JPH01313964A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH01313964A JPH01313964A JP14517188A JP14517188A JPH01313964A JP H01313964 A JPH01313964 A JP H01313964A JP 14517188 A JP14517188 A JP 14517188A JP 14517188 A JP14517188 A JP 14517188A JP H01313964 A JPH01313964 A JP H01313964A
- Authority
- JP
- Japan
- Prior art keywords
- case
- epoxy resin
- protruding part
- injected
- exfoliating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 abstract description 22
- 229920000647 polyepoxide Polymers 0.000 abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 230000008602 contraction Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- NFLLKCVHYJRNRH-UHFFFAOYSA-N 8-chloro-1,3-dimethyl-7H-purine-2,6-dione 2-(diphenylmethyl)oxy-N,N-dimethylethanamine Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC(Cl)=N2.C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 NFLLKCVHYJRNRH-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂封止形半導体装置、特に個別半導体製
品の構成部品の１つであるケースに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and particularly to a case that is one of the components of an individual semiconductor product.
第３図は従来のケースの断面斜視図、第４図は従来のケ
ースを用いた個別半導体製品の断面図を示すもので、図
において、１はベース板、２は絶縁板、３は電極、４は
チップ、５はケース、６はシリコンゲル、７はエポキシ
樹脂を示す。FIG. 3 is a cross-sectional perspective view of a conventional case, and FIG. 4 is a cross-sectional view of an individual semiconductor product using a conventional case. In the figure, 1 is a base plate, 2 is an insulating plate, 3 is an electrode, 4 is a chip, 5 is a case, 6 is a silicone gel, and 7 is an epoxy resin.
即ち銅ベース板１上に絶縁板２、電極３、チップ４等の
内部構成部品を組み立てた後、ケース５をかぶせ、この
後、シリコンゲル６とエポキシ樹脂７を注入する。That is, after assembling internal components such as an insulating plate 2, an electrode 3, and a chip 4 on a copper base plate 1, a case 5 is placed over the copper base plate 1, and then a silicon gel 6 and an epoxy resin 7 are injected.
ところで以上の如きケース５においては、モールド成形
後にこのケースが金型から剥がれ易くするために上下方
向に少しテーパをつけるが、ケース内面は平らである。Incidentally, the case 5 as described above is slightly tapered in the vertical direction to make it easier to peel off from the mold after molding, but the inner surface of the case is flat.
この他、ケース内側には変形対策として補強用のリブや
ファストン端子受台、またフタを用いる場合は、フタの
つめを引っ掛ける凹みをケース上端部に設けたりする。In addition, reinforcing ribs and faston terminal holders are provided on the inside of the case to prevent deformation, and when a lid is used, a recess for hooking the lid tab is provided at the upper end of the case.
以上のような従来のケース５を用いると、エポキシ樹脂
７は上下面ともケースとの接触面で少し上昇し、すなわ
ち、エポキシ樹脂は下から見るとケースとの接触面が上
へ切れ込んでいる。ところが高温によるシリコンゲル膨
張時または冷却によるエポキシ樹脂やケース等の収縮時
には、エポキシ樹脂はケースとの接触面で下から上への
外回りのモーメントを受け、このモーメントによす、工
ポキシ樹脂は切れ込み部があるため、ケースと剥がれ易
く、室温時、エポキシ樹脂はケースより剥がれて反り上
がるという問題があった。When the conventional case 5 as described above is used, both the upper and lower surfaces of the epoxy resin 7 rise slightly at the contact surfaces with the case, that is, the epoxy resin 7 has an upward cut at the contact surfaces with the case when viewed from below. However, when the silicone gel expands due to high temperatures or when the epoxy resin or case contracts due to cooling, the epoxy resin receives a moment of outward rotation from bottom to top at the contact surface with the case. Because of this, the epoxy resin easily peels off from the case, and there was a problem in that the epoxy resin peeled off from the case and warped at room temperature.
この発明は上記のような問題点を解決するためになされ
たも□ので、エポキシ樹脂がケースより剥がれて反り上
がるのを防止することを目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to prevent the epoxy resin from peeling off from the case and warping.
この発明に係る半導体装置は、ケースの上端部の厚さを
大きくして内側に突き出し部を設けたものである。In the semiconductor device according to the present invention, the thickness of the upper end of the case is increased and a protruding portion is provided on the inside.
この発明においては、エポキシ樹脂部はケース上端の突
き出し部にきてケースとの接触面積が大きくなり、また
この突き出し部によってエポキシ樹脂がケースから剥が
れて反り上がるのを防止する。In this invention, the epoxy resin portion is located at the protrusion at the upper end of the case, increasing the contact area with the case, and this protrusion prevents the epoxy resin from peeling off from the case and warping.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、５ｍはケース５の上端に設けられ
た突き出し部である。なおその他の構成は上記従来例の
ものと同様につき説明を省略する。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figures and FIG. 2, 5 m is a protrusion provided at the upper end of the case 5. Note that the other configurations are the same as those of the above-mentioned conventional example, so explanations will be omitted.
なお上記突き出し部５ａは上端の内側全周に設けてもま
た部分的に設けてもよい。この突き出し部の大きさ、高
さ寸法は製品によって適宜決定し、また、この突き出し
部の隅部は角になっていても、丸みをもっていてもよ（
、面取りしていてもよい。Note that the protruding portion 5a may be provided all around the inside of the upper end, or may be provided partially. The size and height of this protruding part are determined as appropriate depending on the product, and the corners of this protruding part may be angular or rounded.
, may be chamfered.
また、突き出し部の位置は、ケース内にシリコンゲル６
を注入してその上に注入されるエポキシ樹脂部の高さ位
置にくるようにする。In addition, the position of the protrusion is determined by the silicone gel 6 inside the case.
Inject it so that it is at the level of the epoxy resin part that will be injected above it.
以上のようにこの発明によれば、エポキシ樹脂とケース
との接触面積が大きくなるので、温度変化時に各構成部
品の膨張、収縮により、エポキシ樹脂とケースの接触部
が受けろ荷重に対しての抵抗力が大きくなり、ケースと
剥がれにく（なる。As described above, according to the present invention, since the contact area between the epoxy resin and the case is increased, the contact area between the epoxy resin and the case will resist the load due to the expansion and contraction of each component when the temperature changes. The force increases, making it difficult to separate from the case.
また、ケース上部は内側に突き出ていることにより、エ
ポキシ樹脂はケースと剥がれていても反り上がることが
なくなるなどのすぐれた効果がある。Furthermore, since the upper part of the case protrudes inward, the epoxy resin does not warp up even if it is separated from the case, which is an excellent effect.
第１図はこの発明の一実施例によるケースの断面斜視図
、第２図はこのケースを用いた個別半導体製品の断面図
、第３図は従来のケースの断面斜視図、第４図は従来の
ケースを用いた個別半導体製品の断面図である。
図中、１はベース板、２は絶縁板、３は電極、４はチッ
プ、５はケース、５ａは突き出し部、６はシリコンゲル
、７はエポキシ樹脂である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional perspective view of a case according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of an individual semiconductor product using this case, FIG. 3 is a cross-sectional perspective view of a conventional case, and FIG. 4 is a conventional case. FIG. 2 is a cross-sectional view of an individual semiconductor product using the case. In the figure, 1 is a base plate, 2 is an insulating plate, 3 is an electrode, 4 is a chip, 5 is a case, 5a is a protrusion, 6 is a silicon gel, and 7 is an epoxy resin. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ケースを被せ、その後上記構成部品を樹脂で封止するよ
うにしたものにおいて、上記ケースの上端部に内側へ突
き出た突き出し部を設けたことを特徴とする半導体装置
。After mounting electrodes, chips, etc. on a base plate, a resin case is placed on the base plate, and the above-mentioned components are then sealed with resin, in which a protruding portion protruding inward is provided at the upper end of the above-mentioned case. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14517188A JPH01313964A (en) | 1988-06-13 | 1988-06-13 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14517188A JPH01313964A (en) | 1988-06-13 | 1988-06-13 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01313964A true JPH01313964A (en) | 1989-12-19 |
Family
ID=15379077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14517188A Pending JPH01313964A (en) | 1988-06-13 | 1988-06-13 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01313964A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613500A (en) * | 1992-06-26 | 1994-01-21 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
-
1988
- 1988-06-13 JP JP14517188A patent/JPH01313964A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613500A (en) * | 1992-06-26 | 1994-01-21 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
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