JPH0146590B2 - - Google Patents
Info
- Publication number
- JPH0146590B2 JPH0146590B2 JP55106501A JP10650180A JPH0146590B2 JP H0146590 B2 JPH0146590 B2 JP H0146590B2 JP 55106501 A JP55106501 A JP 55106501A JP 10650180 A JP10650180 A JP 10650180A JP H0146590 B2 JPH0146590 B2 JP H0146590B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- colloid
- activation
- zeta potential
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000084 colloidal system Substances 0.000 claims description 45
- 239000002245 particle Substances 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 23
- 230000004913 activation Effects 0.000 claims description 22
- 238000007772 electroless plating Methods 0.000 claims description 16
- 108010010803 Gelatin Proteins 0.000 claims description 15
- 229920000159 gelatin Polymers 0.000 claims description 15
- 235000019322 gelatine Nutrition 0.000 claims description 15
- 235000011852 gelatine desserts Nutrition 0.000 claims description 15
- 239000008273 gelatin Substances 0.000 claims description 14
- 239000000375 suspending agent Substances 0.000 claims description 12
- 230000003213 activating effect Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 239000000725 suspension Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 239000010970 precious metal Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 4
- 239000012279 sodium borohydride Substances 0.000 description 4
- 229910000033 sodium borohydride Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 229920001353 Dextrin Polymers 0.000 description 2
- 239000004375 Dextrin Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000001246 colloidal dispersion Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229940076286 cupric acetate Drugs 0.000 description 2
- 235000019425 dextrin Nutrition 0.000 description 2
- 239000011213 glass-filled polymer Substances 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical class Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- 239000001263 FEMA 3042 Substances 0.000 description 1
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- -1 alkylene naphthalene sulfonic acid Chemical compound 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10650180A JPS5732361A (en) | 1980-08-04 | 1980-08-04 | Activation copper colloid for metal plating insulation surface and manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10650180A JPS5732361A (en) | 1980-08-04 | 1980-08-04 | Activation copper colloid for metal plating insulation surface and manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5732361A JPS5732361A (en) | 1982-02-22 |
| JPH0146590B2 true JPH0146590B2 (de) | 1989-10-09 |
Family
ID=14435177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10650180A Granted JPS5732361A (en) | 1980-08-04 | 1980-08-04 | Activation copper colloid for metal plating insulation surface and manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5732361A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066899A (ja) * | 1983-09-22 | 1985-04-17 | 日本電気株式会社 | 印刷配線板の製造方法 |
| CN115989341A (zh) * | 2020-10-21 | 2023-04-18 | 旭化成株式会社 | 带导电性图案的结构体的制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3958048A (en) * | 1974-04-22 | 1976-05-18 | Crown City Plating Company | Aqueous suspensions for surface activation of nonconductors for electroless plating |
-
1980
- 1980-08-04 JP JP10650180A patent/JPS5732361A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3958048A (en) * | 1974-04-22 | 1976-05-18 | Crown City Plating Company | Aqueous suspensions for surface activation of nonconductors for electroless plating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5732361A (en) | 1982-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5882736A (en) | palladium layers deposition process | |
| US4002778A (en) | Chemical plating process | |
| US3873360A (en) | Method of depositing a metal on a surface of a substrate | |
| EP0100452B1 (de) | Verfahren zur Vorbehandlung von Substraten vor der Plattierung | |
| JP2918339B2 (ja) | パラジウム層析出方法 | |
| US4632857A (en) | Electrolessly plated product having a polymetallic catalytic film underlayer | |
| Barker | Electroless deposition of metals | |
| US3485597A (en) | Electroless deposition of nickel-phosphorus based alloys | |
| ATE134719T1 (de) | Abscheidung von silberschichten auf nichtleitenden substraten | |
| JPS6325518B2 (de) | ||
| US9551073B2 (en) | Method for depositing a first metallic layer onto non-conductive polymers | |
| US3668003A (en) | Printed circuits | |
| JP2004197221A (ja) | 合成物質電気メッキ用基板の活性化方法 | |
| US4581256A (en) | Electroless plating composition and method of use | |
| US5219815A (en) | Low corrosivity catalyst containing ammonium ions for activation of copper for electroless nickel plating | |
| EP0044878B1 (de) | Stabiles wässriges Kolloid zur Aktivierung nichtleitender Substrate und Verfahren zur Aktivierung | |
| US5843517A (en) | Composition and method for selective plating | |
| US4671968A (en) | Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces | |
| US3841881A (en) | Method for electroless deposition of metal using improved colloidal catalyzing solution | |
| US4762560A (en) | Copper colloid and method of activating insulating surfaces for subsequent electroplating | |
| JPH0146590B2 (de) | ||
| US3650913A (en) | An electroless plating process employing a specially prepared palladium-tin activator solution | |
| JPH08176837A (ja) | 無電解ニッケルリンめっき液 | |
| US4820547A (en) | Activators for colloidal catalysts in electroless plating processes | |
| US4681630A (en) | Method of making copper colloid for activating insulating surfaces |