JPH0155598B2 - - Google Patents
Info
- Publication number
- JPH0155598B2 JPH0155598B2 JP58021613A JP2161383A JPH0155598B2 JP H0155598 B2 JPH0155598 B2 JP H0155598B2 JP 58021613 A JP58021613 A JP 58021613A JP 2161383 A JP2161383 A JP 2161383A JP H0155598 B2 JPH0155598 B2 JP H0155598B2
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- chip
- hopper
- chip component
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58021613A JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
KR1019830003215A KR880000937B1 (ko) | 1983-02-14 | 1983-07-14 | 칩부품의 취부 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58021613A JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59148400A JPS59148400A (ja) | 1984-08-25 |
JPH0155598B2 true JPH0155598B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=12059889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58021613A Granted JPS59148400A (ja) | 1983-02-14 | 1983-02-14 | チツプ部品の取付装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS59148400A (enrdf_load_stackoverflow) |
KR (1) | KR880000937B1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10178297A (ja) * | 1996-12-17 | 1998-06-30 | Taiyo Yuden Co Ltd | 部品供給装置の部品取込機構 |
CN117092492B (zh) * | 2023-10-18 | 2024-01-09 | 深圳市芯盛智能信息有限公司 | 用于北斗导航芯片的元件插接组件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100798A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
JPS57100799A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
JPS57100800A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
JPS57100797A (en) * | 1980-12-15 | 1982-06-23 | Alps Electric Co Ltd | Device for mounting chip part |
JPS6242560Y2 (enrdf_load_stackoverflow) * | 1981-01-29 | 1987-10-31 |
-
1983
- 1983-02-14 JP JP58021613A patent/JPS59148400A/ja active Granted
- 1983-07-14 KR KR1019830003215A patent/KR880000937B1/ko not_active Expired
Also Published As
Publication number | Publication date |
---|---|
KR880000937B1 (ko) | 1988-05-31 |
JPS59148400A (ja) | 1984-08-25 |
KR840009195A (ko) | 1984-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100308517B1 (ko) | 아이피씨(칩) 종단 기계장치 | |
JPH0155598B2 (enrdf_load_stackoverflow) | ||
JPH11292252A (ja) | 被処理物取扱方法及び被処理物取扱装置 | |
KR850001169B1 (ko) | 칩부품의 취부장치 | |
JPS6242560Y2 (enrdf_load_stackoverflow) | ||
KR850001902Y1 (ko) | 칩 부품의 취부장치 | |
US8303237B2 (en) | Feed mechanism and method for feeding minute items | |
JPH0340520B2 (enrdf_load_stackoverflow) | ||
JPS63114B2 (enrdf_load_stackoverflow) | ||
US4376339A (en) | Method and apparatus for orienting integrated circuit clips and sockets and assembling them into connector contacts | |
JP2000294681A (ja) | Bga型電子部品製造装置における半田ボール整列供給機構 | |
US6153255A (en) | Manual electronic-part mounting method | |
JPS5856277B2 (ja) | 電子部品装着方法 | |
JP2002141642A (ja) | 電子部品実装方法 | |
JP2008240933A (ja) | グリスの塗布治具 | |
KR102484920B1 (ko) | 자동 칩 배치 장치 | |
US6014993A (en) | Method and apparatus for configuring component leads | |
JPH01103900A (ja) | ロータリーヘッド型チッププレーサ | |
JPH07206155A (ja) | 基板位置決め装置 | |
JPH11354392A (ja) | チップ型電子部品保持装置及び保持方法 | |
US20030025278A1 (en) | Liquid splash preventing mechanism and component mounting apparatus | |
JPS6213839B2 (enrdf_load_stackoverflow) | ||
JP2002016346A (ja) | 電子部品の電極形成装置、電子部品の電極形成方法、及び電子部品の製造方法 | |
JPH0751834Y2 (ja) | 電子部品の自動供給装置 | |
JP2002283266A (ja) | 電子部品の吸着ノズル |