JPH0144219Y2 - - Google Patents
Info
- Publication number
- JPH0144219Y2 JPH0144219Y2 JP11233485U JP11233485U JPH0144219Y2 JP H0144219 Y2 JPH0144219 Y2 JP H0144219Y2 JP 11233485 U JP11233485 U JP 11233485U JP 11233485 U JP11233485 U JP 11233485U JP H0144219 Y2 JPH0144219 Y2 JP H0144219Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- tank
- printed circuit
- circuit board
- solder melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233485U JPH0144219Y2 (cs) | 1985-07-24 | 1985-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233485U JPH0144219Y2 (cs) | 1985-07-24 | 1985-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6220768U JPS6220768U (cs) | 1987-02-07 |
| JPH0144219Y2 true JPH0144219Y2 (cs) | 1989-12-21 |
Family
ID=30993109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11233485U Expired JPH0144219Y2 (cs) | 1985-07-24 | 1985-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0144219Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6504887B2 (ja) * | 2015-04-03 | 2019-04-24 | セイテック株式会社 | 局所半田付け装置 |
-
1985
- 1985-07-24 JP JP11233485U patent/JPH0144219Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6220768U (cs) | 1987-02-07 |
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