JPH0155598B2 - - Google Patents

Info

Publication number
JPH0155598B2
JPH0155598B2 JP58021613A JP2161383A JPH0155598B2 JP H0155598 B2 JPH0155598 B2 JP H0155598B2 JP 58021613 A JP58021613 A JP 58021613A JP 2161383 A JP2161383 A JP 2161383A JP H0155598 B2 JPH0155598 B2 JP H0155598B2
Authority
JP
Japan
Prior art keywords
shutter
chip
hopper
chip component
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58021613A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59148400A (ja
Inventor
Takeshi Mori
Toshiaki Terabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP58021613A priority Critical patent/JPS59148400A/ja
Priority to KR1019830003215A priority patent/KR880000937B1/ko
Publication of JPS59148400A publication Critical patent/JPS59148400A/ja
Publication of JPH0155598B2 publication Critical patent/JPH0155598B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP58021613A 1983-02-14 1983-02-14 チツプ部品の取付装置 Granted JPS59148400A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58021613A JPS59148400A (ja) 1983-02-14 1983-02-14 チツプ部品の取付装置
KR1019830003215A KR880000937B1 (ko) 1983-02-14 1983-07-14 칩부품의 취부 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58021613A JPS59148400A (ja) 1983-02-14 1983-02-14 チツプ部品の取付装置

Publications (2)

Publication Number Publication Date
JPS59148400A JPS59148400A (ja) 1984-08-25
JPH0155598B2 true JPH0155598B2 (enrdf_load_html_response) 1989-11-27

Family

ID=12059889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58021613A Granted JPS59148400A (ja) 1983-02-14 1983-02-14 チツプ部品の取付装置

Country Status (2)

Country Link
JP (1) JPS59148400A (enrdf_load_html_response)
KR (1) KR880000937B1 (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10178297A (ja) * 1996-12-17 1998-06-30 Taiyo Yuden Co Ltd 部品供給装置の部品取込機構
CN117092492B (zh) * 2023-10-18 2024-01-09 深圳市芯盛智能信息有限公司 用于北斗导航芯片的元件插接组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100797A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100798A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100800A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS57100799A (en) * 1980-12-15 1982-06-23 Alps Electric Co Ltd Device for mounting chip part
JPS6242560Y2 (enrdf_load_html_response) * 1981-01-29 1987-10-31

Also Published As

Publication number Publication date
JPS59148400A (ja) 1984-08-25
KR880000937B1 (ko) 1988-05-31
KR840009195A (ko) 1984-12-21

Similar Documents

Publication Publication Date Title
KR100308517B1 (ko) 아이피씨(칩) 종단 기계장치
JP3114692B2 (ja) 被処理物取扱方法及び被処理物取扱装置
JPH0155598B2 (enrdf_load_html_response)
KR850001169B1 (ko) 칩부품의 취부장치
KR20010029806A (ko) 볼 장착장치용으로서 사용되는 피가공물과 헤드의위치결정장치 및 위치결정방법, 플럭스 저장장치,장착헤드, 전사헤드 및 플럭스 전사방법
JPS6242560Y2 (enrdf_load_html_response)
KR850001902Y1 (ko) 칩 부품의 취부장치
US8303237B2 (en) Feed mechanism and method for feeding minute items
JPH0340520B2 (enrdf_load_html_response)
CN1103644C (zh) 电子部件手工安装设备和方法
JPS63114B2 (enrdf_load_html_response)
US4376339A (en) Method and apparatus for orienting integrated circuit clips and sockets and assembling them into connector contacts
JP2000294681A (ja) Ｂｇａ型電子部品製造装置における半田ボール整列供給機構
JPH0846392A (ja) 電子部品自動装着装置
JP2008240933A (ja) グリスの塗布治具
KR102484920B1 (ko) 자동 칩 배치 장치
US6014993A (en) Method and apparatus for configuring component leads
JPH01103900A (ja) ロータリーヘッド型チッププレーサ
JPH07206155A (ja) 基板位置決め装置
JPH11354392A (ja) チップ型電子部品保持装置及び保持方法
JPS6213839B2 (enrdf_load_html_response)
JP2001157934A (ja) バルブ自動組付装置
JP2002016346A (ja) 電子部品の電極形成装置、電子部品の電極形成方法、及び電子部品の製造方法
JPH0751834Y2 (ja) 電子部品の自動供給装置
JP2002283266A (ja) 電子部品の吸着ノズル