JPH0154395B2 - - Google Patents
Info
- Publication number
- JPH0154395B2 JPH0154395B2 JP8705185A JP8705185A JPH0154395B2 JP H0154395 B2 JPH0154395 B2 JP H0154395B2 JP 8705185 A JP8705185 A JP 8705185A JP 8705185 A JP8705185 A JP 8705185A JP H0154395 B2 JPH0154395 B2 JP H0154395B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- release material
- petroleum distillate
- mold release
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 29
- 239000003209 petroleum derivative Substances 0.000 claims description 17
- 238000010992 reflux Methods 0.000 claims description 13
- 238000009835 boiling Methods 0.000 claims description 6
- 239000003208 petroleum Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8705185A JPS61243879A (ja) | 1985-04-23 | 1985-04-23 | シ−ト状離型材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8705185A JPS61243879A (ja) | 1985-04-23 | 1985-04-23 | シ−ト状離型材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61243879A JPS61243879A (ja) | 1986-10-30 |
| JPH0154395B2 true JPH0154395B2 (de) | 1989-11-17 |
Family
ID=13904141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8705185A Granted JPS61243879A (ja) | 1985-04-23 | 1985-04-23 | シ−ト状離型材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61243879A (de) |
-
1985
- 1985-04-23 JP JP8705185A patent/JPS61243879A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61243879A (ja) | 1986-10-30 |
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