JPH0147891B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a series of chip parts in which ceramic chip parts such as capacitors, resistors, thermistors, varistors, etc. are arranged in a continuous band shape.

Chip components can be directly bonded to a flat conductive pattern, meeting the demands for high-density packaging, and have a uniform external shape, allowing for automatic mounting and assembly when mounted on a printed circuit board, etc.
It has excellent features such as being small and highly reliable, and is used as an important component for thick-film IC circuits and modularization in electronic computers, communication equipment, television receivers, radio receivers, It is becoming widely used in various electronic devices such as electronic watches and calculators.
These chip parts are automatically inserted using an automatic insertion machine.
To facilitate assembly, they typically take the form of a series of chip parts arranged in a continuous band. 1 to 3 are perspective views showing a conventional example of a series of chip parts.

First, the series of chip parts shown in FIG. 1 is made by applying a thermosetting adhesive A or the like on one side of a tape 1 made of synthetic resin or the like in advance, and applying adhesive A to one side of the tape 1. It has a structure in which chip parts 2 are successively connected and pasted. Each of the chip parts 2 is in the shape of a rectangular flat plate having end electrodes 3 and 4 at both ends, and the end electrodes 3 and 4 are sequentially connected with the direction of the end electrodes 3 and 4 aligned with the width direction of the tape 1.

However, in this conventional series of chip parts, the end electrodes 3-3 and 4-4 of adjacent chip parts 1-1 come into contact with each other, so it is difficult to measure the individual characteristics of the chip parts 1 in the form of a series of chip parts. , it is impossible to carry out characteristic measurement and selection work that selects only those that fall within the reference value. Therefore, in order to obtain the series of chip parts shown in FIG. However, the process of linking chip parts became extremely troublesome. In particular, this kind of chip parts
Its flat area is very small, for example, about 3 x 5 m/m, and its thickness is around 1 mm, which makes it difficult to handle.Furthermore, there is a trend toward further miniaturization due to the demand for high-density packaging. There are circumstances,
It is extremely difficult to perform characteristic measurement and selection work one by one.

The series of chip parts shown in Fig. 2 has a structure in which chip parts 2 are successively pasted at intervals of d ₁ .
Each of the chip parts 2 is in a mutually independent state. Therefore, in this series of chip parts, the chip part 2 is pasted on the tape 1, and the chip part 2 is pasted on the tape 1.
Characteristic measurement and selection work can be carried out. However, since the chip parts 2 must be attached at a distance d ₁ , the number of chip parts per unit length of the tape 1 decreases, an extra tape 1 is required, and the dimension of the distance d ₁ decreases. There are disadvantages such as fluctuations in the amount of paper and easy insertion errors.

The series of parts shown in Fig. 3 has a structure in which adhesive A is applied on the tape 1 in advance at fixed intervals _d2 , and chip parts 1 are successively pasted onto the adhesive A applied areas. There is. This series of chip parts has the advantage that the chip parts 2 can be pasted at a pre-regulated interval d ₂ , but since there is a gap d ₂ between the chip parts 2, it is similar to the series of chip parts shown in FIG. , it is inevitable that the tape 1 will be wasted.

It is an object of the present invention to eliminate the above-mentioned conventional drawbacks, and to provide a series of chip parts in which the characteristic measurement and selection work of chip parts is very easy, the density of chip parts mounted on the tape is high, and there is little wastage of tape. shall be.

In order to achieve the above object, the chip component series according to the present invention includes a chip component having end electrodes at both ends of a ceramic substrate and notches at the corners of the both ends, on a tape in the direction of the both ends. It is characterized in that the tapes are successively connected and pasted along the width direction of the tape.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 4 is a perspective view of a portion of a chip assembly according to the present invention. In this example, tape 1 is coated with adhesive A on one side in advance.
It has a structure in which chip parts 2 are sequentially connected and pasted on the adhesive A-coated side. As shown in FIG. 5, each of the chip parts 2 has end electrodes 3 and 4 adhered to both ends of a ceramic substrate 2a, and corner-shaped, arc-shaped, etc. notches 5 at the four corners of both ends. .
are successively connected and pasted on adhesive A.

With the above-described structure, even though the chip parts 2 are connected and attached to each other, the end electrodes 3 and 4 of the chip parts 2 are connected to the notches 5-7,
6-8, each chip part 2
become electrically independent from each other. Therefore, it is possible to continuously measure the characteristics of each chip component 2 as a series of chip components 2 pasted on the tape 1, and the task of measuring and sorting the characteristics of the chip components 2 is made very easy. Become.

Moreover, since each chip component 2 is attached to the tape 1 in a connected state, the arrangement pitch of the chip components 2 on the tape 1 is constant, the packaging density is high, and the automatic insertion machine is Insertion troubles and waste of the tape 1 when automatically inserting the tape 1 are eliminated.

Chip components 2 include a wide range of ceramics, including chip-shaped ceramic capacitors such as multilayer ceramic capacitors, internal electrode structure ceramic capacitors, and through-hole ceramic capacitors, as well as ceramic substrate-type resistors, thermistors, and varistors. Chip parts can be used.

Next, a method for manufacturing a series of chip parts according to the present invention will be explained. FIG. 6 is a diagram illustrating a method of manufacturing a series of chip parts according to the present invention. In the figure, reference numeral 9 denotes a chip component assembly type ceramic board having a large number of chip component elements. As shown in FIG. 7, this ceramic substrate 9 has a plurality of dividing grooves _S1 at regular intervals _d3 in the length direction, and each area divided by the grooves _S1 is , end electrodes 3, 4 and cutouts 5 to 8
It has chip component elements 2 ₁ , 2 ₂ . . . That is, this ceramic substrate 9 is shown in FIGS. 4 and 5.
A suitable number of chip parts 2 shown in the figure are arranged side by side and integrated to form a chip part assembly. Therefore, since this ceramic substrate 9 has a size many times larger than that of a single chip component, handling and work when assembling chip components becomes extremely easy.

Note that the groove _S1 can be provided as a concave groove or a partially penetrating through groove. Further, as a method for obtaining the above-mentioned ceramic substrate 9, as shown in _{FIG .} provided in the form of
Each region Q ₁ , Q ₂ , surrounded by these grooves S ₁ , S ₂ ,
Q _{3 ...} A chip component assembly having chip component elements having internal electrodes (not shown) etc. is manufactured in one step, and then this assembly is divided along the dividing groove S ₂ . By this, after taking out the aggregate as shown in FIG. 8b, as shown in FIG. 8c,
A suitable method is to form the end electrodes 3 and 4 at both ends in the width direction by coating and baking.

Referring again to FIG. 6, 10 is the roll 11,
An endless belt connected to 12, 13, etc. sequentially and running as shown by arrow A, 14 is a roll 15, 16, 1
It is an endless belt that runs in the direction of the arrow B while being guided by the belt. The belt 14 is stretched so that the portion between the rolls 15 and 16 is pressed against the outside of the roll 12 that guides the belt 10 with an appropriate pressing force.

18 is a tape winding body. Adhesive A is applied in advance to one side of this tape roll 18.
Roll 1 with the side coated with adhesive A facing up.
1-12 onto the belt 10.

The ceramic substrate 9 is stuck onto the tape 18 pulled out onto the belt 10 between the rolls 11 and 12 using the adhesive force of the adhesive A. The ceramic substrate 9 stuck on the tape 18 is conveyed along with the tape 18 by the belt 10 as shown by arrow A. When reaching the roll 12 of the belt 10, the curvature of the roll 12 and the pressing force applied from the belt 14 to the ceramic substrate 9 divide the ceramic substrate 9 continuously and accurately along the groove _S1 , forming the ceramic substrate 9. The chip component elements that correspond to each other are successively isolated one after another. The tape 18 that has been divided is wound with the chip parts attached thereto, thereby obtaining a wound body of a series of chip parts.

As a device for dividing the ceramic substrate 9, the ceramic substrate 9
A device has been proposed that divides the groove by hitting it with a cutter while feeding it at intervals of groove S ₁ , but with this device, it is difficult to accurately divide the groove S ₁ , and often the groove S ₁ There were cases where the parts were cut so that burrs and edges remained. As a result, burrs and edges become obstacles, making it impossible to smoothly insert the paper into the magazine of an automatic insertion machine. In addition, when a series of chip parts is obtained, a step is added to precisely attach each divided chip part to tape one by one, making the process complicated and troublesome.

On the other hand, in the above-mentioned dividing method, since the ceramic substrate 9 is divided by the curvature of the roll 12 and the pressing force of the belt 14, there is no room for applying excessive force to the ceramic substrate 9, and the ceramic substrate 9 is divided into grooves. It is possible to precisely divide along S ₁ and obtain chip parts without burrs or edges. In addition, since the ceramic substrate 9 having a large number of chip component elements can be successively divided while being attached to the tape 18, when assembling chip components, there is no need to attach the chip components one by one as in the conventional process. This greatly simplifies and shortens the process, resulting in significant cost reductions.

As described above, in the chip component series according to the present invention, a chip component having end electrodes at both ends of a ceramic substrate and notches at the corners of both ends is placed on a tape in the direction of the both ends. The tape is characterized in that it is attached sequentially in the width direction, so that each chip component on the tape is electrically independent from each other, and the task of measuring and sorting the characteristics of each chip component can be performed by connecting the chip components in series. It can be done continuously.
Furthermore, it is possible to provide a series of chip parts that has a high mounting density of chip parts on the tape, reduces waste of tape, has a constant arrangement pitch of chip parts, and is easy to automatically insert.

[Brief explanation of drawings]

1 to 3 are perspective views of a conventional chip component series, FIG. 4 is a perspective view of a chip component series according to the present invention, FIG. 5 is a plan view of the chip component, and FIG. 6 is a perspective view of a chip component series according to the present invention. A diagram explaining the manufacturing method of a series of chip parts,
Fig. 7 is a plan view of the ceramic substrate constituting the chip parts assembly, and Figs. 8 (a), (b), and (c) are diagrams explaining the method for obtaining the ceramic substrate constituting the chip parts assembly. . 1... Tape, 2... Chip parts, 3, 4...
End electrode, 5 to 8... cutout.

Claims (1)

[Claims] 1. On the tape, chip parts having end electrodes at both ends of a ceramic substrate and notches at the corners of the both ends are sequentially connected and pasted with the direction of the both ends aligned with the width direction of the tape. A series of chip parts that are characterized by the fact that they are worn.