JPH01310596A - Stage for formation of through-hole of conductor drawing machine - Google Patents

Abstract

PURPOSE:To enable a stage of this design to cope with in a short time at a low cost even if the position of a through-hole forming hole of a substrate changes by a method wherein a thin metal second suction plate, which is prossessed of a conductor paste sucking hole that corresponds to a substrate sucking hole and the through-hole forming hole of the substrate, is provided. CONSTITUTION:A substrate 3 is sucked to adhere to a second suction plate 12 through substrate sucking holes 4 of a first suction plate 1 and substrate sucking holes 13 of a second suction plate 12 and fixed, and a conductive paste applied onto the edge of through-hole forming holes 5 of the substrate 3 is sucked through conductive paste sucking holes 6 and grooves 7 of the first suction plate 1 and conductive paste sucking holes 14 of the second suction plate 12. Therefore, the conductive paste is made to pass through the through- hole forming holes 5 of the substrate 3 reaching up to the rear of the substrate 3 to form through-holes. By these processes, even if the position of the through- hole forming holes 5 varies, only the thin metal second suction plate 12 is needed to manufacture corresponding to it, so that a through-hole forming stage of this design can be manufactured in a short period at a low cost.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a through hole forming stage of a conductor drawing machine which draws a predetermined circuit pattern using a conductor on a substrate made of alumina ceramic or the like and forms one through hole.

BACKGROUND OF THE INVENTION FIGS. 3 and 4 show the structure of a through-hole forming stage of a conventional conductor drawing machine. Figures 3 and 4
As shown in the figure, a suction box 52 is fixed to the lower side of the suction plate 51. Holes 54 for suctioning the substrate 53 made of alumina ceramic are formed at the outer edge of the suction plate 51, and conductive paste is formed at the center of the suction plate 51 corresponding to the holes 55 for forming the plurality of through holes in the substrate 53. A suction hole 56 is formed. The suction box 52 is formed with a cavity 57 communicating with the suction hole 54 and a cavity 58 communicating with the conductor paste suction hole 56.
A hole 59 for sucking the substrate and a hole 60 for sucking the conductive paste are formed in communication with each of the cavities 57 and 58. Each person 59 and 60 is connected to an adsorption device and a suction device (both not shown). A nozzle 61 is provided above the suction plate 51, and the nozzle 61 is filled with a conductive paste 62.Next, the operation of the above conventional example will be explained.

First, the substrate 53 is placed on the suction plate 51, and
The holes 55 for forming through-holes are aligned with the holes 56 for sucking the conductive paste in the suction plate 51. Next, by driving the suction device, the holes 59 for sucking the substrate in the suction box 52;
The substrate 53 is suctioned and fixed to the suction plate 51 through the cavity 57 and the substrate suction hole 54 of the suction plate 51.

In this state, the nozzle 61 applies the conductive paste 62 to the substrate 53.
Coat the edge of the hole 55 for forming the through hole. Next, the conductor paste 62 is formed into a through hole by driving the suction device to suck the conductor paste 62 through the conductor paste suction hole 60 of the suction box 52, the cavity 58, and the conductor paste suction hole 56 of the suction plate 51. Pass through the hole 55 for use and insert it to the back side of the board 53,
A through hole can be formed.

In this way, even in the through hole forming stage of the conventional conductor drawing machine, the holes 5 for forming through holes in the substrate 53 are
A through hole can be formed by suctioning the conductive paste 62 applied to the edge of the hole 5.

Problems to be Solved by the Invention However, in the through-hole forming stage of the conventional conductor drawing machine, if the position of the through-hole forming hole 55 of the substrate 53 changes, the corresponding conductor paste suction hole 56 cannot be opened. Therefore, it is necessary to manufacture a suction plate 51 having the following characteristics, and manufacturing this suction plate 51 requires many days and high cost.

The present invention solves these conventional problems, and aims to provide a through-hole forming stage for a conductor drawing machine that can be manufactured in a short period of time and at low cost. be.

Means for Solving the Problems In order to achieve the above object, the present invention provides a hole for sucking a substrate, a large number of holes for sucking conductor paste, and a groove having a groove communicating with these holes for sucking conductor paste on the upper surface. a thin metal suction plate placed on the first suction plate and having conductor paste suction holes corresponding to substrate suction holes and holes for forming through-holes in the substrate; It is equipped with a suction plate.

Effects The present invention has the following effects due to the above structure.

That is, the substrate is suctioned and fixed to the second suction plate through the substrate suction holes of the first suction plate and the substrate suction holes of the second suction plate, and the edges of the holes for through-hole formation of the substrate are fixed. By suctioning the conductive paste applied to the conductor paste through the conductor paste suction holes and grooves of the first suction plate and the conductor paste suction holes of the second suction plate, the conductor paste is applied to the substrate for through-hole formation. A through hole can be formed by passing it through the hole and wrapping it around to the back side of the board. In this way, the grooves communicating between the conductive paste suction holes of the first suction plate
Even if the holes for conducting paste suction in the suction plate do not match the positions of the holes for forming through-holes in the board, the conductive paste can be sucked, and therefore the holes for forming through-holes in the board Even if the position changes, only the thin metal second suction plate needs to be manufactured accordingly.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

1 and 2 show a through-hole forming stage of a conductor drawing machine in one embodiment of the present invention, with FIG. 1 being an exploded perspective view and FIG. 2 being a sectional view of the assembled state.

As shown in FIGS. 1 and 2, the first suction plate 1
A suction box 2 is fixed to the lower side. An alumina ceramic substrate 3 is attached to the outer edge of the first suction plate 1.
A suction hole 4 is formed in the first suction plate 1, and a large number of conductor paste suction holes 6 are formed in the center of the first suction plate 1, regardless of the position and number of holes 5 for forming through holes in the substrate 3. Shallow grooves 7 are formed in the upper surface of the first suction plate 1 in all directions, allowing the conductor paste suction holes 6 to communicate with each other. The suction box 2 is formed with a cavity 8 communicating with the hole 4 for sucking the board, a cavity 9 communicating with the hole 6 for sucking the conductive paste, and a cavity 9 communicating with the cavity 6 and 8 for sucking the substrate. A hole 10 and a hole 11 for sucking conductive paste are formed. Each person 10 and 11 is connected to an adsorption device, for example a pump, and a suction device, for example a pump (both not shown). A thin second suction plate 12 made of metal (for example, Q, 1 mm) is mounted on the first suction plate 1 . The outer edge of the second suction plate 12 has holes 1 for sucking substrates corresponding to holes 4 for sucking substrates in the first suction plate 1.
3 is formed, and holes 14 for sucking the conductive paste are formed in the central part corresponding to the holes 5 for forming the plurality of through holes in the substrate 3. These holes 14 for sucking conductor paste
The conductor paste suction holes 6 of the first suction plate 1 communicate with each other directly or through a groove 7 on the upper surface of the first suction plate 1. A nozzle 15 is provided above the second suction plate 12, and the nozzle 15 is filled with a conductive paste 16.

Next, the operation of the above embodiment will be explained.

First, the substrate 3 is placed on the second suction plate 12, and the holes 5 for forming through holes in the substrate 3 are placed on the second suction plate 12.
The hole 14 for sucking the conductive paste in No. Next, by driving the suction device, the holes 1 for suctioning the substrate in the suction box 2 are
0, void 8, hole 4 for substrate suction in first suction plate 1
, the substrate 3 is suctioned and fixed to the second suction plate 12 through the substrate suction hole 13 of the second suction plate 12 . In this state, nozzle 15 J: conductor heath 16
is applied to the edge of the hole 5 for through-hole formation in the substrate 3. Next, the suction device is driven to move the conductor paste suction holes 11 and spaces 9 of the suction box 2, the conductor paste suction holes 6 and grooves 7 of the first suction plate 1, and the conductor paste of the second suction plate 12. By suctioning the conductive paste 16 applied to the edge of the through-hole forming hole 5 through the suction hole 14, the conductive paste 16 is caused to pass through the through-hole forming hole 5 and wrap around to the back side of the board 3. ,
A through hole can be formed.

As described above, according to the above embodiment, even if the position of the hole 5 for through-hole formation in the substrate 3 does not match the position of the hole 6 for sucking the conductive paste on the first suction plate 1, the Hole 6 for conductor paste suction of suction plate 1 of 1, Hole 6
A shallow groove 7 communicating between the holes 5 and a hole 5 for forming a through hole.
The conductor paste 16 can be suctioned from the conductor paste suction hole 14 of the second suction plate 12 that coincides with the position of the conductor paste 16 . Therefore, it is only necessary to manufacture the second suction plate 12 made of thin metal and having the hole 14 for sucking the conductive paste corresponding to the position of the hole 5 for forming the through hole in the substrate 3. The number of days can be shortened,
Production costs are also low. Moreover, the shallow groove 7 allows the suction force from the conductive paste suction holes 14 of the thin metal second suction plate 12 to be uniform.

Effects of the Invention As described above, according to the present invention, the substrate is suctioned and fixed to the second suction plate through the substrate suction hole of the first suction plate and the substrate suction hole of the second suction plate. Then, the conductive paste applied to the edges of the holes for through-hole formation on the board is sucked through the numerous conductive paste suction holes and grooves of the first suction plate and the conductive paste suction holes of the second suction plate. By doing so, the conductive paste is allowed to pass through the hole for forming the through hole in the board and wrap around to the back side of the board, thereby forming the through hole. In this way, even if the holes for forming through-holes on the board do not match the holes in the first suction plate, the conductor paste can be applied to the grooves that communicate with the large spaces for suctioning the conductive paste on the first suction plate. Can be inhaled. therefore,
Even if the position of the hole for through-hole formation on the board changes, it is only necessary to manufacture a second suction plate made of thin metal to match the change, and this second suction plate made of thin metal can be made in a short period of time and at low cost. It can be manufactured.

[Brief explanation of the drawing]

1 and 2 show a stage for forming through-holes in a conductor drawing machine according to an embodiment of the present invention. 1. First suction plate, 2. Suction box, 3. Substrate, 4. For substrate suction. hole, 5, through-hole formation hole, 6...
Hole for conductor paste suction, 7... Groove, 10... Hole for board suction, 11. Hole for conductor paste suction, 12...
・Second suction plate, 13...hole for substrate suction, 1
4... Hole for conductor paste suction, 15... Nozzle, 1
6... Conductor paste. Name of agent: Patent attorney Toshio Nakao and one other person Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] A first suction plate that has a hole for sucking a substrate, a number of holes for sucking conductor paste, and a groove on the top surface that communicates with the holes for sucking conductor paste; A through-hole forming device for a conductor drawing machine, characterized in that the second suction plate is made of thin metal and has a hole for sucking the conductor paste corresponding to the hole for forming the through-hole in the substrate. stage.