JPH0142350Y2 - - Google Patents
Info
- Publication number
- JPH0142350Y2 JPH0142350Y2 JP19607583U JP19607583U JPH0142350Y2 JP H0142350 Y2 JPH0142350 Y2 JP H0142350Y2 JP 19607583 U JP19607583 U JP 19607583U JP 19607583 U JP19607583 U JP 19607583U JP H0142350 Y2 JPH0142350 Y2 JP H0142350Y2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- flange
- spool
- wall
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19607583U JPS60103835U (ja) | 1983-12-19 | 1983-12-19 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19607583U JPS60103835U (ja) | 1983-12-19 | 1983-12-19 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60103835U JPS60103835U (ja) | 1985-07-15 |
JPH0142350Y2 true JPH0142350Y2 (de) | 1989-12-12 |
Family
ID=30420865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19607583U Granted JPS60103835U (ja) | 1983-12-19 | 1983-12-19 | 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60103835U (de) |
-
1983
- 1983-12-19 JP JP19607583U patent/JPS60103835U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60103835U (ja) | 1985-07-15 |
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