JPH0158636B2 - - Google Patents

Info

Publication number
JPH0158636B2
JPH0158636B2 JP17916087A JP17916087A JPH0158636B2 JP H0158636 B2 JPH0158636 B2 JP H0158636B2 JP 17916087 A JP17916087 A JP 17916087A JP 17916087 A JP17916087 A JP 17916087A JP H0158636 B2 JPH0158636 B2 JP H0158636B2
Authority
JP
Japan
Prior art keywords
package
socket
lock cover
spring
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17916087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6424377A (en
Inventor
Keiichiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP17916087A priority Critical patent/JPS6424377A/ja
Publication of JPS6424377A publication Critical patent/JPS6424377A/ja
Publication of JPH0158636B2 publication Critical patent/JPH0158636B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)
JP17916087A 1987-07-20 1987-07-20 Lock cover for ic socket Granted JPS6424377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17916087A JPS6424377A (en) 1987-07-20 1987-07-20 Lock cover for ic socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17916087A JPS6424377A (en) 1987-07-20 1987-07-20 Lock cover for ic socket

Publications (2)

Publication Number Publication Date
JPS6424377A JPS6424377A (en) 1989-01-26
JPH0158636B2 true JPH0158636B2 (US06826419-20041130-M00005.png) 1989-12-12

Family

ID=16060991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17916087A Granted JPS6424377A (en) 1987-07-20 1987-07-20 Lock cover for ic socket

Country Status (1)

Country Link
JP (1) JPS6424377A (US06826419-20041130-M00005.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0464541U (US06826419-20041130-M00005.png) * 1990-10-09 1992-06-03

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0464541U (US06826419-20041130-M00005.png) * 1990-10-09 1992-06-03

Also Published As

Publication number Publication date
JPS6424377A (en) 1989-01-26

Similar Documents

Publication Publication Date Title
JP5160434B2 (ja) 多接合部ばねフィンガを有する接地ばねを用いて電子コンポーネントに熱的に接触したヒート・シンクを接地するための方法および装置
JPH0713191Y2 (ja) コネクタ
US7286371B2 (en) Attaching heat sinks to printed circuit boards using preloaded spring assemblies
US4941832A (en) Low profile chip carrier socket
US7708583B2 (en) Electrical connector assembly with heat dissipating device
US6923656B2 (en) Land grid array socket with diverse contacts
US6826052B2 (en) Retaining assembly for heat sink
US7422442B2 (en) Land grid array socket
US5226824A (en) IC socket and contact therein
US7134898B2 (en) Land grid array connector assembly
JPH0158636B2 (US06826419-20041130-M00005.png)
US7029309B2 (en) Land grid array electrical connector
JP4287559B2 (ja) 電子部品用ソケット
US6764317B2 (en) Electric connector having elastic pins
US20060002089A1 (en) Attaching heat sinks to printed circuit boards using preloaded spring assemblies
US6414846B1 (en) Heat sink assembly
EP1309039A2 (en) Ball grid array socket
JP4281864B2 (ja) Icソケット組立体
JP3378174B2 (ja) 高発熱素子の放熱構造
JP3060218U (ja) チップモジュールの放熱装置
JP2004523864A (ja) 信号コンタクト及び高電力コンタクトを有する半導体デバイス
JP4142222B2 (ja) 半導体装置用保持体
US20050059288A1 (en) Electrical connector with loading plate
JPS5827518Y2 (ja) 圧接形コネクタ
JP3318511B2 (ja) カード型半導体装置の実装構造