JPH0157503B2 - - Google Patents
Info
- Publication number
- JPH0157503B2 JPH0157503B2 JP14312480A JP14312480A JPH0157503B2 JP H0157503 B2 JPH0157503 B2 JP H0157503B2 JP 14312480 A JP14312480 A JP 14312480A JP 14312480 A JP14312480 A JP 14312480A JP H0157503 B2 JPH0157503 B2 JP H0157503B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- fins
- module
- refrigerant
- circular tubular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 5
- 239000000110 cooling liquid Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 description 17
- 239000007788 liquid Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000007664 blowing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Description
【発明の詳細な説明】
本発明は半導体素子等の発熱体を冷媒に直接浸
し沸騰冷却するモジユールに於いて、特に沸騰冷
却型モジユールの小型軽量化と冷却効果の改善に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a module in which a heating element such as a semiconductor element is directly immersed in a refrigerant to be evaporatively cooled, and particularly relates to a reduction in size and weight of an evaporative cooling module and an improvement in the cooling effect.
沸騰冷却による半導体素子の冷却は通常第１図
示すように、外壁及び内壁に夫々冷却フイン１，
２を備えた密閉容器３内に不活性液体の冷媒４を
充填し、冷媒４中に浸漬された回路基板５に実装
された半導体素子６等の発熱体を冷媒４の沸騰に
より冷却が行われている。なお、７は端子を示
す。 Cooling of semiconductor devices by boiling cooling is usually performed by using cooling fins 1 and 1 on the outer and inner walls, respectively, as shown in Figure 1.
An inert liquid refrigerant 4 is filled in an airtight container 3 equipped with a refrigerant 2, and a heating element such as a semiconductor element 6 mounted on a circuit board 5 immersed in the refrigerant 4 is cooled by boiling of the refrigerant 4. ing. Note that 7 indicates a terminal.
上記の冷却フイン１，２の放熱効果を高めるた
めに、フイン表面に溝、あるいは多数の孔を作る
ことが考えられてきた。しかし、かゝる形状にし
たフインは複雑な形となるため、製作する場合作
業性が悪く、多大の加工工数を必要とする。又冷
却フイン１，２を複雑な形状に形成することは、
加工上冷却フイン材料を薄くすることは不可能で
あり、該冷却フインを持つ容器は体積、重量とも
大きくなるという欠点がある。 In order to enhance the heat dissipation effect of the cooling fins 1 and 2, it has been considered to form grooves or a large number of holes on the surface of the fins. However, since such a fin has a complicated shape, it is difficult to manufacture and requires a large number of man-hours. Also, forming the cooling fins 1 and 2 into a complicated shape
It is impossible to make the cooling fin material thinner due to processing, and a container having the cooling fins has the disadvantage that both volume and weight are large.
本発明の目的は小型軽量で、冷却効果の大きい
沸騰冷却型モジユールを提供するにある。 An object of the present invention is to provide a boiling-cooled module that is small and lightweight and has a large cooling effect.
本発明の特徴は冷却モジユールの内部フイン及
び外部フインに相当する部分を多数の円管状突起
を持つ薄い容器として上記目的を達している。 A feature of the present invention is that the portions corresponding to the internal and external fins of the cooling module are formed into thin containers having a large number of circular tubular protrusions to achieve the above object.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
第２図は本発明による沸騰冷却型モジユールの
１実施例を示す断面斜視図である。 FIG. 2 is a cross-sectional perspective view showing one embodiment of the evaporative cooling module according to the present invention.
図において、半導体素子６の実装されたセラミ
ツク回路基板５に薄いAl材料等を打ち抜いて作
つた多数の外部フインを構成する円管状突起ａを
持つ容器８をパツキング９を介させて封止し、冷
却モジユール１０が構成されている。冷却モジユ
ール１０内部にはフルオロカーボン等の冷媒液体
１１が封入されており、又冷謀液体１１が入つて
いない空間１２は冷媒の気体のみで満たされる。
なお、冷媒液体１１は冷却モジユール１０内部で
円管状突起ａにより形成された内部フインｂと接
触し分割されている。これは冷媒の気化により発
生した気泡により冷媒が撹拌され、内部フインに
当ることにより冷媒液自体が冷却され、冷却効果
を高めるためである。 In the figure, a container 8 having cylindrical protrusions a constituting a large number of external fins made by punching a thin Al material or the like from a ceramic circuit board 5 on which a semiconductor element 6 is mounted is sealed with a packing 9 interposed therebetween. A cooling module 10 is configured. A refrigerant liquid 11 such as fluorocarbon is sealed inside the cooling module 10, and a space 12 not containing the refrigerant liquid 11 is filled only with refrigerant gas.
Note that the refrigerant liquid 11 comes into contact with internal fins b formed by circular tubular protrusions a inside the cooling module 10 and is divided. This is because the refrigerant is stirred by bubbles generated by the vaporization of the refrigerant, and the refrigerant liquid itself is cooled by hitting the internal fins, thereby increasing the cooling effect.
半導体素子６の発生する熱は冷媒液体１１が該
素子６の表面にて沸騰することにより奪われて該
素子６の温度上昇が防がれる。冷媒液体１１は多
数の円管状突起を持つ容器８へ凝縮等の形で熱を
伝え、最終的に容器８を強制空冷等により熱を逃
がしている。該容器８の円管状突起が強制空冷に
より第３図に示す矢印方向の風を受けると、円管
状突起ａ背後にカルマン渦１３ができ、乱流を生
ずることで熱伝達が非常に向上する。この乱流は
送風方向に規定されずに発生可能であり、送風冷
却において、回路基板の実装位置を考慮する必要
がない利点がある。 The heat generated by the semiconductor element 6 is removed by the refrigerant liquid 11 boiling on the surface of the element 6, thereby preventing the temperature of the element 6 from rising. The refrigerant liquid 11 transfers heat in the form of condensation or the like to the container 8 having a large number of cylindrical protrusions, and finally releases the heat from the container 8 by forced air cooling or the like. When the circular tubular projection of the container 8 receives wind in the direction of the arrow shown in FIG. 3 due to forced air cooling, a Karman vortex 13 is formed behind the circular tubular projection a, producing turbulent flow and greatly improving heat transfer. This turbulent flow can be generated regardless of the blowing direction, and there is an advantage in blowing cooling that there is no need to consider the mounting position of the circuit board.
本発明のように、多数の円管状突起ａを持つ容
器８内部に冷媒液体１１を充填することにより、
冷媒蒸気の凝縮面積が広がり、円管状突起ａへの
熱伝達量が増大する。さらに、円管状突起ａ内部
が流体で満たされるため、円管状突起ａは半導体
素子６の温度に近い均一な温度となり、冷却能力
は従来の冷却モジユールに比べ、大きく向上す
る。さらに、円管状突起ａはプレス加工で板厚薄
く形成されるので、従来の冷却フイン部分の体積
が省け、小型、軽量化できるため、冷却モジユー
ル自身の高密度実装ができる。また冷却モジユー
ルの製造においても、工数の少い打ち抜き等の簡
単な方法を用いることにより安価にできる利点が
ある。 As in the present invention, by filling the refrigerant liquid 11 inside the container 8 having a large number of circular tubular projections a,
The condensation area of the refrigerant vapor is expanded, and the amount of heat transferred to the circular tubular protrusion a is increased. Further, since the inside of the circular tubular projection a is filled with fluid, the temperature of the circular tubular projection a becomes uniform close to that of the semiconductor element 6, and the cooling capacity is greatly improved compared to the conventional cooling module. Further, since the circular tubular protrusion a is formed with a thin plate by press working, the volume of the conventional cooling fin portion can be omitted, making it possible to reduce the size and weight, thereby allowing the cooling module itself to be mounted in high density. Furthermore, in manufacturing the cooling module, there is an advantage that the cost can be reduced by using a simple method such as punching that requires few man-hours.
以上実施例を用いて、本発明を説明したが、本
発明によれば冷却モジユールの内部フイン及び外
部フインに相当する部分を多数の円管状突起を持
つ薄い容器とした沸騰冷却型モジユールを提供す
ることにより安価で冷却効率のよい小型軽量なも
のが得られる効果は大きい。 The present invention has been described using the embodiments above.According to the present invention, there is provided a boiling cooling module in which the portions corresponding to the internal fins and external fins of the cooling module are thin containers having a large number of circular tubular protrusions. This has a great effect in that a small and lightweight device with low cost and good cooling efficiency can be obtained.
第１図は従来の沸騰冷却型モジユールを説明す
るための断面図、第２，３図は本発明による沸騰
冷却型モジユールの１実施例を説明するための第
２図は断面図、第３図イは正面図、第３図ロは平
面図である。
図において、５はセラミツク回路基板、６は半
導体素子、７は端子、８は円管状突起を持つ容
器、９はパツキング、１０は冷却モジユール、１
１は冷媒液体、１２は空間、１３はカルマン渦を
示す。
FIG. 1 is a cross-sectional view for explaining a conventional boiling-cooled module, FIGS. 2 and 3 are cross-sectional views for explaining an embodiment of the boiling-cooling module according to the present invention, and FIG. A is a front view, and FIG. 3B is a plan view. In the figure, 5 is a ceramic circuit board, 6 is a semiconductor element, 7 is a terminal, 8 is a container having a circular tubular projection, 9 is a packing, 10 is a cooling module, 1
1 is a refrigerant liquid, 12 is a space, and 13 is a Karman vortex.
Claims (1)
フインと空冷のための外部フインを持つ金属容器
と該金属容器内の冷却液に半導体を浸漬するよう
に実装された回路基板とからなる冷却モジユール
であつて、前記内部フイン及び外部フイン部分を
薄い容器とし、かつ外部フイン部分を多数の円管
状突起で構成し、内部フインを冷却液で漬し、該
金属容器外面を強制空冷することを特徴とする沸
騰冷却型モジユール。1. A cooling system consisting of a metal container with internal fins for sealing and dividing the cooling liquid and external fins for air cooling, and a circuit board mounted so that a semiconductor is immersed in the cooling liquid in the metal container. The module is characterized in that the inner fins and outer fins are made into thin containers, the outer fins are made up of a large number of cylindrical projections, the inner fins are immersed in a cooling liquid, and the outer surface of the metal container is forcedly cooled with air. Features a boiling cooling module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14312480A JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14312480A JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5766654A JPS5766654A (en) | 1982-04-22 |
| JPH0157503B2 true JPH0157503B2 (en) | 1989-12-06 |
Family
ID=15331468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14312480A Granted JPS5766654A (en) | 1980-10-14 | 1980-10-14 | Ebullition type cooling module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5766654A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020235217A1 (en) * | 2019-05-21 | 2020-11-26 | 株式会社ロータス・サーマル・ソリューション | Heat exchange structure extracting heat of coolant in cooling device, and cooling device provided with said heat exchange structure |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6801431B2 (en) | 1999-07-15 | 2004-10-05 | Incep Technologies, Inc. | Integrated power delivery and cooling system for high power microprocessors |
| US6490160B2 (en) | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
| AU7816501A (en) * | 2000-08-02 | 2002-02-13 | Incep Technologies Inc | Vapor chamber with integrated pin array |
| US20020118511A1 (en) * | 2001-02-28 | 2002-08-29 | Dujari Prateek J. | Heat dissipation device |
| TWI542277B (en) * | 2014-09-30 | 2016-07-11 | 旭德科技股份有限公司 | Heat dissipation module |
-
1980
- 1980-10-14 JP JP14312480A patent/JPS5766654A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020235217A1 (en) * | 2019-05-21 | 2020-11-26 | 株式会社ロータス・サーマル・ソリューション | Heat exchange structure extracting heat of coolant in cooling device, and cooling device provided with said heat exchange structure |
| JP2022107071A (en) * | 2019-05-21 | 2022-07-21 | 株式会社ロータス・サーマル・ソリューション | Heat exchange structure taking out heat of cooling liquid in cooler, and cooler comprising the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5766654A (en) | 1982-04-22 |
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