JPH0155761B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a microwave module, and particularly to the configuration of a power supply terminal portion led out from a housing of the module.

(b) Background of technology Due to the progress of semiconductor devices in their ability to handle high frequencies,
It has also come to be used in devices such as wireless relays and radars for communication lines that use microwaves as a medium.

However, in the microwave region, the gain of a single semiconductor device is generally smaller than that of an electron tube, so in the case of an amplifier, for example, multiple semiconductor devices are connected in series to form a circuit that obtains the required gain, and the housing It is often configured as a module, such as storing it in an amplifier module.

(c) Prior art and problems Figure 1 shows a plan view a, a front view b, a side view c, and a second view of an embodiment of a conventional microwave amplifier module.
The figure shows the configuration of the power terminal section, where 1 is a semiconductor device, 2 is a housing body, 3 is a lid, 4 is an input terminal, 5 is an output terminal, 6 is a power terminal, 61 is a conductor,
62 is an insulator, 63 is a sheath, and 7 is a printed wiring board.

In the amplifier module shown in FIG. 1, a plurality of semiconductor devices 1 connected in series are fixed in a line in a box-shaped housing body 2 made of stainless steel, for example, and input terminals are provided on both sides of the housing body 2. 4
and an output terminal 5, and a plurality of power supply terminals 6 for supplying power to the semiconductor device 1 are airtightly installed on the front and rear sides, and the required wiring is provided, nitrogen is filled, and the battery is made of, for example, a stainless steel plate. A lid 3 is placed on the lid 3 and the surrounding area is sealed by welding, and a power terminal 6 is connected by a printed wiring board 7 on the outside of the housing body 2.
are connected in parallel.

Semiconductor device 1 used in this amplifier module
For example, this is an amplifier unit that incorporates a balanced potassium arsenide field effect transistor (GaAs-FET), and the power supply to it requires two each for the gate and drain.
The power terminals 6 attached to the main body 2 of the casing are located on the front, and one for the gate and drain is paired, and this pair is also paired with the one on the back, and these four terminals are allocated to one semiconductor device 1. It's starting to become easier.

By the way, as shown in FIG. 2, the power terminal 6 used here is made of metal and has a conductor wire 61 that penetrates the side wall of the housing body 2 to introduce the power, and is made of glass, for example, and is insulated and airtight. The insulator 62 is made of metal and is interposed to fix the insulator 62 to the housing body 2 in an airtight manner. is attached to the housing body 2 in an airtight manner.

Therefore, in this amplifier module, although the entire microwave circuit is sealed between the conductive housing body 2 and the lid 3 to shield internal and external microwaves, the conductor 61 of the power terminal 6 is The microwaves leak through the circuit, and the microwaves on the inside near the output side pass through the outside and return to the circuit near the input side, causing oscillation, or the boundary conditions of electromagnetic waves due to the outer casing that houses the amplifier module. It has the disadvantage that the circuit characteristics may be disturbed due to the influence of changes in the current.

(d) Object of the Invention In view of the above-mentioned drawbacks of the conventional art, the object of the present invention is to provide a metal casing housing a microwave circuit, which has a power supply terminal provided through the wall of the casing, and
It is an object of the present invention to provide a configuration of a microwave module that reduces microwaves leaking between the inside and outside of the housing at the terminal portion.

(e) Structure of the Invention The above object is to provide a power supply provided in a metal casing that penetrates the wall of the casing, which houses an amplifier with a multi-stage configuration that obtains a desired gain by connecting a plurality of semiconductor devices in series. A radio wave absorber covering a part of the periphery of the conductor wire is placed adjacent to the wall to reduce microwaves leaking between the inside and outside of the casing at the terminal portion. This is achieved by a microwave module characterized by the following.

By covering the conductive wire with the radio wave absorber, microwaves passing through the conductive wire are attenuated, so that leakage of microwaves at the terminal portion can be reduced.

(f) Embodiments of the invention Examples of the invention will be described below with reference to the drawings. The same reference numerals indicate the same objects throughout the figures.

3 is a plan view a, a front view b, and a side view c of an embodiment of the microwave amplifier module according to the present invention, and FIG. 4 is a diagram showing the configuration of the power terminal section thereof.
6a is a power terminal, 61a is a conductor, 8 is a radio wave absorber, and 9 is a support.

In the amplifier module shown in FIG. 3, the power terminal 6 of the amplifier module shown in FIG. It is something that Therefore, the position of the printed wiring board 7 is
It is slightly outside the case shown in the figure, and the housing body 2
A metal support 9 is attached between the two.

FIG. 4 corresponds to FIG. 2 and shows the configuration of the power supply terminal 6a section. In the power supply terminal 6a, the conductor wire 61a corresponding to the conductor wire 61 is longer than the conductor wire 61, and the radio wave absorber 8 formed in a cylindrical shape with an insulating radio wave absorbing material is attached to the insulator 62 (i.e., the case main body 2
It is placed over the outer side of the conductor 61a adjacent to the wall of the conductor 61a and fixed by a support 9.

By doing this, the microwaves passing through the conductor 61a are attenuated, so the microwaves leaking between the inside and outside of the housing at the power terminal 6a are reduced, and the oscillation that was a problem in the case shown in FIG. 1 is reduced. It becomes possible to prevent disturbances in circuit characteristics.

The inventor of this application has a size of approximately 21 mm in height and approximately 130 mm in width.
The housing body is made of stainless steel and has a height of approximately 10 mm.
When accommodating 11 semiconductor devices to form an amplifier module with a frequency of 13 GHz and a gain of about 40 dB, a conductor wire with a diameter of about 1 mmφ and a glass wire with an outer diameter of about 2 mmφ and a length of about 1.7 mm was used. A power supply terminal consisting of an insulator and a sheath with an outer diameter of approximately 3.5 mmφ was installed so that the insulator was located approximately in the center of the approximately 2.5 mm thick side wall of the housing body. oscillation and disturbance of circuit characteristics occurred, but
According to the structure of the present invention, EPO iron (manufactured by TDK Corporation), which is an insulating radio wave absorbing material, is used with an inner diameter of about 1 mm,
A radio wave absorber formed in a cylindrical shape with an outer diameter of about 3 mm and a length of about 5 mm is attached to the conductor wires of all power terminals as shown in Fig. 4, and fixed with a support made of an aluminum plate to eliminate the oscillation. And the disturbance in the circuit characteristics could be completely removed. Incidentally, when the amount of microwave attenuation by the radio wave absorber was measured, it was approximately 10 dB.

It should be noted that it is clear in principle that the structure of the present invention is not limited to the structure of the embodiments described above, and is applicable to all conductive wires that introduce power into the housing of the microwave module.

(g) Effects of the Invention As explained above, according to the configuration of the present invention, the casing made of metal and housing the microwave circuit has a power supply terminal provided through the wall of the casing, However, it is possible to provide a configuration of a microwave module that reduces microwaves leaking between the inside and outside of the casing at the terminal portion, and prevents, for example, oscillation of the circuit that occurs due to the leakage. This has the effect of making it possible to eliminate characteristic disturbances caused by the influence of external electromagnetic waves.

[Brief explanation of drawings]

Figure 1 shows a plan view a, a front view b, a side view c, and a second view of an embodiment of a conventional microwave amplifier module.
3 is a plan view a, a front view b and a side view c of an embodiment of the microwave amplifier module according to the present invention, and FIG. 4 is a diagram showing the configuration of the power terminal portion thereof. FIG. In the drawings, 1 is a semiconductor device, 2 is a housing body, 3 is a lid, 4 is an input terminal, 5 is an output terminal, 6,
6a is a power terminal, 61 and 61a are conducting wires, 62 is an insulator, 63 is a sheath, 7 is a printed wiring board, 8 is a radio wave absorber, and 9 is a support body.

Claims (1)

[Claims] 1 It houses a multi-stage amplifier that obtains a desired gain by connecting a plurality of semiconductor devices in series, and has a power supply terminal provided through the wall of a metal case, and the conductor of the terminal is connected to the power supply terminal. A microwave module characterized in that a radio wave absorber covering a part of the periphery of the conductive wire is placed adjacent to the wall to reduce microwaves leaking between the inside and outside of the casing at the terminal portion. .