JPH0136913Y2 - - Google Patents
Info
- Publication number
- JPH0136913Y2 JPH0136913Y2 JP19954485U JP19954485U JPH0136913Y2 JP H0136913 Y2 JPH0136913 Y2 JP H0136913Y2 JP 19954485 U JP19954485 U JP 19954485U JP 19954485 U JP19954485 U JP 19954485U JP H0136913 Y2 JPH0136913 Y2 JP H0136913Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating liquid
- pass line
- contact material
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 109
- 239000007788 liquid Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 28
- 239000010970 precious metal Substances 0.000 description 7
- 238000004804 winding Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19954485U JPH0136913Y2 (cs) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19954485U JPH0136913Y2 (cs) | 1985-12-27 | 1985-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62110271U JPS62110271U (cs) | 1987-07-14 |
| JPH0136913Y2 true JPH0136913Y2 (cs) | 1989-11-08 |
Family
ID=31161266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19954485U Expired JPH0136913Y2 (cs) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0136913Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009079242A (ja) * | 2007-09-25 | 2009-04-16 | Panasonic Electric Works Co Ltd | 部分めっき方法及びその装置 |
-
1985
- 1985-12-27 JP JP19954485U patent/JPH0136913Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62110271U (cs) | 1987-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI122221B (fi) | Applikaattori käytettäväksi refleksoterapiassa | |
| KR950704541A (ko) | 닉켈-텅스텐 도금을 위한 전착방법 | |
| DE2324834B1 (de) | Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren | |
| JPH0149795B2 (cs) | ||
| JPH0136913Y2 (cs) | ||
| JPH0140117B2 (cs) | ||
| JPH0140114B2 (cs) | ||
| EP0222232B1 (en) | Plating device for minute portions of connector terminals | |
| JPH0125391B2 (cs) | ||
| US4786389A (en) | Electroplating apparatus | |
| FR2429273A1 (fr) | Electrode comprenant un substrat recouvert d'un film et son procede d'obtention | |
| JPH0140115B2 (cs) | ||
| US4416756A (en) | Electrotreating apparatus with depletable anode roll | |
| JPS62139894A (ja) | 部分メツキ装置 | |
| JPH11209898A5 (cs) | ||
| JPS596919B2 (ja) | ロ−ルメッキ法 | |
| JPH0126770Y2 (cs) | ||
| JP2519374Y2 (ja) | 鋼板処理用電極 | |
| JPH0335882U (cs) | ||
| JPH01212791A (ja) | 帯状被処理物に対する部分めっき装置 | |
| JPH0111733Y2 (cs) | ||
| JPS6236857Y2 (cs) | ||
| CN109640537A (zh) | 一种防止pcb在碱性条件下氧化的pcb褪膜装置 | |
| JPS6211963Y2 (cs) | ||
| JPS6215569U (cs) |