JPH0132765Y2 - - Google Patents

Info

Publication number
JPH0132765Y2
JPH0132765Y2 JP12775384U JP12775384U JPH0132765Y2 JP H0132765 Y2 JPH0132765 Y2 JP H0132765Y2 JP 12775384 U JP12775384 U JP 12775384U JP 12775384 U JP12775384 U JP 12775384U JP H0132765 Y2 JPH0132765 Y2 JP H0132765Y2
Authority
JP
Japan
Prior art keywords
cooling medium
clip body
jaw
temperature
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12775384U
Other languages
Japanese (ja)
Other versions
JPS6142881U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12775384U priority Critical patent/JPS6142881U/en
Publication of JPS6142881U publication Critical patent/JPS6142881U/en
Application granted granted Critical
Publication of JPH0132765Y2 publication Critical patent/JPH0132765Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 考案の目的 産業上の利用分野 本考案は、電子部品をハンダ付け時の熱破壊か
ら保護する吸熱クリツプに関するものである。
[Detailed Description of the Invention] Purpose of the Invention Industrial Application Field The present invention relates to an endothermic clip that protects electronic components from thermal damage during soldering.

従来の技術 従来、電子部品をハンダ付け時の熱破壊から保
護するために、加熱個所から電子部品への伝熱経
路であるリード線の途中を金属製のピンセツトや
ラジオペンチ等のクリツプでクリツプし、クリツ
プ側に熱を逃がしながらハンダ付け作業を行つて
いる。
Conventional Technology Conventionally, in order to protect electronic components from thermal damage during soldering, the lead wires, which are the heat transfer path from the heating point to the electronic components, are clipped with metal tweezers, needle-nose pliers, or other clips. , soldering work is performed while dissipating heat to the clip side.

考案が解決しようとする問題点 上記従来の方法では、多数の個所のハンダ付け
を連続して長時間行う場合、クリツプの温度が次
第に上昇してきてヒートシンクとしての機能が低
下し、電子部品の熱による劣化や破壊を引起こす
おそれがあつた。
Problems that the invention aims to solve In the conventional method described above, when soldering a large number of parts in succession for a long period of time, the temperature of the clip gradually rises and its function as a heat sink deteriorates. There was a risk of deterioration or destruction.

考案の構成 問題点を解決するための手段 上記従来技術の問題点を解決する本考案は、冷
却媒体を反転させる流路及び検温素子を固定する
機構を内部に形成したクリツプ本体と、このクリ
ツプ本体に冷却媒体を供給する冷却媒体供給部
と、検温素子による検出温度を所定値以下に保つ
ように冷却媒体供給部を制御する制御部とを備え
るように構成されている。
Means for Solving the Problems in the Structure of the Invention The present invention, which solves the problems in the prior art described above, consists of a clip body in which a flow path for reversing the cooling medium and a mechanism for fixing the temperature measuring element are formed inside the clip body; The cooling medium supply section is configured to include a cooling medium supply section that supplies a cooling medium to the cooling medium supply section, and a control section that controls the cooling medium supply section so as to keep the temperature detected by the temperature measuring element below a predetermined value.

以下本考案の作用を実施例によつて詳細に説明
する。
The operation of the present invention will be explained in detail below using examples.

実施例 第1図は、本考案の一実施例の構成を示す機能
ブロツク図である。この吸熱クリツプ装置は、ク
リツプ本体10と、このクリツプ本体10に冷却
水を供給する冷却水槽23、送水ポンプ24及び
モーター25を備えた冷却水供給部20と、検出
されたクリツプ本体10の温度に基づいて冷却水
供給部20の動作を制御する制御部30から構成
されている。
Embodiment FIG. 1 is a functional block diagram showing the configuration of an embodiment of the present invention. This endothermic clip device includes a clip body 10, a cooling water supply unit 20 that includes a cooling water tank 23, a water pump 24, and a motor 25 for supplying cooling water to the clip body 10, and a cooling water supply section 20 that controls the detected temperature of the clip body 10. It is comprised of a control section 30 that controls the operation of the cooling water supply section 20 based on the above.

第2図は、第1図のクリツプ本体10の構成の
一例を示す断面図である。このクリツプ本体10
は、第1の顎部11と、第2の顎部12と、これ
ら両顎部を開閉自在に係合するピン13と、両顎
部を閉方向に駆動する板バネ14から構成されて
いる。
FIG. 2 is a sectional view showing an example of the structure of the clip main body 10 of FIG. 1. This clip body 10
consists of a first jaw 11, a second jaw 12, a pin 13 that engages these jaws to open and close them, and a leaf spring 14 that drives both jaws in the closing direction. .

第1の顎部11の内部には、冷却水の流路15
が設けられている。この流路15は、第1の顎部
11の後端部において可撓性のホース21から供
給された冷却水を第1の顎部11の先端部まで導
き、この先端部から転流させて同じく顎部11の
後端部において可撓性のホース22に戻すように
構成されている。
Inside the first jaw 11, a cooling water flow path 15 is provided.
is provided. This flow path 15 guides the cooling water supplied from the flexible hose 21 at the rear end of the first jaw 11 to the tip of the first jaw 11 and diverts it from the tip. Similarly, the jaw 11 is configured to be returned to the flexible hose 22 at its rear end.

一方、第2の顎部12の内部には、熱電対31
を固定するための孔18が形成されている。孔1
8は、熱電対31の先端部を第2の顎部12の後
端部から引入れて顎部12の先端部まで導き、そ
こに固定するように構成されている。
On the other hand, inside the second jaw 12, a thermocouple 31 is provided.
A hole 18 for fixing is formed. Hole 1
8 is configured such that the tip of the thermocouple 31 is pulled in from the rear end of the second jaw 12, guided to the tip of the jaw 12, and fixed there.

熱電対31の熱起電力(電圧)は、制御部30
の差動増幅回路32の一方の入力端子に供給され
る。なお、熱電対31の他方の端子は、図示しな
い冷接点を介して接地されている。差動増幅回路
32の他方の入力端子には、分圧器33から基準
電圧Vrefが供給されている。差動増幅回路32
は、基準電圧Vrefと熱電対31の出力電圧との
差分電圧に比例する大きさの電圧を出力する。
The thermoelectromotive force (voltage) of the thermocouple 31 is controlled by the control unit 30
is supplied to one input terminal of the differential amplifier circuit 32. Note that the other terminal of the thermocouple 31 is grounded via a cold junction (not shown). A reference voltage Vref is supplied from a voltage divider 33 to the other input terminal of the differential amplifier circuit 32 . Differential amplifier circuit 32
outputs a voltage proportional to the difference voltage between the reference voltage Vref and the output voltage of the thermocouple 31.

従つて、長時間のハンダ付け作業に伴つてクリ
ツプ本体10の温度が基準電圧Vref相当の温度
よりも上昇すると、差動増幅回路32の出力が正
電圧から負電圧に反転し、トランジスタ34が導
通する。これに伴い、直流モーター25の印可電
圧が上昇して回転速度が上昇し、冷却水槽23か
ら送水ポンプ24でクリツプ本体10に送られる
水量が増大する。送水ポンプ24は、送水量が小
さく吐出圧が高いギヤポンプ等が使用される。
Therefore, when the temperature of the clip body 10 rises above the temperature corresponding to the reference voltage Vref due to long-term soldering work, the output of the differential amplifier circuit 32 is reversed from a positive voltage to a negative voltage, and the transistor 34 becomes conductive. do. Accordingly, the voltage applied to the DC motor 25 increases, the rotational speed increases, and the amount of water sent from the cooling water tank 23 to the clip body 10 by the water pump 24 increases. As the water pump 24, a gear pump or the like is used, which has a small amount of water to be fed and a high discharge pressure.

この結果、クリツプ本体10の温度上昇につれ
て、これに供給される冷却水量が増加して冷却能
力が高まり、クリツプ本体10の温度が上昇から
下降に転じる。クリツプ本体10の温度が所定の
基準値以下に降下するとトランジスタ34は、非
導通となり、モーター25は、電源電圧から抵抗
器35の電圧降下を差し引いた低い電圧で低速駆
動される。
As a result, as the temperature of the clip body 10 rises, the amount of cooling water supplied to it increases, the cooling capacity increases, and the temperature of the clip body 10 changes from rising to falling. When the temperature of the clip body 10 falls below a predetermined reference value, the transistor 34 becomes non-conductive, and the motor 25 is driven at low speed at a low voltage obtained by subtracting the voltage drop across the resistor 35 from the power supply voltage.

上述のようなクリツプ本体10は適宜な方法で
作成できる。例えば、第1の顎部の輪郭を有する
平板を2個作成し、流路15を掘削したのち、ハ
ンダ付けやろう付けによつて両者を貼合わせても
よい。第2の顎部についても同様である。またク
リツプ本体10の素材は、鋼、黄銅、アルミ合金
等適宜なものを使用できる。
The clip body 10 as described above can be made by any suitable method. For example, two flat plates having the outline of the first jaw part may be created, the flow path 15 is excavated, and then the two plates may be bonded together by soldering or brazing. The same applies to the second jaw. Further, the material of the clip body 10 may be any suitable material such as steel, brass, or aluminum alloy.

冷却媒体として水を使用する構成を例示した
が、水よりも低沸点のアルコールや、商品名フロ
ン11、フロン114等室温よりやや低沸点の冷却媒
体を使用し、クリツプ本体10内で気化を行わせ
る構成とすれば、冷却能力を一層高めることがで
きる。
Although a configuration using water as the cooling medium has been illustrated, it is also possible to use a cooling medium with a boiling point slightly lower than room temperature, such as alcohol with a lower boiling point than water or the product names Freon 11 and Freon 114, and vaporize it within the clip body 10. If the configuration is such that the cooling capacity can be further increased.

また、検温素子として熱電対を例示したが、サ
ーミスタ等他の適宜な検温素子を使用してもよ
い。
Moreover, although a thermocouple is illustrated as an example of a temperature measuring element, other suitable temperature measuring elements such as a thermistor may be used.

さらに、冷却媒体の流路と検温素子の固定機構
を異なる顎部に設置したが、これらを同じ顎部に
形成してもよい。
Furthermore, although the cooling medium flow path and the fixing mechanism for the thermometry element are installed in different jaws, they may be formed in the same jaw.

考案の効果 以上詳細に説明したように、本考案によれば、
クリツプ本体の温度上昇を自動的に検出し、これ
が所定値以下になるように冷却を行う構成である
から、多数の個所のハンダ付けを連続して長時間
行う場合でもクリツプ本体の温度を一定に保つこ
とができ、電子部品の熱による劣化や破壊を有効
に防止できるという効果が奏せられる。
Effects of the invention As explained in detail above, according to the invention,
The structure automatically detects the rise in temperature of the clip body and cools it down to below a predetermined value, so the temperature of the clip body can be kept constant even when soldering many parts in succession for a long time. This has the effect of effectively preventing deterioration and destruction of electronic components due to heat.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の一実施例の構成を示す機能
ブロツク図、第2図は第1図のクリツプ本体10
の構成の一例を示す断面図である。 10……クリツプ本体、11……第1の顎部、
12……第2の顎部、13……第1、第2の顎部
を係合するピン、14……板バネ、15……冷却
媒体を転流させる流路、20……冷却媒体供給
部、21,22……ホース、23……冷却水槽、
24……送水ポンプ、25……モーター、30…
…制御部、31…検温素子、32……差動増幅回
路。
FIG. 1 is a functional block diagram showing the configuration of an embodiment of the present invention, and FIG. 2 shows the clip main body 10 of FIG.
FIG. 2 is a cross-sectional view showing an example of the configuration. 10...Clip body, 11...First jaw part,
12... Second jaw, 13... Pin that engages the first and second jaws, 14... Leaf spring, 15... Channel for commutating the cooling medium, 20... Cooling medium supply Part, 21, 22... hose, 23... cooling water tank,
24...Water pump, 25...Motor, 30...
...Control unit, 31...Temperature detection element, 32...Differential amplifier circuit.

Claims (1)

【実用新案登録請求の範囲】 冷却媒体を転流させる流路及び検温素子を固定
する機構を内部に形成したクリツプ部と、 該クリツプ本体に冷却媒体を供給する冷却媒体
供給部と、 前記検温素子による検出温度を所定値以下に保
つように前記冷却媒体供給部を制御する制御部と
を備えたことを特徴とする吸熱クリツプ装置。
[Scope of Claim for Utility Model Registration] A clip part having a flow path for commutating a cooling medium and a mechanism for fixing a temperature measuring element formed therein; a cooling medium supply part supplying a cooling medium to the clip body; and the temperature measuring element. A control section for controlling the cooling medium supply section so as to maintain a temperature detected by the cooling medium below a predetermined value.
JP12775384U 1984-08-23 1984-08-23 Endothermic clip device Granted JPS6142881U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12775384U JPS6142881U (en) 1984-08-23 1984-08-23 Endothermic clip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12775384U JPS6142881U (en) 1984-08-23 1984-08-23 Endothermic clip device

Publications (2)

Publication Number Publication Date
JPS6142881U JPS6142881U (en) 1986-03-19
JPH0132765Y2 true JPH0132765Y2 (en) 1989-10-05

Family

ID=30686386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12775384U Granted JPS6142881U (en) 1984-08-23 1984-08-23 Endothermic clip device

Country Status (1)

Country Link
JP (1) JPS6142881U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0266864A (en) * 1988-08-31 1990-03-06 Sumitomo Electric Ind Ltd Auxiliary device of soldering of coaxial connector

Also Published As

Publication number Publication date
JPS6142881U (en) 1986-03-19

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