JPH0143035B2 - - Google Patents

Info

Publication number
JPH0143035B2
JPH0143035B2 JP56125783A JP12578381A JPH0143035B2 JP H0143035 B2 JPH0143035 B2 JP H0143035B2 JP 56125783 A JP56125783 A JP 56125783A JP 12578381 A JP12578381 A JP 12578381A JP H0143035 B2 JPH0143035 B2 JP H0143035B2
Authority
JP
Japan
Prior art keywords
plating
plated
mask
plating liquid
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56125783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827993A (ja
Inventor
Koichi Shimamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonix Co Ltd
Original Assignee
Sonix Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sonix Co Ltd filed Critical Sonix Co Ltd
Priority to JP56125783A priority Critical patent/JPS5827993A/ja
Publication of JPS5827993A publication Critical patent/JPS5827993A/ja
Priority to US06/508,659 priority patent/US4483749A/en
Publication of JPH0143035B2 publication Critical patent/JPH0143035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H10W70/05—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
JP56125783A 1981-08-10 1981-08-10 微小部分メツキ方法及びその装置 Granted JPS5827993A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56125783A JPS5827993A (ja) 1981-08-10 1981-08-10 微小部分メツキ方法及びその装置
US06/508,659 US4483749A (en) 1981-08-10 1983-06-28 Method and apparatus for plating minute parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56125783A JPS5827993A (ja) 1981-08-10 1981-08-10 微小部分メツキ方法及びその装置

Publications (2)

Publication Number Publication Date
JPS5827993A JPS5827993A (ja) 1983-02-18
JPH0143035B2 true JPH0143035B2 (OSRAM) 1989-09-18

Family

ID=14918735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56125783A Granted JPS5827993A (ja) 1981-08-10 1981-08-10 微小部分メツキ方法及びその装置

Country Status (2)

Country Link
US (1) US4483749A (OSRAM)
JP (1) JPS5827993A (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931883A (ja) * 1982-08-12 1984-02-21 Sonitsukusu:Kk 極微小部分メツキ処理部材
JPS616817A (ja) * 1984-06-20 1986-01-13 Canon Inc シ−トコイルの製造方法
JPS61138691A (ja) * 1984-12-10 1986-06-26 ハノ−バ−・リサ−チ・コ−ポレイシヨン 固体から軽質油を除去する為の方法及び装置
LU86119A1 (fr) * 1985-10-15 1987-06-02 Centre Rech Metallurgique Dispositif de depot electrolytique et procede pour sa mise en oeuvre
FR2592895B1 (fr) * 1986-01-16 1990-11-16 Selectrons France Installation pour la realisation de traitements electrolytiques localises de surfaces.
GB8708945D0 (en) * 1987-04-14 1987-05-20 Atomic Energy Authority Uk Electrolytic polishing device
US5389961A (en) * 1991-11-25 1995-02-14 Eastman Kodak Company Ink jet printer with variable-force ink declogging apparatus
US5597412A (en) * 1995-02-15 1997-01-28 Fujitsu Limited Apparatus for forcing plating solution into via openings
JP3949504B2 (ja) * 2002-04-25 2007-07-25 英夫 吉田 母材表面の活性化処理方法および活性化処理装置
EP1653788A1 (de) * 2004-10-28 2006-05-03 Delphi Technologies, Inc. Schattenmaske zur erzeugung eines elektrisch leitenden bereiches auf einem dreidimensionalen schaltungsträger
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
CN113737264B (zh) * 2021-09-22 2023-05-23 中国计量大学 一种微孔前处理和电镀一体化装置及方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2987460A (en) * 1958-10-21 1961-06-06 United States Steel Corp Holder for sheet-metal sample
US3536594A (en) * 1968-07-05 1970-10-27 Western Electric Co Method and apparatus for rapid gold plating integrated circuit slices
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea

Also Published As

Publication number Publication date
JPS5827993A (ja) 1983-02-18
US4483749A (en) 1984-11-20

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