JPS59113618A - Electronic part series - Google Patents

Electronic part series

Info

Publication number
JPS59113618A
JPS59113618A JP57224146A JP22414682A JPS59113618A JP S59113618 A JPS59113618 A JP S59113618A JP 57224146 A JP57224146 A JP 57224146A JP 22414682 A JP22414682 A JP 22414682A JP S59113618 A JPS59113618 A JP S59113618A
Authority
JP
Japan
Prior art keywords
shaped portion
band
electronic component
mount
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57224146A
Other languages
Japanese (ja)
Inventor
天野 俊紀
光一 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP57224146A priority Critical patent/JPS59113618A/en
Publication of JPS59113618A publication Critical patent/JPS59113618A/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は電子部品連に関し、更に詳しくは電子部品に
接続するリード端子のテープ化によって複数個の電子部
品を連結して取付けた電子部品連に係るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component chain, and more particularly to an electronic component chain in which a plurality of electronic components are connected and attached by tape-forming lead terminals connected to the electronic components.

例えばコンデンナや抵抗、混成集積回路等の電子部品に
使用されている従来の端子部材は、第1図に示すように
、導電性の金属板を用い、帯状部分1に一定のピッチで
送り孔2を穿設し、この帯状部分1の側縁に多数のリー
ド端子3を一定の間隔で並べて突設した構造であり、第
2図に示ずように、リード端子3を電子部品への電極に
半田付によって接合し、電子部品へに外装樹脂をコーテ
ィングすることにより電子部品連を形成するものである
For example, conventional terminal members used for electronic components such as capacitors, resistors, and hybrid integrated circuits use a conductive metal plate and have two perforations arranged at a constant pitch in a strip 1, as shown in Fig. 1. It has a structure in which a large number of lead terminals 3 are lined up at regular intervals and protrude from the side edge of the band-shaped part 1.As shown in Fig. 2, the lead terminals 3 are used as electrodes for electronic components. An electronic component series is formed by joining the electronic components by soldering and coating the electronic components with an exterior resin.

上記電子部品Aは最終工程において容量等の測定選別を
行なう必要があるが、上記のように従来の端子部材は、
各リード端子3が帯状部分1で接続されているため、そ
のままでは測定が行なえず、従って各リード端子3を切
断して電子部品Aを個々に分離しなければならない。
The above-mentioned electronic component A needs to be subjected to measurement and selection of capacitance etc. in the final process, but as mentioned above, the conventional terminal member
Since each lead terminal 3 is connected by the band-shaped portion 1, measurement cannot be performed as it is, and therefore each lead terminal 3 must be cut to separate the electronic component A individually.

ところで、近年電子部品のプリント基板等への装着は能
率向上と省力化をはかるためにその自動化が望まれてい
るが、電子部品が分離していては自動装着の実現が回動
であり、出荷のための包装も面倒になるという問題があ
る。
Incidentally, in recent years, there has been a desire to automate the mounting of electronic components onto printed circuit boards, etc. in order to improve efficiency and save labor, but if the electronic components are separated, automatic mounting requires rotation, which slows down shipping. There is also the problem that packaging for the product is also troublesome.

この発明は上記のような問題を解消するためになされた
ものであり、電子部品のテーピング化によりプリント基
板等への自動装着を容易にし、出荷のための包装も容易
な電子部品連を提供することを目的とする。
This invention was made to solve the above-mentioned problems, and provides an electronic component series that can be easily attached to a printed circuit board etc. by taping the electronic components, and can be easily packaged for shipping. The purpose is to

この発明の構成は帯状部分に多数のリード端子を突設し
た端子部材の前記帯状部分に、この帯状部分よりも広幅
で電気絶縁性のテープ部材を固着し、前記帯状部分の各
リード端子間にテープ部材と共に打抜いた分離孔を設け
、各リード端子を独立後もテープ部材で保持するように
し、そのリード端子に電子部品を取付けるようにしたも
のである。
The structure of the present invention is such that an electrically insulating tape member having a width wider than the strip portion is fixed to the strip portion of a terminal member having a large number of lead terminals protruding from the strip portion, and between each lead terminal of the strip portion. Separation holes are punched together with the tape member so that each lead terminal is held by the tape member even after being separated, and electronic components are attached to the lead terminals.

以下、この発明の実施例を第3図ないし第11図にもと
づいて説明する。
Embodiments of the present invention will be described below with reference to FIGS. 3 to 11.

この発明の電子部品連は、洋白等の導電性の金属板を用
い、帯状部分11の長手方向に沿う側縁に多数のリード
端子12を一定の間隔で並べて突設した端子部材13と
、この端子部材13の帯状部分11よりも広幅の電気絶
縁性テープ部材14とで構成され、テープ部材14を帯
状部分11に固定化すると共に、帯状部分11に分離孔
15を各リード端子12間ごとにテープ部材14と共に
打抜゛き形成し、電気的に独立した各リード端子12を
テープ部材14で保持づるようにし、それぞれのリード
端子12に電子部品を取付【プるようにしたものである
The electronic component series of the present invention includes a terminal member 13 made of a conductive metal plate such as nickel silver, and having a large number of lead terminals 12 arranged at regular intervals and protruding from the side edge along the longitudinal direction of a band-shaped portion 11; The tape member 14 is fixed to the strip portion 11, and separation holes 15 are formed in the strip portion 11 between each lead terminal 12. It is formed by punching together with the tape member 14, so that each electrically independent lead terminal 12 is held by the tape member 14, and an electronic component is attached to each lead terminal 12. .

上記テープ部材14の構造と帯状部分11への固定は種
々の構造を採用することができ、第3図と第4図に示す
第1の例は、テープ部材14に厚紙製の台紙14aを用
い、帯状部分11への固定は台紙14aの表面に塗布し
た接着剤層14bによる貼着によって行ない、帯状部分
11に台紙14aを貼合わせた後、帯状部分11の各リ
ード端子12間に両側に台紙14aを残して分離孔15
を、また台紙14aに送り孔16を自動プレス機で同時
に打抜き、リード端子12を分離孔15によって独立さ
せると共に、台紙14aによって保持するようにしたも
のである。なお、接着剤層14bは、図示では台紙14
a表面の全面に塗布しているが、少なくとも帯状部分1
1が貼合される部分に塗布しておけばよい。
Various structures can be adopted for the structure of the tape member 14 and for fixing it to the band-shaped portion 11. In the first example shown in FIGS. 3 and 4, the tape member 14 uses a cardboard mount 14a. The fixation to the strip-shaped portion 11 is performed by pasting with an adhesive layer 14b applied to the surface of the mount 14a. After the mount 14a is pasted to the strip-shaped portion 11, a mount is attached on both sides between each lead terminal 12 of the strip-shaped portion 11. Separation hole 15 leaving 14a
Further, feed holes 16 are punched out on the mount 14a at the same time using an automatic press machine, and the lead terminals 12 are made independent by the separation holes 15 and held by the mount 14a. Note that the adhesive layer 14b is the mount 14 in the illustration.
a It is applied to the entire surface, but at least the band-shaped part 1
1 may be applied to the area to be bonded.

第5図と第6図に示J第2の例は、テープ部材14を帯
状部分11よりも広幅の台紙14aと粘着テープ14c
で形成した場合であり、台紙14a上に端子部材13の
帯状部分11を重ね、この帯状部分11上に重ねた粘着
テープ14cの両側を台紙14aに貼合せることよって
帯状部分11を挾み込み、この後帯状部分の各リード端
子12間の位置に分離孔15を台紙14aおよび粘着テ
ープ14cと共に打抜き形成するようにしたものであり
、台紙14aには送り孔16を同時に穿設しておく。こ
の送り孔16は、台紙14aと粘着テープ14cの両方
を貫通するように穿設してもよい。
In the second example shown in FIGS. 5 and 6, the tape member 14 is connected to a mount 14a wider than the strip portion 11 and an adhesive tape 14c.
In this case, the strip-shaped portion 11 of the terminal member 13 is stacked on the mount 14a, and the strip-shaped portion 11 is sandwiched by laminating both sides of the adhesive tape 14c stacked on the strip-shaped portion 11 to the mount 14a. Separation holes 15 are formed by punching together with the mount 14a and the adhesive tape 14c at positions between the respective lead terminals 12 of the rear band-shaped portion, and feed holes 16 are simultaneously bored in the mount 14a. This feed hole 16 may be formed so as to penetrate both the mount 14a and the adhesive tape 14c.

第7図と第8図に示す第3の例は、テープ部材14に帯
状部分11よりも広幅の台紙14aを用い、帯状部分1
1と台紙14aの固定を帯状部分11の両側縁において
、各リード端子12ごとに設けた突き刺し爪17を使用
するようにしたものであり、帯状部分11に重ねた台紙
14aに対して、下方に屈曲する尖鋭状の突き刺し爪1
7を貫通させ、突き刺し爪17の先端を台紙14aの裏
面で折曲げて両者を固定化した後、帯状部分11に分離
孔15と台紙14aに送り孔16を穿設する。
The third example shown in FIGS. 7 and 8 uses a mount 14a wider than the strip portion 11 for the tape member 14, and the strip portion 1
1 and the mount 14a are fixed using piercing claws 17 provided for each lead terminal 12 on both side edges of the strip-shaped portion 11, and the mount 14a stacked on the strip-shaped portion 11 is fixed downwardly. Bent sharp piercing claw 1
After fixing both by bending the tips of the piercing claws 17 on the back surface of the mount 14a, a separation hole 15 is formed in the band-shaped portion 11 and a feed hole 16 is formed in the mount 14a.

なお、台紙14aに予め喫き刺し爪17を挿入し得る切
削が形成されている場合には、突き刺し爪17は特に尖
鋭状にしておく必要はない。
Note that if the mount 14a has a cut in advance into which the stabbing claw 17 can be inserted, the stabbing claw 17 does not need to be particularly sharp.

第9図と第10図に示す第4の例は、テープ部材14を
塩化ビニールのような可撓性の合成樹脂で形成した場合
であり、帯状部分11を被覆するように金型を用いて一
体成形した後、分離孔15および送り孔16を穿設した
ものである。
A fourth example shown in FIGS. 9 and 10 is a case in which the tape member 14 is made of a flexible synthetic resin such as vinyl chloride, and a mold is used to cover the band-shaped portion 11. After integral molding, separation holes 15 and feed holes 16 are bored.

なお、何れの例においても、リード端子12には、それ
ぞれ所要の電子部品Δが取付けられるとともに外装材で
被覆されて電子部品連が構成されるのであるが、リード
端子12の形状とその1個の電子部品に対する使用本数
は電子部品Aの回路構成によって自由に選択できると共
に、自動装着のための送り孔16は分離孔15を利用す
ることによって省略することができる。
In both examples, the required electronic components Δ are attached to each lead terminal 12 and covered with an exterior material to form an electronic component chain. The number of electronic components used can be freely selected depending on the circuit configuration of the electronic component A, and the feed hole 16 for automatic mounting can be omitted by using the separation hole 15.

また、端子部材13は帯状部分11の一方にリード端子
12を設けたものに限定されるものではなく、第11図
に示すように、二本の帯状部分11.11にリード端子
12を対向して設け、対向する両側リード端子12に電
子部品Aを接続するものでもよく、この場合両側の帯状
部分11に前記第1ないし第4の例で示した何れかのテ
ープ部材を取付け、分離孔15のg設を行なえばよい。
Furthermore, the terminal member 13 is not limited to one in which the lead terminal 12 is provided on one side of the band-shaped portion 11, but as shown in FIG. The electronic component A may be connected to the opposing lead terminals 12 on both sides. In this case, one of the tape members shown in the first to fourth examples is attached to the strip portions 11 on both sides, and the separation holes 15 are provided. All you have to do is set up the following.

この発明の電子部品連は上記のような構成であり、端子
部材13のリード端子12を電子部品Aと半田付によっ
て接続したのちに、帯状部分11に広幅のテープ部材1
4を固定し、帯状部分11に分離孔15とテープ部材1
4に送り孔1Gを穿設して、各リード端子12を独立さ
せたり、あるいは帯状部分11に固定したテープ部材1
4に分離孔15を穿設して各カード端子12を独立させ
たのち、リード端子12に電子部品Aを半田付Cノする
。電子部品を被覆する外装材はディッピング、成型等の
適宜の手段で付与される。
The electronic component series of the present invention has the above-described configuration, and after the lead terminal 12 of the terminal member 13 is connected to the electronic component A by soldering, a wide tape member 1 is attached to the band-shaped portion 11.
4 is fixed, and a separation hole 15 and a tape member 1 are attached to the strip portion 11.
A feed hole 1G is formed in the tape member 1 to make each lead terminal 12 independent, or the tape member 1 is fixed to the strip portion 11.
4 to make each card terminal 12 independent, electronic component A is soldered to lead terminal 12. The exterior material covering the electronic component is applied by appropriate means such as dipping or molding.

この後、リード端子12を利用して各電子部品への特性
を測定すれば、テープ部材14で保持された電子部品連
が完成し、テープ部材14をロール状に巻回した状態で
包装して出荷すればよく、電子部品Aのプリント基板へ
の装着は、テープ状のままで自動装着機にセットし、送
り孔16で間歇的に送り出してリード端子12を所定位
置で切断することによりおこなわれる。
After that, by measuring the characteristics of each electronic component using the lead terminal 12, the series of electronic components held by the tape member 14 is completed, and the tape member 14 is wound into a roll and packaged. The electronic component A can be mounted on a printed circuit board by setting it in an automatic mounting machine in its tape form and feeding it intermittently through the feed hole 16 to cut the lead terminal 12 at a predetermined position. .

以上のように、この発明によると帯状部分に多数のリー
ド端子を設けた端子部材の前記帯状部分にこの帯状部分
J:りも広幅のテープ部(Aを固定し、帯状部分の各リ
ード端子間に分離孔を設けたので、電子部品と半田付に
より接続した各リード端子を独立させると同時にテープ
部材で保持覆ることができ、電子部品をデーピング状態
のままでその性能測定が可能になり、テーピング状態に
より電子部品のプリント基板への自動装着を実現するこ
とかできる。
As described above, according to the present invention, a wide tape portion (A) is fixed to the strip-shaped portion of the terminal member in which a large number of lead terminals are provided on the strip-shaped portion. Since a separation hole is provided in the , each lead terminal connected to the electronic component by soldering can be made independent and at the same time be held and covered by the tape material, making it possible to measure the performance of the electronic component while it is in the taped state. Depending on the situation, it is possible to automatically attach electronic components to printed circuit boards.

また、テープ状態のまま巻回して電子部品の出荷が可能
になり、電子部品の包装が容易で必る。
In addition, it becomes possible to ship electronic components by winding them in a tape state, making it easy to package electronic components.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の端子部材を示す斜視図、第2図は同上を
用いた電子部品連の平面図、第3図はこの発明に係る電
子部品連の第1の例を示す斜視図、第4図は同上の縦断
面図、第5図は同第2の例を示す斜視図、第6図は同上
の縦断面図、第7図は同第3の例を示す斜視図、第8図
は同上の縦断面図、第9図は同第4の例を示す斜視図、
第10図は同上の縦断面図、第11図は同第5の例をポ
リ一平面図である。 11・・・帯状部分  12・・・リードOEf子13
・・・端子部材  14・・・テープ部材15・・・分
離孔  16・・・送り孔  A・・・電子部品第1図 第2図
FIG. 1 is a perspective view showing a conventional terminal member, FIG. 2 is a plan view of an electronic component chain using the same, and FIG. 3 is a perspective view showing a first example of an electronic component chain according to the present invention. 4 is a vertical cross-sectional view of the same as above, FIG. 5 is a perspective view showing the second example of the same, FIG. 6 is a vertical cross-sectional view of the same as above, FIG. 7 is a perspective view of the third example of the same, and FIG. is a longitudinal cross-sectional view of the same as above, and FIG. 9 is a perspective view showing the fourth example of the same.
FIG. 10 is a longitudinal cross-sectional view of the same as above, and FIG. 11 is a polygon plan view of the fifth example. 11... Band-shaped part 12... Lead OEf element 13
... Terminal member 14 ... Tape member 15 ... Separation hole 16 ... Feed hole A ... Electronic component Fig. 1 Fig. 2

Claims (5)

【特許請求の範囲】[Claims] (1)帯状部分に多数のリード端子を並べて突設した端
子部材の前記帯状部分に電気絶縁性のテープ部材を固定
化し、帯状部分の各リード端子間の位置に分離孔が設け
られ、前記それぞれのリード端子には複数個の電子部品
が取付けられていることを特徴とする電子部品連。
(1) An electrically insulating tape member is fixed to the strip-shaped portion of a terminal member in which a large number of lead terminals are lined up and protruding from the strip-shaped portion, and separation holes are provided at positions between the respective lead terminals of the strip-shaped portion, and each of the An electronic component series characterized in that a plurality of electronic components are attached to the lead terminal.
(2)  テープ部材は帯状部分よりも広幅の厚紙台紙
で形成され、接着剤で帯状部分に固定されている特許請
求の範囲第1項記載の電子部品連。
(2) The electronic component series according to claim 1, wherein the tape member is formed of a cardboard mount having a width wider than the band-shaped portion, and is fixed to the band-shaped portion with an adhesive.
(3)  テープ部材は帯状部分よりも広幅の台紙と粘
着テープで形成され、帯状部分を挾んで台紙と粘着テー
プが貼合されている特許請求の範囲第1項に記載の電子
部品連。
(3) The electronic component series according to claim 1, wherein the tape member is formed of a mount having a width wider than the band-shaped portion and an adhesive tape, and the mount and the adhesive tape are pasted together with the band-shaped portion sandwiched therebetween.
(4)  テープ部材は帯状部分よりも広幅の台紙を用
いて形成され、帯状部分に設けた突き刺し爪の貫通と折
曲げによって帯状部分に固定されている特許請求の範囲
第1項に記載の電子部品連。
(4) The electronic device according to claim 1, wherein the tape member is formed using a mount wider than the band-shaped portion, and is fixed to the band-shaped portion by penetrating and bending a piercing claw provided in the band-shaped portion. Part series.
(5)  テープ部材は可撓性の合成樹脂を用い帯状部
分を被覆するように帯状に一体成形されている特許請求
の範囲第1項に記載の電子部品連。
(5) The electronic component series according to claim 1, wherein the tape member is made of flexible synthetic resin and is integrally molded into a band shape so as to cover the band portion.
JP57224146A 1982-12-20 1982-12-20 Electronic part series Pending JPS59113618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57224146A JPS59113618A (en) 1982-12-20 1982-12-20 Electronic part series

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57224146A JPS59113618A (en) 1982-12-20 1982-12-20 Electronic part series

Publications (1)

Publication Number Publication Date
JPS59113618A true JPS59113618A (en) 1984-06-30

Family

ID=16809258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57224146A Pending JPS59113618A (en) 1982-12-20 1982-12-20 Electronic part series

Country Status (1)

Country Link
JP (1) JPS59113618A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277225A (en) * 1989-04-18 1990-11-13 Matsushita Electric Ind Co Ltd Manufacture of electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277225A (en) * 1989-04-18 1990-11-13 Matsushita Electric Ind Co Ltd Manufacture of electronic component

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