JPH0145957B2 - - Google Patents
Info
- Publication number
- JPH0145957B2 JPH0145957B2 JP58083442A JP8344283A JPH0145957B2 JP H0145957 B2 JPH0145957 B2 JP H0145957B2 JP 58083442 A JP58083442 A JP 58083442A JP 8344283 A JP8344283 A JP 8344283A JP H0145957 B2 JPH0145957 B2 JP H0145957B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldering iron
- solder
- wire
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 254
- 238000005476 soldering Methods 0.000 claims description 213
- 229910052742 iron Inorganic materials 0.000 claims description 127
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 55
- 238000009413 insulation Methods 0.000 claims description 29
- 238000012546 transfer Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 5
- 230000006866 deterioration Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 238000012360 testing method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005491 wire drawing Methods 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 2
- XEEYBQQBJWHFJM-NJFSPNSNSA-N Iron-58 Chemical compound [58Fe] XEEYBQQBJWHFJM-NJFSPNSNSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37665882A | 1982-05-10 | 1982-05-10 | |
| US376658 | 1982-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5916289A JPS5916289A (ja) | 1984-01-27 |
| JPH0145957B2 true JPH0145957B2 (de) | 1989-10-05 |
Family
ID=23485924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58083442A Granted JPS5916289A (ja) | 1982-05-10 | 1983-05-10 | 端子パッドへのワイヤーハンダ付け方法及びシステム |
Country Status (11)
| Country | Link |
|---|---|
| JP (1) | JPS5916289A (de) |
| AU (1) | AU1436083A (de) |
| BR (1) | BR8302421A (de) |
| CA (1) | CA1202377A (de) |
| CH (1) | CH659204A5 (de) |
| DE (1) | DE3313456C2 (de) |
| FR (1) | FR2526624B1 (de) |
| GB (1) | GB2120152B (de) |
| NL (1) | NL8301585A (de) |
| SE (1) | SE450098B (de) |
| ZA (1) | ZA833330B (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63144864A (ja) * | 1986-12-08 | 1988-06-17 | Matsushita Electric Ind Co Ltd | 基板加熱装置 |
| DE3722729A1 (de) * | 1987-07-09 | 1989-01-19 | Productech Gmbh | Geheizter stempel |
| DE3828621A1 (de) * | 1988-08-23 | 1990-03-01 | Productech Gmbh | Vorrichtung zum herstellen eines definierten spaltes zwischen werkzeug und teilen beim impulsloeten |
| US4987678A (en) * | 1989-03-21 | 1991-01-29 | Harris Corporation | Apparatus for installing wire in grid support structure |
| EP0468267B1 (de) * | 1990-07-23 | 1994-04-13 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Verlegewerkzeug zum Verlegen einer Änderungsverdrahtung bei Leiterplatten, sowie Verfahren zum Verlegen der Änderungsverdrahtung |
| DE102010006879A1 (de) * | 2010-02-04 | 2011-08-04 | Sunfilm AG, 01900 | Verfahren zur Kontaktierung eines Fotovoltaikmoduls |
| DE102017114771B4 (de) | 2017-06-29 | 2022-01-27 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zur Herstellung einer Drahtverbindung sowie Bauelementanordnung mit Drahtverbindung |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5644043U (de) * | 1979-09-12 | 1981-04-21 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1164437A (en) * | 1966-05-27 | 1969-09-17 | Plessey Co Ltd | Improvements relating to Soldering |
| US3673681A (en) * | 1969-04-01 | 1972-07-04 | Inforex | Electrical circuit board wiring |
| US3650450A (en) * | 1969-11-24 | 1972-03-21 | Wells Electronics | Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly |
| US3960309A (en) * | 1974-07-31 | 1976-06-01 | International Business Machines Corporation | Fine wire twisted pair routing and connecting system |
| FR2304247A1 (fr) * | 1975-03-12 | 1976-10-08 | Commissariat Energie Atomique | Procede et dispositif d'interconnexion de composants electroniques |
-
1983
- 1983-04-11 DE DE3313456A patent/DE3313456C2/de not_active Expired
- 1983-05-03 GB GB08312010A patent/GB2120152B/en not_active Expired
- 1983-05-04 NL NL8301585A patent/NL8301585A/nl not_active Application Discontinuation
- 1983-05-09 CH CH2532/83A patent/CH659204A5/de not_active IP Right Cessation
- 1983-05-09 AU AU14360/83A patent/AU1436083A/en not_active Abandoned
- 1983-05-09 BR BR8302421A patent/BR8302421A/pt unknown
- 1983-05-10 SE SE8302679A patent/SE450098B/sv not_active IP Right Cessation
- 1983-05-10 FR FR8307762A patent/FR2526624B1/fr not_active Expired
- 1983-05-10 CA CA000427813A patent/CA1202377A/en not_active Expired
- 1983-05-10 JP JP58083442A patent/JPS5916289A/ja active Granted
- 1983-05-10 ZA ZA833330A patent/ZA833330B/xx unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5644043U (de) * | 1979-09-12 | 1981-04-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL8301585A (nl) | 1983-12-01 |
| DE3313456A1 (de) | 1983-11-17 |
| SE8302679D0 (sv) | 1983-05-10 |
| DE3313456C2 (de) | 1984-02-16 |
| CH659204A5 (de) | 1987-01-15 |
| BR8302421A (pt) | 1984-01-10 |
| GB2120152A (en) | 1983-11-30 |
| ZA833330B (en) | 1984-06-27 |
| GB8312010D0 (en) | 1983-06-08 |
| AU1436083A (en) | 1983-11-17 |
| CA1202377A (en) | 1986-03-25 |
| FR2526624A1 (fr) | 1983-11-10 |
| SE450098B (sv) | 1987-06-09 |
| GB2120152B (en) | 1986-06-04 |
| SE8302679L (sv) | 1983-11-11 |
| JPS5916289A (ja) | 1984-01-27 |
| FR2526624B1 (fr) | 1986-05-02 |
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