JPH0153511B2 - - Google Patents

Info

Publication number
JPH0153511B2
JPH0153511B2 JP57076948A JP7694882A JPH0153511B2 JP H0153511 B2 JPH0153511 B2 JP H0153511B2 JP 57076948 A JP57076948 A JP 57076948A JP 7694882 A JP7694882 A JP 7694882A JP H0153511 B2 JPH0153511 B2 JP H0153511B2
Authority
JP
Japan
Prior art keywords
tank
tank member
brazing
ceramic
ceramic pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57076948A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194359A (ja
Inventor
Tomyoshi Kanai
Shoichi Furuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Altemira Co Ltd
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to JP57076948A priority Critical patent/JPS58194359A/ja
Publication of JPS58194359A publication Critical patent/JPS58194359A/ja
Publication of JPH0153511B2 publication Critical patent/JPH0153511B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57076948A 1982-05-07 1982-05-07 半導体素子冷却器の製造方法 Granted JPS58194359A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57076948A JPS58194359A (ja) 1982-05-07 1982-05-07 半導体素子冷却器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57076948A JPS58194359A (ja) 1982-05-07 1982-05-07 半導体素子冷却器の製造方法

Publications (2)

Publication Number Publication Date
JPS58194359A JPS58194359A (ja) 1983-11-12
JPH0153511B2 true JPH0153511B2 (enExample) 1989-11-14

Family

ID=13619980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57076948A Granted JPS58194359A (ja) 1982-05-07 1982-05-07 半導体素子冷却器の製造方法

Country Status (1)

Country Link
JP (1) JPS58194359A (enExample)

Also Published As

Publication number Publication date
JPS58194359A (ja) 1983-11-12

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