JPH0150109B2 - - Google Patents

Info

Publication number
JPH0150109B2
JPH0150109B2 JP58025070A JP2507083A JPH0150109B2 JP H0150109 B2 JPH0150109 B2 JP H0150109B2 JP 58025070 A JP58025070 A JP 58025070A JP 2507083 A JP2507083 A JP 2507083A JP H0150109 B2 JPH0150109 B2 JP H0150109B2
Authority
JP
Japan
Prior art keywords
semiconductor device
module
external terminals
circuit board
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58025070A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59151445A (ja
Inventor
Masahiko Tsumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58025070A priority Critical patent/JPS59151445A/ja
Publication of JPS59151445A publication Critical patent/JPS59151445A/ja
Publication of JPH0150109B2 publication Critical patent/JPH0150109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58025070A 1983-02-17 1983-02-17 半導体装置 Granted JPS59151445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58025070A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58025070A JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1005333A Division JPH0271551A (ja) 1989-01-12 1989-01-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS59151445A JPS59151445A (ja) 1984-08-29
JPH0150109B2 true JPH0150109B2 (mo) 1989-10-27

Family

ID=12155659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58025070A Granted JPS59151445A (ja) 1983-02-17 1983-02-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS59151445A (mo)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117147A (ja) * 1982-12-23 1984-07-06 Matsushita Electric Ind Co Ltd 複合電子部品

Also Published As

Publication number Publication date
JPS59151445A (ja) 1984-08-29

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