JPH0132357Y2 - - Google Patents
Info
- Publication number
- JPH0132357Y2 JPH0132357Y2 JP10161483U JP10161483U JPH0132357Y2 JP H0132357 Y2 JPH0132357 Y2 JP H0132357Y2 JP 10161483 U JP10161483 U JP 10161483U JP 10161483 U JP10161483 U JP 10161483U JP H0132357 Y2 JPH0132357 Y2 JP H0132357Y2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- holder
- liquid
- semiconductor wafer
- resist solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 25
- 239000007921 spray Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000243 solution Substances 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 22
- 239000007789 gas Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10161483U JPS609224U (ja) | 1983-06-30 | 1983-06-30 | レジスト塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10161483U JPS609224U (ja) | 1983-06-30 | 1983-06-30 | レジスト塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS609224U JPS609224U (ja) | 1985-01-22 |
JPH0132357Y2 true JPH0132357Y2 (de) | 1989-10-03 |
Family
ID=30239886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10161483U Granted JPS609224U (ja) | 1983-06-30 | 1983-06-30 | レジスト塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS609224U (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6165647B2 (ja) * | 2014-01-31 | 2017-07-19 | 東京エレクトロン株式会社 | 塗布装置および接合システム |
-
1983
- 1983-06-30 JP JP10161483U patent/JPS609224U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS609224U (ja) | 1985-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7803720B2 (en) | Coating process and equipment for reduced resist consumption | |
US20130011555A1 (en) | Coating apparatus and coating method | |
JPH05208163A (ja) | スピン・コーティング装置および方法 | |
JPH09246173A (ja) | 塗布方法 | |
JPH0929158A (ja) | 回転式塗布装置 | |
JPH0132357Y2 (de) | ||
JPS6053305B2 (ja) | 現像方法 | |
JPS6369563A (ja) | 塗布方法および装置 | |
JP2002143749A (ja) | 回転塗布装置 | |
JP3169666B2 (ja) | 現像装置及び現像方法 | |
JPS6085524A (ja) | レジスト塗布方法 | |
JP2802636B2 (ja) | 塗布装置及び塗布方法 | |
JPS62121669A (ja) | 塗布装置 | |
JPH08299878A (ja) | 回転式塗布装置および回転式塗布方法 | |
JPH0899057A (ja) | 基板へのレジスト液塗布方法および基板用レジスト液塗布装置 | |
JPS61207019A (ja) | 回転塗布装置 | |
JPH0338821A (ja) | 塗布方法 | |
JPH02133916A (ja) | レジスト塗布装置 | |
JPS581144A (ja) | フオトレジストの塗布方法 | |
JPS60217627A (ja) | 薄膜形成方法と薄膜形成装置 | |
KR20050064779A (ko) | 감광제 도포 장치 | |
KR0172269B1 (ko) | 공정액 분사노즐 조립체 | |
JP2911254B2 (ja) | 塗布方法及び塗布装置 | |
US6395086B1 (en) | Shield for wafer station | |
JP2580082B2 (ja) | 基板の回転処理装置 |