JPH0141017B2 - - Google Patents

Info

Publication number
JPH0141017B2
JPH0141017B2 JP57038874A JP3887482A JPH0141017B2 JP H0141017 B2 JPH0141017 B2 JP H0141017B2 JP 57038874 A JP57038874 A JP 57038874A JP 3887482 A JP3887482 A JP 3887482A JP H0141017 B2 JPH0141017 B2 JP H0141017B2
Authority
JP
Japan
Prior art keywords
lead frame
frame case
disk
cam
machine base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57038874A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58157141A (ja
Inventor
Matsuo Ootake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Seiki Machine Works Ltd
Original Assignee
Fuji Seiki Machine Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Seiki Machine Works Ltd filed Critical Fuji Seiki Machine Works Ltd
Priority to JP57038874A priority Critical patent/JPS58157141A/ja
Priority to US06/492,299 priority patent/US4555876A/en
Publication of JPS58157141A publication Critical patent/JPS58157141A/ja
Publication of JPH0141017B2 publication Critical patent/JPH0141017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0446
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/08Abrasive blasting machines or devices; Plants essentially adapted for abrasive blasting of travelling stock or travelling workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Warehouses Or Storage Devices (AREA)
JP57038874A 1982-03-13 1982-03-13 リ−ドフレ−ムケ−ス連続送出し装置 Granted JPS58157141A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57038874A JPS58157141A (ja) 1982-03-13 1982-03-13 リ−ドフレ−ムケ−ス連続送出し装置
US06/492,299 US4555876A (en) 1982-03-13 1983-05-06 Process and apparatus for finishing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57038874A JPS58157141A (ja) 1982-03-13 1982-03-13 リ−ドフレ−ムケ−ス連続送出し装置

Publications (2)

Publication Number Publication Date
JPS58157141A JPS58157141A (ja) 1983-09-19
JPH0141017B2 true JPH0141017B2 (enExample) 1989-09-01

Family

ID=12537353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57038874A Granted JPS58157141A (ja) 1982-03-13 1982-03-13 リ−ドフレ−ムケ−ス連続送出し装置

Country Status (2)

Country Link
US (1) US4555876A (enExample)
JP (1) JPS58157141A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674238A (en) * 1984-10-03 1987-06-23 Fuji Seiki Machine Works, Ltd. Lead frame handling apparatus for blasting machine
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
DE3613482C2 (de) * 1986-04-22 1996-05-30 Focke & Co Vorrichtung zum formstabilisierenden Speichern von quaderförmigen Packungen
KR940003241B1 (ko) * 1991-05-23 1994-04-16 금성일렉트론 주식회사 To-220 반도체 제조기의 리드프레임 자동 공급장치
US5437534A (en) * 1992-01-21 1995-08-01 R. R. Donnelley & Sons Company Lift index table
US5533922A (en) * 1993-03-22 1996-07-09 Eikichi Yamaharu Method and apparatus for pretreating electronic component manufacturing frame
KR960032667A (ko) * 1995-02-28 1996-09-17 김광호 리드프레임의 이송방법
DE19739868A1 (de) * 1997-09-11 1999-03-25 Piller Entgrattechnik Gmbh Verfahren zum Entgraten von Metallteilen und Vorrichtung zur Durchführung des Verfahrens
NL1008018C2 (nl) * 1998-01-13 1999-07-14 Fico Bv Werkwijze en inrichting voor het separeren en overzetten van electronische componenten.
US20030102016A1 (en) * 2001-12-04 2003-06-05 Gary Bouchard Integrated circuit processing system
NO2982624T3 (enExample) * 2014-08-04 2018-03-03

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360100A (en) * 1966-05-02 1967-12-26 Gd Sas E Seragnoli A Seragnoli Transfer mechanism for articles travelling from a delivery machine to a reception machine
US3771670A (en) * 1972-01-03 1973-11-13 Dennison Mfg Co Ticket stacker
US4008890A (en) * 1975-01-29 1977-02-22 Vanguard Machinery Corporation Method and apparatus for transporting materials
US4068767A (en) * 1976-08-09 1978-01-17 Honeywell Information Systems Inc. Transfer mechanism
DE2710661C2 (de) * 1977-03-11 1984-04-12 Index-Werke Kg Hahn & Tessky, 7300 Esslingen Einrichtung zum Transport eines Werkstückes zwischen einem Werkstückspeicher und einer Werkzeugmaschine
JPS5910578B2 (ja) * 1978-11-28 1984-03-09 株式会社不二精機製造所 リ−ドフレ−ム仕上装置
JPS5617167A (en) * 1979-07-20 1981-02-18 Pioneer Electronic Corp Strip producing apparatus
US4390098A (en) * 1980-11-06 1983-06-28 Ball Corporation Automatic closure reject from upstacking device

Also Published As

Publication number Publication date
JPS58157141A (ja) 1983-09-19
US4555876A (en) 1985-12-03

Similar Documents

Publication Publication Date Title
JPH0141017B2 (enExample)
US6231042B1 (en) Inclining slide for card dispensing device
JP2529100Y2 (ja) 電子部品送り装置
US3386574A (en) High speed item handling apparatus
KR0171924B1 (ko) 여러종류의 부품을 선택적으로 공급하기 위한 부품 공급장치
JP2000016558A (ja) 部品搬送装置
KR0122599B1 (ko) 경화수납 및 배출장치
US5862942A (en) Ampule dispenser
US3553815A (en) Machine for assembling insert into lid
JPH0148653B2 (enExample)
CA1140601A (en) Method and device for separating a sheet from a stack of sheets
US4621970A (en) Apparatus for removing reels with exposed roll films from cartridges
CN119037987A (zh) 可预拣连续袋装中药饮片单元药柜
KR100265157B1 (ko) 칩 부품 공급장치
US4221522A (en) Apparatus for the automatic stepwise displacement and changing of magazines
JP3568588B2 (ja) 打抜き装置の製品箱詰め方法及び箱詰め装置
CN217024276U (zh) 磁铁隔片组装装置
JPS61203035A (ja) シートフイルム貯蔵装置
KR100265158B1 (ko) 칩 부품 공급장치
JP2549156Y2 (ja) パンチ機用パンチ屑排出装置
JPH0125956Y2 (enExample)
CN118346715B (zh) 保持架装珠装置
US3933349A (en) Document copying machine
JPH0145911B2 (enExample)
CN114952376B (zh) 一种电容器铝壳自动切口机