JPH0132764Y2 - - Google Patents

Description

[Detailed Description of the Invention] Purpose of the Invention Industrial Application Field The present invention relates to an endothermic clip that protects electronic components from thermal damage during soldering.

Conventional Technology Conventionally, in order to protect electronic components from thermal damage during soldering, the lead wires, which are the heat transfer path from the heating point to the electronic components, are clipped with metal tweezers or needle-nose pliers. Soldering work is performed while dissipating heat to these clips.

Problems that the invention aims to solve In the conventional method described above, when soldering a large number of parts in succession for a long period of time, the temperature of the clip gradually rises and its function as a heat sink deteriorates. There was a risk of deterioration or destruction.

Means for Solving the Problems in the Structure of the Invention The present invention, which solves the problems in the prior art described above, has a mechanism for fixing the electronic cooling element, and a mechanism for commutating the cooling medium for cooling the heat dissipation part of the electronic cooling element. The clip body has a mechanism for fixing the flow path and the thermometry element inside, a cooling section that supplies an operating current to the electronic cooling element and a cooling medium to the clip body, and a cooling part that keeps the temperature detected by the thermometry element below a predetermined value. and a control unit that controls the cooling unit to maintain the temperature.

The operation of the present invention will be explained in detail below using examples.

Embodiment FIG. 1 is a functional block diagram showing the configuration of an embodiment of the present invention. This endothermic clip device includes a clip body 10, a cooling section 20 that cools the clip body 10, and a clip body 10 that cools the clip body 10.
The control section 30 controls the operation of the cooling section 20 based on the temperature of the cooling section 20 .

FIG. 2 is a sectional view showing an example of the structure of the clip main body 10 of FIG. 1. This clip body 10
consists of a first jaw 11, a second jaw 12, a pin 13 that engages these jaws to open and close them, and a leaf spring 14 that drives both jaws in the closing direction. .

A groove 15 is formed at the tip of the first jaw 11, and a commercially available electronic cooling element 26 utilizing the Peltier effect is embedded in the groove 15. The heat-absorbing side and the heat-generating side of the electronic cooling element 26 are applied with a pressing force against the wall surface of the groove 15 or against the wall surface of the groove 15 so as to maintain good thermal contact with the tip side and the base side of the clip body 10, respectively. It is fixed within the first jaw 11 by soldering or the like.

A cooling water flow path 16 is provided behind the wall surface of the groove portion 15 with which the heat generating side of the electronic cooling element 26 comes into contact. This flow path 16 is connected to the first jaw 1
The cooling water supplied from the flexible hose 21 at the rear end of the jaw 11 is guided to the back of the groove 15 and diverted from there to the flexible hose 2 at the rear end of the jaw 11.
2.

On the other hand, a hole 18 for fixing a thermocouple is formed inside the second jaw 12. This hole 1
8 is configured such that the tip of the thermocouple 31 is pulled in from the rear end of the second jaw 12, guided to the tip of the jaw 12, and fixed there.

The cooling unit 20 includes a DC power supply V1 that supplies an operating current to the electronic cooling element 26 in the clip body 10 via a transistor 34 and a lead wire 27, and a water supply unit that supplies cooling water from a cooling water tank 23 to the clip body 10. It consists of a pump 24 and a DC motor 25 that drives this pump 24.

The thermoelectromotive force (voltage) of the thermocouple 31 is controlled by the control unit 30
is supplied to one input terminal of the differential amplifier circuit 32. Note that one terminal of the thermocouple is grounded via a cold junction (not shown). The other input terminal of the differential amplifier circuit 32 receives a reference voltage from a voltage divider 33.
Vref is supplied. The differential amplifier circuit 32 is
A voltage proportional to the difference voltage between the reference voltage Vref and the output voltage of the thermocouple 31 is output.

When the temperature of the clip body 10 rises above the temperature corresponding to the reference voltage Vref due to long-term soldering work, the output of the differential amplifier circuit 32 is reversed from a positive voltage to a negative voltage, the transistor 34 becomes conductive, and the electronic The current supplied to the cooling element 26 increases. Along with this, both the heat absorption amount on the heat absorption side and the heat generation amount on the heat generation side of the electronic cooling element 26 increase.

Simultaneously with the conduction of transistor 26, transistor 35 also becomes conductive. Along with this, DC motor 2
The applied voltage of the pump 24 increases to near the voltage of the DC power supply V2, the rotational speed increases, and the amount of water supplied by the pump 24 increases. As the pump 24, for example, a gear pump or the like is used, which has a small water flow rate but a high discharge pressure. As the speed of the DC motor increases, the clip body 10
The amount of cooling water supplied to the electronic cooling element 2 increases.
The heat emitted from the heat generating side of 6 is transferred to the clip body 10.
discharge to the outside.

As a result, the temperature of the clip body 10 detected by the thermocouple 31 changes from rising to falling. When the temperature of the clip body 10 falls below a predetermined reference value, the transistor 34 becomes non-conductive, and a bias current is only supplied to the thermoelectric cooling element 26 through the resistor 36. At the same time, the transistor 35 also becomes non-conductive, and the motor 25 is driven at low speed with a low bias voltage obtained by subtracting the voltage drop across the resistor 37 from the power supply voltage.

The clip body 10 as described above can be made by any suitable method. For example, two flat plates having the outline of the first jaw part may be created, the flow path 15 is excavated, and then the two plates may be bonded together by soldering or brazing. The same applies to the second jaw. Further, the material of the clip body 10 may be any suitable material such as steel, brass, or aluminum alloy.

Although a configuration using water as a cooling medium has been illustrated, it is also possible to use a cooling medium with a boiling point slightly lower than room temperature, such as alcohol with a lower boiling point than water, or a cooling medium with a boiling point slightly lower than room temperature, such as Freon 11 or Freon 114, and vaporize it within the clip body 10. If the configuration is such that the cooling capacity can be further increased.

Moreover, although a thermocouple is illustrated as an example of a temperature measuring element, other suitable temperature measuring elements such as a thermistor may be used.

Furthermore, although the fixing mechanisms for the electronic cooling element and the thermometry element are installed in different jaws, they may be formed in the same jaw.

Effects of the invention As explained in detail above, according to the invention,
The structure automatically detects the temperature rise in the clip body and uses an electronic cooling element and a cooling medium to cool the clip body, so even when soldering many parts in succession for a long time, the clip body remains stable. The temperature of the electronic components can be kept constant, and deterioration and destruction of electronic components due to heat can be effectively prevented.

[Brief explanation of the drawing]

FIG. 1 is a functional block diagram showing the configuration of an embodiment of the present invention, and FIG. 2 shows the clip main body 10 of FIG.
FIG. 2 is a cross-sectional view showing an example of the configuration. 10...Clip body, 11...First jaw part,
DESCRIPTION OF SYMBOLS 12... Second jaw part, 15... Channel which diverts a cooling medium, 20... Cooling part, 21, 22... Hose, 23... Cooling water tank, 24... Water pump, 2
5...Motor, 26...Electronic cooling element, 30...
...Control unit, 31...Temperature detection element, 32...Differential amplifier circuit.

Claims (1)

[Claims for Utility Model Registration] A clip body having a mechanism for fixing an electronic cooling element, a channel for commutating a cooling medium for cooling the heat radiation part of the electronic cooling element, and a mechanism for securing a temperature measuring element inside. a cooling section that supplies an operating current to the electronic cooling element and a cooling medium to the clip body; and a control section that controls the cooling section so as to keep the temperature detected by the thermometer below a predetermined value. An endothermic clip device characterized by: