるので、外界の雰囲気によ
り腐触することがなくなり、したがつて長期間の
使用にわたつて防耐湿性を維持することができ
る。また、磁気抵抗検出片が形成された基板を筐
体の一部分として使用しているので、筐体の肉厚
を薄くすることによつて、磁気抵抗検出片を検出
磁界の磁極に肉厚、すなわち基板の厚さまで接近
させることができるので、微小間隔幅で配列され
た磁極の配列状態を正確にしかも高感度で検知す
ることができるなどの極めて優れた効果が得られ
る。 As explained above, according to the magnetoresistive sensing element of the present invention, the magnetoresistive sensing piece is isolated from the outside air and housed in the casing, so it is not corroded by the outside atmosphere, and therefore can be used for a long period of time. Moisture resistance can be maintained over the course of use. In addition, since the substrate on which the magnetoresistive detection piece is formed is used as a part of the housing, by reducing the thickness of the housing, the magnetoresistive detection piece can be attached to the magnetic pole of the detection magnetic field by increasing the wall thickness. Since it can be brought close to the thickness of the substrate, extremely excellent effects such as being able to accurately and highly sensitively detect the arrangement state of magnetic poles arranged at minute intervals can be obtained.
第１図、第２図は従来の磁気抵抗検出素子の一
例を示す要部断面図、第３図は本発明による磁気
抵抗検出素子の一実施例を示す要部断面図、第４
図は本発明による磁気抵抗検出素子の他の実施例
を示す要部断面図である。
２……磁気抵抗検出片、９……接着剤、１０…
…基板、１１……導体部、１２……リード、１３
……リードサポート、１４……ボンデイングワイ
ヤ、１５……パツケージ、１６……導電性接着
剤。
1 and 2 are sectional views of essential parts showing an example of a conventional magnetoresistive sensing element, FIG. 3 is a sectional view of essential parts showing an embodiment of a magnetoresistive sensing element according to the present invention, and FIG.
The figure is a sectional view of a main part showing another embodiment of the magnetoresistive sensing element according to the present invention. 2...Magnetic resistance detection piece, 9...Adhesive, 10...
...Substrate, 11...Conductor part, 12...Lead, 13
... Lead support, 14 ... Bonding wire, 15 ... Package, 16 ... Conductive adhesive.
Claims (1)
被着形成された磁気抵抗効果を有する磁気抵抗検
出片と、前記基板の前記磁気抵抗検出片形成面に
対向して配置された非磁性材からなるパツケージ
とを少なくとも備え、前記磁気抵抗検出片が前記
基板を介して磁場を検出することを特徴とした磁
気抵抗検出素子。 ２ 前記基板を薄肉基板としたことを特徴とする
特許請求の範囲第１項記載の磁気抵抗検出素子。[Scope of Claims] 1. A substrate made of a non-magnetic material, a magnetoresistive detection piece having a magnetoresistive effect adhered and formed on one side of the substrate, and a magnetoresistive detection piece facing the surface of the substrate on which the magnetoresistive detection piece is formed. 1. A magnetoresistive sensing element comprising at least a package made of a non-magnetic material arranged thereon, wherein the magnetoresistive sensing piece detects a magnetic field via the substrate. 2. The magnetoresistive sensing element according to claim 1, wherein the substrate is a thin substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56049311A JPS57164587A (en) | 1981-04-03 | 1981-04-03 | Magnetic reluctance detecting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56049311A JPS57164587A (en) | 1981-04-03 | 1981-04-03 | Magnetic reluctance detecting element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57164587A JPS57164587A (en) | 1982-10-09 |
| JPH0158675B2 true JPH0158675B2 (en) | 1989-12-13 |
Family
ID=12827403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56049311A Granted JPS57164587A (en) | 1981-04-03 | 1981-04-03 | Magnetic reluctance detecting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57164587A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074588A (en) * | 1983-09-30 | 1985-04-26 | Hitachi Ltd | Packaging method of magnetoresistance element |
-
1981
- 1981-04-03 JP JP56049311A patent/JPS57164587A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57164587A (en) | 1982-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4021767A (en) | Hall element and method of manufacturing same | |
| JPS63238441A (en) | Semiconductor pressure sensor and manufacture thereof | |
| JP2007232616A (en) | Magnetic sensor | |
| JPH0158675B2 (en) | ||
| JPS6180074A (en) | Magnetic sensor with terminal for detecting current | |
| JP4273847B2 (en) | Manufacturing method of magnetic sensor | |
| JP2010147227A (en) | Electronic device package | |
| JPH0613496Y2 (en) | Clamp sensor | |
| JP2006060015A (en) | Sensor having electrode protection structure and its manufacturing method | |
| JPS6046038A (en) | Integrated circuit device | |
| JPH03251704A (en) | Manufacture of strain gauge | |
| CN209910844U (en) | Multifunctional sensor | |
| JPH0473318B2 (en) | ||
| JPH0511267B2 (en) | ||
| JP2005121471A (en) | Current sensor | |
| JPS61222358A (en) | Semiconductor device | |
| JPS6175535A (en) | Semiconductor device | |
| JPH0320786Y2 (en) | ||
| JPS6190009A (en) | Rotary encoder | |
| JPH0478035B2 (en) | ||
| JPH118423A (en) | Semiconductor thin-film magnetoresistance sensor | |
| JPH09243667A (en) | Current detector | |
| JPH0512656B2 (en) | ||
| JPS59127217A (en) | Detecting element of magnetism and its manufacture | |
| JPH1137873A (en) | Semiconductor pressure sensor |