JPH0143820Y2 - - Google Patents
Info
- Publication number
- JPH0143820Y2 JPH0143820Y2 JP1981065155U JP6515581U JPH0143820Y2 JP H0143820 Y2 JPH0143820 Y2 JP H0143820Y2 JP 1981065155 U JP1981065155 U JP 1981065155U JP 6515581 U JP6515581 U JP 6515581U JP H0143820 Y2 JPH0143820 Y2 JP H0143820Y2
- Authority
- JP
- Japan
- Prior art keywords
- core wire
- board
- terminal
- lance
- protruding end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002788 crimping Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【考案の詳細な説明】
(産業上の利用分野)
本考案は基板用ターミナルに関するものであ
る。[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a terminal for a board.
(従来の技術)
従来の基板用ターミナルとして特開昭51−
511699号公報記載のものがある。これは、第1図
に示すように、その先端部を基板Pの孔Paを通
して裏面側に突出させ、その突出端を半田盛りし
ているが、この突出端16の長さL1がほぼ3.5
mmと長いので、他の素子との短絡を防止するため
に、ターミナルの圧着部13をほぼ1.5〜2mmカ
ツトしているのが実情であつた。(Conventional technology) As a terminal for conventional circuit boards, JP-A-51-
There is one described in Publication No. 511699. As shown in FIG. 1, the tip of this protrudes through the hole Pa of the substrate P to the back side, and the protruding end is filled with solder, but the length L1 of this protruding end 16 is approximately 3.5
Since the terminal is long (about 1.5 mm), the crimp portion 13 of the terminal is actually cut by approximately 1.5 to 2 mm to prevent short circuit with other elements.
(考案が解決しようとする課題)
しかしながら、この圧着部13は非常に硬いの
で、切断刃が破損しやすく、またカツト作業の工
程分作業能率の低下を招いていた。また芯線被覆
部12と圧着部13との間の下面に設けたランス
14が直線状に延びているために、ランスの基板
Pの裏面に対する引掛りが弱い欠点があつた。さ
らに、芯線被覆部12と圧着部13との間の上面
に形成した切欠部15はフツク状であるので半田
盛りを良くするのになお改善の余地があつた。(Problems to be Solved by the Invention) However, since the crimp portion 13 is very hard, the cutting blade is easily damaged, and the efficiency of the cutting process is reduced. Further, since the lance 14 provided on the lower surface between the core wire covering part 12 and the crimping part 13 extends linearly, there is a drawback that the lance is weakly caught on the back surface of the substrate P. Furthermore, since the notch 15 formed on the upper surface between the core wire covering part 12 and the crimping part 13 is hook-shaped, there is still room for improvement in improving solder coverage.
本考案の目的は上記の欠点を除去すると共に半
田盛りをよくすることにある。 The purpose of the present invention is to eliminate the above-mentioned drawbacks and to improve solder deposition.
(課題を解決するための手段)
本考案の特徴は、順次連ねて形成したリード線
被覆圧着部、芯線被覆部および芯線圧着部で構成
してあり、上記芯線圧着部と芯線被覆部との間の
一面側に先端部に屈成部を有するランスを設け、
他面側に両端を切込んだ皿状の切欠部を形成して
あり、ターミナル先端部が基板の孔より裏面側に
突出可能であつて、突出端の長さがほぼ1.2〜2.0
mmであり、上記ランスおよび切欠部が上記基板の
裏面側に位置可能であり、上記突出端が半田盛り
により基板に支持可能としたことにある。(Means for Solving the Problems) The feature of the present invention is that it is composed of a lead wire covering crimping section, a core wire covering section, and a core wire crimping section formed in series, and a gap between the core wire crimping section and the core wire covering section. A lance having a bending part at the tip is provided on one side of the
A dish-shaped notch with both ends cut out is formed on the other side, and the terminal tip can protrude from the hole in the board to the back side, and the length of the protruding end is approximately 1.2 to 2.0 mm.
mm, the lance and the notch can be positioned on the back side of the substrate, and the protruding end can be supported by the substrate with solder.
(実施例)
以下本考案の一実施例を図面に基づいて説明す
る。(Example) An example of the present invention will be described below based on the drawings.
第2〜4図において、基板用ターミナルは、順
次連ねて形成したリード線被覆圧着部1、芯線被
覆部2および芯線圧着部3とで構成してある。被
覆圧着部1はリード線Sの先端の被覆部分を圧着
し、芯線被覆部2は被覆部分から露出している芯
線Wを被覆し、さらに芯線圧着部3はこの芯線の
最先端部を圧着している。そして芯線被覆部2と
芯線圧着部3との間の背面にはランス4を切り起
してある。ランス4の先端部は外方に屈成した屈
成部4aとなつており、この屈成部によりランス
の復元力を大きくし、基板Pの裏面へ引掛りを大
きくしている。またランス4の反対側には切欠部
5,5を設けてあつて、この切欠部は半田盛りを
良くするために、両端を背面側に切り込んだ皿状
に形成している。 In FIGS. 2 to 4, the board terminal is composed of a lead wire covering crimping section 1, a core wire covering section 2, and a core wire crimping section 3 formed in series. The covering crimping part 1 crimps the covering part at the tip of the lead wire S, the core wire covering part 2 covers the core wire W exposed from the covering part, and the core wire crimping part 3 crimps the leading end of this core wire. ing. A lance 4 is cut and raised on the back surface between the core wire covering part 2 and the core wire crimping part 3. The distal end of the lance 4 has a bent portion 4a bent outward, and this bent portion increases the restoring force of the lance and increases its ability to hook onto the back surface of the substrate P. Further, on the opposite side of the lance 4, notches 5, 5 are provided, and the notches are formed into a dish shape with both ends cut into the back side in order to improve the solder build-up.
ここで、ターミナルの基板Pへの取付け状態を
第2図に基づいて説明する。ターミナル先端部は
基板Pの孔Paより裏面側に突出している。この
突出端6の長さLは、他の素子(図示せず。)と
短絡しない範囲すなわちほぼ1.2〜2.0mmに設定し
てある。突出端6は半田盛りされて、基板Pに支
持される。 Here, the state in which the terminal is attached to the board P will be explained based on FIG. 2. The tip of the terminal protrudes from the hole Pa of the board P toward the back side. The length L of this protruding end 6 is set within a range that does not short-circuit with other elements (not shown), that is, approximately 1.2 to 2.0 mm. The protruding end 6 is soldered and supported by the substrate P.
(考案の効果)
以上説明したように本考案によれば、切欠部を
皿状に形成したので、半田付け作業が容易とな
り、半田盛りを良くできて、基板の孔からのター
ミナル突出端を短く形成でき、このために他の素
子の短絡を防止することができ、従来のように芯
線圧着部を切断する作業をが不要となり、組立作
業の能率の向上を図ることができる。ランスの先
端部に屈成部を形成したので、復元力を大きくで
きて、基板へのランスの引掛りを大きくとれる。
さらに、切欠部をその両端を切り込んだ形状とし
たので、半田盛りを良くすることができ、この切
欠部を皿状に形成してあるので、半田付け作業が
容易となり、より一層半田盛りを良くすることが
でき、溶融半田がリード線の芯線間に多量にし浸
み込んでリード線、ターミナル及び基板の三者間
の結合を強固なものにする効果がある。(Effects of the invention) As explained above, according to the invention, the notch is formed into a dish shape, which facilitates soldering work, improves the solder build-up, and shortens the protruding end of the terminal from the hole in the board. Therefore, it is possible to prevent short-circuiting of other elements, and there is no need to cut the core wire crimping portion as in the conventional method, thereby improving the efficiency of assembly work. Since the bending part is formed at the tip of the lance, the restoring force can be increased, and the lance can be more easily caught on the substrate.
Furthermore, since the notch has a shape with both ends cut out, it is possible to improve the solder buildup, and since the notch is formed into a dish shape, the soldering work is easier and the solder buildup is even better. This has the effect of allowing a large amount of molten solder to penetrate between the core wires of the lead wires, thereby strengthening the bond between the lead wire, the terminal, and the board.
第1図は従来のターミナルの取付け状態を示す
断面図、第2図は本考案のターミナルの取付け状
態を示す断面図、第3図は本考案のターミナルの
正面図、第4図は第3図−線断面である。
1……リード線被覆圧着部、2……芯線被覆
部、3……芯線圧着部、4……ランス、4a……
ランスの屈曲部、5……切欠部、6……ターミナ
ルの突出端。
Figure 1 is a cross-sectional view showing how the conventional terminal is installed, Figure 2 is a cross-sectional view showing how the terminal of the present invention is installed, Figure 3 is a front view of the terminal of the present invention, and Figure 4 is Figure 3. - It is a line cross section. 1... Lead wire covering crimping part, 2... Core wire covering part, 3... Core wire crimping part, 4... Lance, 4a...
Bent part of the lance, 5... Notch part, 6... Projecting end of the terminal.
Claims (1)
被覆部および芯線圧着部で構成してあり、 上記芯線圧着部と芯線被覆部との間の一面側に
先端部に屈成部を有するランスを設け、他面側に
両端を切込んだ皿状の切欠部を形成してあり、 ターミナル先端部が基板の孔より裏面側に突出
可能であつて、突出端の長さがほぼ1.2〜2.0mmで
あり、上記ランスおよび切欠部が上記基板の裏面
側に位置可能であり、上記突出端が半田盛りによ
り基板に支持可能であることを特徴とする基板用
ターミナル。[Scope of Claim for Utility Model Registration] It is composed of a lead wire covering crimping part, a core wire covering part, and a core wire crimping part formed in series, and a tip part is provided on one side between the core wire crimping part and the core wire covering part. A lance having a bending part is provided, and a dish-shaped notch is formed on the other side with both ends cut out, and the terminal tip part can protrude from the hole in the board to the back side, and the length of the protruding end is 1. A terminal for a board, characterized in that the lance and cutout portion can be located on the back side of the board, and the protruding end can be supported by the board by solder filling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981065155U JPH0143820Y2 (en) | 1981-05-07 | 1981-05-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981065155U JPH0143820Y2 (en) | 1981-05-07 | 1981-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57178378U JPS57178378U (en) | 1982-11-11 |
JPH0143820Y2 true JPH0143820Y2 (en) | 1989-12-19 |
Family
ID=29861204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981065155U Expired JPH0143820Y2 (en) | 1981-05-07 | 1981-05-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0143820Y2 (en) |
-
1981
- 1981-05-07 JP JP1981065155U patent/JPH0143820Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57178378U (en) | 1982-11-11 |
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