JPH01309395A - Printing apparatus for printed-circuit board - Google Patents

Abstract

PURPOSE:To print a solder cream with a uniform thickness by a method wherein a board is shifted surely in the transverse direction on a conveyance cylinder by using a conveyance pin unit, a printing plate is closely contacted surely to the board and the board is stopped surely in a printing position. CONSTITUTION:A conveyance pin 3 is inserted into a reference hole 8 in a board 7. A conveyance cylinder 1 is driven; a conveyance pin unit 5 is shifted in a direction of an arrow A. A conveyance head 4 of the unit 5 is shifted to the upper part; the pin 3 is pulled out from the board 7. When the unit 5 is shifted and reaches a printing position, a head 26 of a reference pin unit 25 which is installed separately under a guide rail 6 is shifted to the upper part; a reference pin 24 is inserted into the reference hole 8. A printing plate 12 is installed on the board 7 by using the cylinder; a lifting force of a spring 26 at the lowering part of the pin 24 and a lowering force of the plate 12 are balanced with each other; the plate 12 is closely contacted surely to the board 7. By this setup, a solder cream can be printed with a uniform thickness.

Description

[Detailed Description of the Invention] [Summary] Regarding a solder cream printing device for a printed circuit board, the printed circuit board installed on a transport pin unit on a transport cylinder is placed in a predetermined printing position in the horizontal direction on the cylinder without shifting. A guide rail for conveying the printed circuit board and a conveyance cylinder provided at the bottom of the guide rail are installed so that the printed circuit board and the printing plate installed on the printed circuit board can be brought into close contact with each other without any gaps. installed on the
a transport pin unit that inserts a transport pin into a reference hole of the printed circuit board to transport the printed circuit board along the guide rail, and a transport bin of the transport bin unit;
It is inserted into the reference hole of the printed circuit board, moved laterally along a conveyance cylinder, and stopped at a predetermined printing position of the cylinder, and a printing plate is placed on the printed circuit board, and solder cream is applied to the printed circuit board. In the printing apparatus, the transport cylinder and the transport bin unit are provided with means for positioning the printing position in the lateral direction of the transport bin unit, and when the printed circuit board reaches the printing position, the transport bin is aligned with the reference hole. A means for inserting and lifting a reference bin into a reference hole of a printed circuit board installed in the transport bin unit is provided, and by setting the printing plate on the board, the printed circuit board is raised to a predetermined height. It is configured to be fixed at the printing position.

[Industrial application field]

The present invention relates to a printing device for printing solder cream on printed circuit boards.

Solder connection pads are provided at predetermined positions on both the front and back sides of the printed circuit board, and after applying solder cream on the pads by printing, electronic components are placed on the pads and introduced into a heating furnace to place the solder connection pads on the solder connection bands. There is no need to provide through holes etc. for surface mount type printed circuit boards that connect electronic components to
This method has been widely used recently because it allows for high-density packaging.

When applying solder cream onto such solder connection pads, a metal film called a printing plate, which has openings in a predetermined pattern and is surrounded by a frame-like member, is installed on the printed circuit board. Then, cream solder is applied by printing onto the metal film using a jig called a squeegee having a rubber cutting edge.

[Conventional technology]

A front view of the main parts of a conventional printing apparatus is shown in FIG. 4, a plan view thereof in FIG. 5, and a side view thereof in FIG. 6.

As shown in FIGS. 4 to 6, a transport bin unit 5 is installed in the transport cylinder 1, contains an inverted angle 2 and a transport bin 3, and has a transport seat 4 that can be moved up and down. The head 4 falls downward, is inserted into the reference hole 8 of the printed circuit board 7 installed on the guide rail 6 on the transport cylinder 1, and is moved in the direction of arrow A by adjusting the air pressure of the transport cylinder 1. The transport bin unit 5 is moved to the end cover 9 installed inside the cylinder 1.
The transport bin unit 5 is stopped at a predetermined printing position in the lateral direction on the cylinder 1 by the contact with the backing 1o of the stop member.

Next, as shown in FIG. 7, when the transport bin unit 5 stops at this predetermined printing position, clampers 11 are installed at both ends of the printed circuit board 7 with the transport bin 3 inserted into the printed circuit board 7. Fixed.

Further, as shown in FIG. 8, with this clamper 11 installed on the printed circuit board 7, a printing plate 12 is installed on the printed circuit board 7, and the solder cream is applied onto the printing plate 12 using a rubber-made squeegee. After application with a printing jig having a cutting edge, the printed circuit board is heat treated in a separate furnace to print the solder cream onto the solder connection pads on the printed circuit board.

[Problem to be solved by the invention]

By the way, in the conventional printing apparatus described above, after the transport bin unit 5 is moved to a predetermined printing position in the lateral direction of the transport cylinder 1, a stop member connected to the transport bin unit 5 is attached to the end cover 9 installed in the cylinder 1. The structure is such that the cushion backing 10 at the tip of the cylinder comes into contact and stops, and this contact position changes depending on the air pressure inside the cylinder 1 or the assembly accuracy of the cylinder 1. There is a problem that is not fixed.

Furthermore, the structure in which the printed circuit board 7 is held down and fixed by the clamper 11 is such that when the printing plate 12 is installed on the printed circuit board 7, the printing plate 12 is held at the end of the printed circuit board 7 by the clamper 1.
1, it does not adhere to the printed circuit board but floats up, and the raised area is printed with a large amount of cream solder.
Problems arise in that the solder cream cannot be accurately applied to the solder connection pads with a uniform thickness, or that the solder cream moves laterally and is not applied in an accurate pattern.

The present invention eliminates the above-mentioned problems, allows the conveyance pin unit to accurately stop at a predetermined position on the conveyance cylinder, and allows the printing plate to be installed on the printed circuit board with good adhesion. The purpose is to provide a printing device for printed circuit boards.

[Means to solve the problem]

The printed circuit board printing apparatus of the present invention, which achieves the above object, has a means for positioning the lateral movement position of the conveying cylinder l and the conveying pin unit 5, as shown in FIGS. 1 to 3. 21, 22° 23 are provided, and when the magnetic feed pin unit 5 reaches a predetermined printing position in the lateral direction of the transfer cylinder 1, the reference hole 8 of the printed circuit board 7 installed in the transfer pin unit 5 is inserted. The transport bin 3 is removed, a reference pin 24 is inserted into the reference hole 8, and a means 25 is provided for lifting and fixing the printed circuit board at a predetermined printing position.

[For production]

The apparatus of the present invention uses the above-mentioned transport cylinder 1 and the transport pin unit 5 for positioning the transport pin unit 5 to set the horizontal movement position (printing position) of the transport pin unit 5 on the transport cylinder 1.

Mechanisms 21, 22, and 23 are provided so that the conveyance pin unit 5 is moved to a predetermined printing position in the lateral direction of the conveyance cylinder 1, and its movement stroke varies depending on the processing accuracy during the manufacture of the conveyance cylinder 1, or To surely stop printing at a predetermined position even if the air pressure of the printer changes.

Furthermore, instead of using a clamper to fix the printed circuit board at a predetermined printing position on the printed circuit board, a reference pin 24 having a spring at the bottom is inserted into the reference hole 8 of the printed circuit board 7 from the bottom of the printed circuit board using a cylinder or the like. A reference pin unit 25 is provided, and when the printing plate 12 is installed from the top of the printed circuit board using a spring 2G provided at the bottom of this reference pin, the printing plate 12 and the printed circuit board can be securely fixed in close contact with each other. shall be.

[Example] Hereinafter, an example of the present invention will be described in detail using the drawings.

FIG. 1 is a front view of a printed circuit board printing apparatus of the present invention, FIG. 2 is a plan view of the apparatus, and FIG. 3 is a diagram showing the positioning of a printed circuit board in the apparatus of the present invention.

As shown in FIGS. 1 to 3, adjustment bolts 22 and rubber bolts are used to stop and fix the movement of the conveyance pin unit 5 at a predetermined position of the conveyance cylinder 1. ! i! Absorbing member 2
3 is provided, and a fixing metal fitting 21 that contacts the bolt 22 is further attached to the angle 2 of the conveying pin unit 5. Here, in order to simplify the drawing, parts such as an end cover and cushion backing inside the conveyance cylinder are omitted from illustration.

Further, the conveyance pin unit 5 moves along the direction of arrow A,
A reference pin 24 is inserted into the reference hole 8 of the printed circuit board 7 when it comes into contact with the adjustment bolt 22 and stops, and a reference pin unit 25 for fixing the printed circuit board 7 is separately provided in place of the clamper.

The operation of such a device of the present invention will be described.

As shown in FIG. 1 to FIG. 3, the head 4 of the conveying pin unit 5 is lowered by the operation of an air cylinder onto the printed circuit board 7 that has been subjected to a predetermined process and conveyed on the guide rail 6, and the printed circuit board 7 is Insert the transport bottle 3 into the reference hole 8 of 7.

Next, the conveyance cylinder 1 is driven and the conveyance pin unit 5
move in the direction of arrow A. Then, the conveyor pin unit 5
are the fixing fittings 21, adjustment bolts 22, and shock absorbing members 23.
It stops at a predetermined printing position on the transport cylinder 1.

Next, the transport head 4 of the transport pin unit 5 is moved upward to remove the transport bin 3 from the printed circuit board 7, and when the first transport bin unit 3 moves and reaches the printing position, The end 26 of the reference pin unit 25 provided separately is moved upward and the reference pin 24 is inserted into the reference hole 8 of the printed circuit board 7. Furthermore, the printing plate 12 described above is installed using a cylinder on the printed circuit board 7 installed in the reference pin unit 25,
The upward force of the spring 26 below the reference pin 24 and the downward force of the printing plate 12 are balanced, and the printing plate 12 is securely brought into close contact with the printed circuit board 7. Also, the reference pin 244
Even if the upper part of the board 7 protrudes slightly from the surface of the printed circuit board 7, a spring 26 is provided at the bottom of the reference pin 24, so that when the printing plate 12 is pressed from above the printed circuit board 7, the plate and board will definitely come into close contact.

In this way, the conveyance pin unit moves laterally from its initial position and reliably stops at a predetermined printing position. Since there are no fixing jigs such as clampers around the printed circuit board, the printing plate can be firmly attached to it, and the solder cream can be applied to the printed circuit board with a uniform thickness without shifting the position.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the shadow feed pin unit can reliably move laterally on the conveyance cylinder and reliably stop at the printing position. Furthermore, since the printing plate is reliably brought into close contact with the printed circuit board, there is an effect that the solder cream can be printed with a uniform thickness.

[Brief explanation of the drawing]

FIG. 1 is a front view of the main parts of the apparatus of the present invention, FIG. 2 is a plan view of the main parts of the apparatus of the invention, FIG. 3 is a diagram of the positioning state of the printed circuit board in the apparatus of the invention, and FIG. Figure 5 is a front view of the main parts of the conventional device, Figure 5 is a plan view of the main parts of the conventional device, Figures 6 and 7 are side views of the main parts of the conventional device, and Figure 8 is the conventional device. FIG. In the figure, 1 is a transfer cylinder, 2 is an angle, 3 is a transfer pin, 4 is a transfer head, 5 is a transfer pin unit, 6 is a guide rail, 7 is a printed circuit board, 8 is a reference hole, 21 is a fixing metal fitting, 2
2 is a bolt, 23 is a shock absorbing member, 24 is a reference pin, 2
5 is a reference pin unit, 26 is a head, and 27 is a spring. Agent Patent Attorney Sada Igata - 61J4 Do and Halfway 13JId Family f, Ube et al. >h)Ej
izzq4tisl:s! f8 (fJ 3rd figure 4's!'s vote penalty front view 4th figure 4th figure 15 white 1.jitmi,,l'A'Jt, l￥FQ =+
41'J tkJ mFigure 6

Claims (1)

[Claims] A guide rail (6) for transporting a printed circuit board (7), and a transport cylinder (1) provided at the bottom of the guide rail.
the reference hole (8) of the printed circuit board (7);
includes a conveyance pin unit (5) for inserting a conveyance pin (3) into the guide rail (6) to convey the printed circuit board (7), and inserting the conveyance pin into the reference hole (8) of the printed circuit board. The cylinder is inserted and moved laterally along the conveyance cylinder (1) and stopped at a predetermined printing position on the cylinder, and a printing plate (12) is placed on the printed circuit board to apply solder cream to the printed circuit board. In the printing apparatus, the conveyance cylinder (1) and the conveyance pin unit (5) are provided with positioning means (for positioning the printing position in the horizontal direction of the conveyance pin unit).
21, 22, 23), and when the printed circuit board reaches the printing position, insert the reference pin (24) into the reference hole (8) of the printed circuit board installed in the transport pin unit (5). providing means (25) for lifting and placing the printing plate (12) on the substrate;
A printed circuit board printing apparatus, characterized in that the printed circuit board is fixed at a printing position at a predetermined height.