JPH01302734A - Electric circuit device - Google Patents

Abstract

PURPOSE:To realize electrical connections, at a time, of many electric circuit components by establishing electrical connection of electric circuit components and the other circuit components using electric circuit holding member and electric connecting member. CONSTITUTION:A plurality of semiconductor elements 101 are held on a holding circuit board 201 using a bonding material. Next, a glass substrate 201 is turned over and the connecting part 102 of semiconductor 102 is provided opposed to the connecting part 105 of the circuit board 104. Next, an electrical connecting member 125 is disposed between the glass substrate 201 and circuit board 104, and moreover aluminum of connecting part 102 of semiconductor element 101 is connected to gold of connecting part 108 of electrical connecting member 125, while gold of connecting part 105 of circuit board 104 is connected to gold of connecting part 109 of electrical connecting member 125 by metallization and/or formation of alloy.

Description

[Detailed description of the invention] [Industrial application fields] The present invention relates to an electric circuit device.

[Prior Art] Conventionally, the following technology is known as a technology related to an electric circuit device in which an electric circuit member configured by electrically connecting electric circuit components to each other is sealed.

■Wire bonding method Figures 18 and 19 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on Figures 18 and 19. .

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

1! In Sequel 11t, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as an epoxy resin by a method such as a transfer molding method, and then the lead frame is extended outward from the resin-sealed component. Unnecessary portions of 1 are cut and bent into a desired shape to form a semiconductor 9.

■T A B (Tape Automate
d Bonding)? Figure 20 shows a typical example of a semiconductor device 1 connected and sealed by the TA method.

This method is an automatic bonding method based on the Dave Carrier method. This method will be explained based on FIG. 20.

In this method, after positioning the gear rear film substrate 16 and the semiconductor element 4, the inner lead portion 17 of the carrier film substrate 16 and the connecting portion 5 of the semiconductor element 4 are connected by thermocompression bonding. After connecting, use eboxy ΔJ resin, etc.
The semiconductor device 9 is sealed with resin 20 or resin 21 which is a thermosetting resin.

■CCB (C0n1:rolled Co11a
(Pse Bonding) method (for example, Japanese Patent Publication No. 42-2096, Japanese Patent Application Laid-Open No. 60-57944) FIG. 21 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 21. Note that this method is also called a flip chip bonding method.

Contacting the semiconductor element 4 (a half bump 31 is provided on the solder section 5 in advance, and the semiconductor element 4 provided with the solder bump 31 is positioned and mounted on the circuit board 32. Then, by heating and melting the solder) The circuit board 32 and the semiconductor element 4 are connected, and sealed after cleaning with fufuss to form a semiconductor device 9.

■The method shown in FIGS. 22 and 23: Do not use polyimide or the like on the parts of the first semiconductor element 4 other than the connection part 5! 3 film 71 is formed, a metal material 70 made of Au or the like is provided at the connection part 5, and then a metal material 70 is formed.
And the exposed surfaces 73 and 72 of the insulation board 71 are made flat.

On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion of the second semiconductor element 4° other than the connecting part 5°, and a metal material 70' made of Au or the like is provided at the connecting part 5'. There,
The exposed surface of the carbon material 70° and the insulating film 71° is 73°.

Flatten 72゛.

Thereafter, as shown in FIG. 23, the first semiconductor element 4 and the second semiconductor element 4' are positioned, and after positioning, they are bonded by thermocompression, thereby connecting the connection part 5 of the first semiconductor element f4 and the second semiconductor element 4'. Connecting portion 5'' of semiconductor element 4'' is connected to metal material 70, 70.
Connect via °.

■The method shown in FIG. 24 An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit board 75 and the second circuit board 75°. After positioning the circuit board 75 and the second circuit board 75°, pressure is applied, or pressure and heat are applied to connect the connection part '76 of the first circuit board 75 and the connection part 76' of the second circuit board 75'. This is the way to connect.

■The method shown in FIG. 25 Between the first circuit board 75 and the second circuit board 75',
The first circuit board 75 and the second circuit board 75 are positioned at 75 degrees by interposing an elastic connector 83 made of an insulating material 81 in which a metal wire 82 made of e, Cu, etc. is oriented in a certain direction. One method is to apply pressure afterward and connect the connecting portion 76 of the first circuit board 75 and the connecting portion 76° of the second circuit board 75'.

[Problems to be Solved by the Invention] However, the conventional honding method described above has the following problems.

■ Wire bonding method ■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead free - The element f) of the frame 1 comes into contact with the outer peripheral edge 11 of the loading portion 2 easily. When the ultrafine metal wire 7 comes into contact with these outer peripheral edges 10 or 11, a short circuit occurs. Furthermore, the ultra-fine metal wire 7
If the length is increased, the ultrafine metal wire 7 will be easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 must be placed around the semiconductor element f4, and is subject to circuit design limitations.

(2) Since the semiconductor element 4 and the lead frame 1 are connected by the ultra-fine metal wire 7, a horizontal spread is required for the connection, and if this is attempted to be made smaller, the short circuit described in (2) above will occur. Therefore, the wire bonding method cannot reduce the horizontal size required for connection, and is not suitable for high-density packaging.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (distance between the centers of adjacent connecting parts 11
i1) It is necessary to maintain a certain amount of distance. Therefore, once the size of the semiconductor element 4 is determined, the connection portion 5 must be
The maximum number of is determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■Wire bonding takes time. In particular, as the number of connection points increases, bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

In addition, in the connection portion 5 on the semiconductor element 4, since AJZ, which is not alloyed with the ultrafine metal wire 7, is exposed, AJ2
Corrosion is likely to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length l of the inner lead part 17 of the carrier film substrate 16 becomes longer, so the inner lead part 17 is easily deformed. If the inner lead part cannot be connected to the desired connection part 5 or the inner lead part 17
may come into contact with a portion of the semiconductor element 4 other than the connection portion 5 . In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery of the semiconductor element 4, which is subject to design limitations.

■ Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be set to about 0.09 to 0.15 mm. Therefore, as mentioned in Problems of the wire bonding method (■), the number of connections must be increased. It becomes difficult to do so.

(2) Like the wire bonding method, the TAB method also connects in the horizontal direction, so it is difficult to reduce the size in the horizontal direction, and it is not suitable for high-density packaging.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

■In order to connect the connection part 5 of the semiconductor element 4 and the inner lead part 17, it is necessary to attach gold bumps to the connection part 5 of the semiconductor element 4 or the connection part of the inner lead part 17, which increases the cost. .

■The thermal expansion coefficient of the semiconductor element 4 is between resin 20 and resin 21.
Since the coefficient of thermal expansion is different from that of , when heat is applied to the semiconductor device 9 , thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, cracks occur in the semiconductor element 4 or the resin 20 or 21, reducing the reliability of the device. Such a phenomenon becomes remarkable when the size of the semiconductor element 4 is large.

(2) CCB method (2) Solder bumps 31 must be formed at the connection portions 5 of the semiconductor element 4, resulting in high costs.

■If the amount of solder on the bumps is large, a bridge will occur between adjacent solder bumps (a phenomenon in which adjacent solder bumps come into contact with each other), and conversely, if the amount of solder on the bumps is small, the connection between the connection part 5 of the semiconductor element 4 and the circuit board 32 will occur. The connection portion 33 is no longer connected and electrical continuity is no longer established. In other words, the reliability of the connection becomes low.

Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection ("Geometric Optimization").
n ofControlled Co11apse I
“interconnections”.

L, S, Goldman, IBM J, RES
, DEVELOP, 1969°MAY, pp, 2
51-265. “Re1ability of Co.
ntrolledCollapse Inter-co
C. Norris,'
A, 11. l,andzberg, IBM J,
RES, DEVELOP.

1969. MAY, pp25B-271, Technical data of the Brazing Technology Study Group, No. Q17-'84, Published by the Brazing Technology Study Group).

As described above, since the amount of solder bumps affects the reliability of the connection, it is necessary to control the radius of the solder bumps 31.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation of semiconductor elements (Reference material: Electr
onic Packaging Technology
1987.1゜(Vol, 3. No, l) P, 66
~71. NIKKEI MICRO DEVICE51
May 986, P! 17-108), therefore, great efforts are required to improve the heat dissipation characteristics.

(2) Since it is a 5-surface douw mount method in which the connecting portions of the semiconductor element 4 and the connecting portions of the circuit board 32 are connected together, alignment is difficult and the manufacturing equipment is complicated. Furthermore, although the connection is performed by reflowing after mounting, positional deviation may occur during transportation.

■Technique shown in FIGS. 22 and 23 ■Exposed surface '72 of insulating film 71, exposed surface 73 of metal material 70
Alternatively, the exposed surface 72° of the insulating film 71° and the exposed surface 73° of the metal material 70' must be flattened, which increases the number of steps and increases costs.

■ If there is unevenness on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70 or on the exposed surface 72° of the insulating film 71' and the exposed surface 73° of the metal material 70°, the metal material 70 and the metal material 70'
connection will be lost, and reliability will decrease.

■In this method as well, 5urf at, e Dow
Since it is an n-mount method, problems with the CCB method (1) As mentioned above, positioning is difficult and the manufacturing equipment is quite large.

■Technology shown in Fig. 24■ After positioning, when applying pressure to connect the connecting parts 76 and 76', it is difficult to apply constant pressure, which causes variations in the connection state, and as a result, the connecting parts The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor. In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Further, it is not suitable when a large amount of current is desired to flow.

■If the pitch between adjacent connecting parts (distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, making it unsuitable for high-density connections. .

(2) The protrusion of the connecting portion 76, 76' of the circuit board 75, 75°'x Since the resistance value changes due to variations in h, it is necessary to accurately control the amount of variation in h.

■Furthermore, when an anisotropic conductive film is used to connect a semiconductor element and a circuit board, or to connect a first semiconductor element and a second semiconductor element, in addition to the drawbacks of It is necessary to provide a bump at the connection part, which increases the cost.

■Technology shown in Figure 25 ■Pressurization is required, and pressurization is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connecting portion 76 of the first circuit board 75, and the connecting portion 76 of the second circuit board 75°, changes depending on the pressing force and surface condition, so the connection lack of reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
There is a high possibility that the surfaces of the first circuit board 75 and the second circuit board 75° will be damaged. Furthermore, if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection part 76.76' of the circuit board 75.75'
Since the amount of protrusion 52 or the protrusion fflhs of the metal wire 82 of the elastic connector 83 and its dispersion have an influence on resistance change and damage, it is necessary to devise ways to reduce the dispersion.

(2) Furthermore, when an elastic connector is used to connect a semiconductor element and a circuit board or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as (1) to (4) occur.

(The following is a blank space) [Means for solving the problem] The first gist of the present invention is to provide a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder. and an electrical connection member in which one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. and an electric circuit holding member that holds at least one surface of the electric circuit component other than the surface on which the at least one electrical connection portion is present;
at least one electrical circuit component held by the electrical circuit holding member to which one end of at least one of the electrically conductive members exposed on one surface of the holding body is connected; at least one other electrical conductor, to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected. An electric circuit device comprising at least a circuit component and;

A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface, and the other end of the electrically conductive member is exposed on the other surface of the holder; at least one or more electrical connection portions of the electrical circuit component; an electric circuit holding member that holds at least one or more surfaces other than the surface where the
at least one electrical circuit component held by the electrical circuit holding member to which one end of at least one of the electrically conductive members exposed on one surface of the holding body is connected; The other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected to the connecting portion, and the connecting portion is connected to the connecting portion. and at least one or more other electric circuit parts made by metallizing and/or alloying the part and the other end.

A third aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. An electrical connection member that is exposed on one surface, and the other end of the electrically conductive member is exposed on the other surface of the holder; and: at least one electrical connection portion of an electrical circuit component. an electric circuit holding member that holds at least one or more surfaces other than the surface where the
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
the connection is made by metallizing and/or alloying the connection part and the one end; and at least one or more electric circuit components held by the electric circuit holding member; at least one connection part; and in the connection part,
At least one other electrical circuit component to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected.

An electric circuit device comprising at least the following.

A fourth aspect of the present invention is a holder made of an electrically insulating material, and a plurality of electrically conductive members embedded in the holder, wherein one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface of the holder, and the other end of the electrical four-electric member is exposed on the other surface of the holder;

an electric circuit holding member that holds at least one or more surfaces outside the layout where at least one or more electrical connection portions of the electric circuit component exist; having at least one or more connection portions;
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection is made by metallizing and/or alloying the connection part and the one end. At least one or more electric circuit components held by the electric circuit holding member: At least one or more connection part and in the connection part,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connection portion and the other end, and at least one or more other electric circuit components. It's in the device.

The constituent elements of the present invention will be individually explained below.

(Electrical circuit components) Electric circuit components in the present invention include, for example, semiconductor elements such as transistors and ICs, and circuit boards (hereinafter simply referred to as circuit boards) such as resin circuit boards, ceramic boards, metal boards, and silicon boards. ), lead frames, etc.

Note that the electric circuit components held by the electric circuit holding member are
Only one or more than one may exist on one surface of the electric circuit holding member. In addition, the size, shape 5, and type of the electrical circuit components to be held may be arbitrary, but the greater the number of electrical circuit components to be held and the greater the variety of types, the more the The effects of the invention will be significant.

Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, the location of the connection portion does not matter, and the effects of the present invention become more pronounced as the connection portion is located inside the electric circuit component.

Note that the connecting portion is an electrically conductive material.

(Electrical circuit holding member) The material of the electric circuit holding member may be metal, alloy, organic, or inorganic material. Further, the shape and size of the electric circuit holding member may be arbitrary as long as the electric circuit component being held can be uniformly and stably connected to other electric circuit components.

Further, the size, number, and type of electric circuit components held by the electric circuit holding member may be arbitrary, but the greater the number and the more types, the more pronounced the effects of the present invention are. It is.

Examples of the metal or alloy include Ag.

Cu, Au, Aj2. Be, Ca, MglMo.

Fe, Ni, Co, Mn, W, Ti, Pt.

Examples include metals or alloys such as Cr, Pd, Nb, Ta, V, Y, and the like.

Examples of inorganic materials include Si and Ge.

Semiconductors such as GaAs, a-3i, B2O3゜Aj22
03. N a20. 20. Ca O.

ZnO, Bad, PbO, Sb2 03°AS2 0s
, La2 03 , ZrO2, Bad.

P205, Tie, MgO, SiC, B
ed.

BP, BN, AJIN, B4 C, Ta
C, T i B2゜Cr B2 , TtN
, Si3Na, Ta20s.

Examples include ceramics such as CBN and SiO2, diamond, glass, synthetic quartz, carbon, boron, and other inorganic materials.

Further, as the organic material, for example, an insulating resin may be used, and as the resin, any material such as a thermosetting resin, an ultraviolet curing resin, a thermoplastic resin, etc. may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin,
Polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methasilyl resin, chloride vinylidene resin, alkyd resin,
Silicone resins and other resins can be used.

Further, as the electric circuit holding member, it is also possible to combine members having different functions to form a composite. For example, by combining a holding plate and a heat dissipation fin, an electric circuit holding member having a function matching the electric circuit component to be held can be obtained.

(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of electrically conductive members embedded in a holder made of an electrically insulating material. The buried conductive members are electrically insulated from each other.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

Furthermore, the electrical connection member may be made of one layer or may be made of two or more layers.

(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Although metal materials are generally used, materials other than metal materials such as those exhibiting superconductivity may also be used.

Gold is preferred as the material for the metal member, but any metal or alloy other than gold may also be used. For example, Ag, Be, Ca, Mg.

1vlo, Ni, w, Fe, Ti, In, Ta.

Examples include metals or alloys such as Zn, Cu, ALL, Sn, and Pb-3n.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same kind of metal or alloy, or may be made of different kinds of metals or alloys. Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as the material exhibits conductivity.

Furthermore, the cross section of the electrically conductive member can be circular, square, or any other arbitrary shape.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection part of the electric circuit member, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on only one side or on both sides. If it is made to protrude further, it may be made into a bump shape.

Further, the intervals between the electrically conductive members may be the same as the intervals between the connecting parts of the electric circuit components, or may be narrower than the intervals between the connecting parts of the electric circuit components. When the interval is narrow, it becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the electric circuit component and the electrical connection member.

Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more kinds of inorganic materials, metal materials, and alloy materials having a desired shape, such as powder, fibers, etc., may be dispersed and held in the organic material. Furthermore, in the inorganic material, an organic material having a desired shape such as powder, IA fiber, etc., a metallic material,
One or more kinds of alloy materials may be dispersed and retained. In addition, powder,
One or more kinds of inorganic materials or organic materials having a desired shape, such as fibers, may be dispersed and held. In addition, when the holding body is made of a metal material or an alloy material, for example, an electrically insulating material such as resin may be disposed between the electrically conductive member and the holding body.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be a thermosetting resin, an ultraviolet curing resin, or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin, and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. moreover,
If you select a resin that has the same or similar coefficient of thermal expansion as the circuit board, and if there is at least one hole or multiple bubbles in the organic material, thermal expansion and contraction will be reduced. It becomes possible to further prevent a decrease in the reliability of the device due to

Inorganic materials and metal materials include, for example, S i02 ,
B203, AJ2203, Na2o.

K20. Cab, ZnO, Bad, PbO.

S b203, A S203, La203
.

ZrO2, Bad, P20S, TiO2.

MgO, SiC, Bed, BP, BN, AflN.

B4 C, TaC, Ti B2, CrB2, T
iN.

Si3N, ceramics such as Ta205, inorganic materials such as diamond, crow, carbon, boron, Ag,
Cu, Au, An, Be, Ca.

Metals or alloys such as Mg, Mo, Fe, Ni, Si, Co, Mn, and W may be used.

(Connection) The following three configurations can be considered for the connection between the end of the electrical connection member and the connection of the electrical circuit component.

Note that one or more electric circuit components may be connected to one electrical connection member, but at least one of the connected electric circuit components may be connected by the following configuration. It would be good if it was done.

■One end of a plurality of electrically conductive members exposed on one surface of the holder and a plurality of connections of one electric circuit component, and a plurality of electrically conductive members exposed on the other surface of the holder. A configuration in which the other end of the electrically conductive member and the plurality of connection parts of the other electrical circuit component are connected by a method other than metallization and/or alloying described in the following (1) and (2).

■One end of the plurality of electrically conductive members exposed on one surface of the holder and at least one of the plurality of connection parts of one electric circuit component are connected by metallization and/or alloying, and one , the other ends of the plurality of electrically conductive members exposed on the other surface of the holder and the plurality of connection parts of the other electric circuit component are connected by a method other than the above-mentioned metallization and/or alloying. composition.

(1) One end of the plurality of electrically conductive members exposed on one surface of the holder and at least one of the plurality of connection parts of one electric circuit component are connected by metallization and/or alloying, On the other hand, the other ends of the plurality of electrically conductive members exposed on the other surface of the holder and at least one of the plurality of connection parts of the other electric circuit component are metallized and/or
or configurations connected by alloying.

Next, among the above connections, connections by metallization and/or alloying will be described.

When the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the connecting body formed by metallization has the same type of crystal structure as the electrically conductive member or the connecting portion. In addition, as a method of metallization, for example, after bringing an end of an electrically conductive member into contact with a connecting part corresponding to the end,
It may be heated to an appropriate temperature. The heating causes atomic diffusion 1 and the like in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a connection body.

When the electrically conductive member to be connected and the connecting portion are made of different types of pure metals, the formed connecting body is made of an alloy of both metals. As a method of alloying, for example, after bringing an end of an electrically conductive member into contact with a connecting portion corresponding to the end,
It may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact part, and a layer made of a solid solution or an intermetallic compound is formed in the vicinity of the contact part, and this layer becomes a connection body. □ In addition, when Au is used for the metal member of the electrical connection member and AI is used for the connection part of the electric circuit component, the
A heating temperature of 350°C is preferred.

When one of the electrically conductive member and the connecting portion to be connected is made of a pure metal and the other is made of an alloy, or when both are made of the same or different kinds of alloys, the connecting body is made of an alloy.

Regarding a plurality of electrically conductive members in one electrical connection member, when each electrically conductive member is made of the same kind of metal or alloy, when each is made of different kinds of metal or alloy, and furthermore, - The above-mentioned metallization or alloying is carried out in any case where the electrically conductive members are made of the same kind of metals or alloys, different kinds of metals or alloys, or in other cases. On the other hand, the same applies to the connection portion.

Note that the electrically conductive member or the connecting portion may be made of metal or an alloy at the contact portion thereof, and the other portion may be a mixture of metal, glass metal, and resin, for example.

Note that in order to increase the connection strength, it is preferable to reduce the surface roughness of the connected portion (particularly preferably 0.3 μm or less). Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

To perform a connection other than the metallization or alloying described above, for example, the electric circuit component and the electrically conductive member of the electrical connection member may be pressed to connect.

(Holding) Examples of the electric circuit components in the present invention include circuit boards (hereinafter sometimes simply referred to as circuit boards) such as resin circuit boards, ceramic boards, and metal boards, semiconductor elements, and lead frames.

The following methods ■ to ■ can be considered for holding at least one surface of the electric circuit holding member and the electric circuit component other than the surface where the at least one electrical connection part is present, but the holding portion is one of them. It suffices if it is held by at least one of the following methods.

■Retained by curing reaction of organic materials. When using resin as the organic material, the type of resin does not matter. for example,
Either thermosetting resin or ultraviolet curable resin may be used.

■Adhere and hold with adhesive. The type of adhesive does not matter. For example, either an acrylic adhesive or an epoxy adhesive may be used.

(2) Retained by metallization and/or alloying as described above.

(2) The parts to be held are formed from the same material, their surfaces are smoothed and cleaned, and they are bonded together in a vacuum, and held by the atomic force (van der Waals force) of the constituent atoms of the contact parts.

■Hold using methods other than those described in ■ to ■ above. For example, it is held by mechanical fitting or the like.

[Function] In the present invention, as described above, since an electric circuit component and another electric circuit component are connected using the air circuit holding member and the electrical connection member, the connecting portion of the electric circuit component is connected to the outer peripheral part. It is also possible to arrange them internally, which increases the number of connections, which in turn makes it possible to increase the density.

Further, since the number of metal members used for the electrical connection member is small, it is possible to reduce costs even if expensive gold is used as the metal member.

Further, in the present invention, after the electric circuit component is held in the electric circuit holding member, it is connected to other electric circuit components via the electrical connection member, so that the complicated Surface Down Mouth
It is no longer necessary to perform nt positioning for each electric circuit component, and the connection parts of many electric circuit components can be positioned simply by positioning the electric circuit holding member and other electric circuit components, increasing productivity. Significantly improved.

Furthermore, in the present invention, after the electric circuit components are held in the electric circuit holding member, they are positioned and connected to other electric circuit components at once through the electrical connection members, so a wide variety of electric circuit components can be used. Furthermore, since they are connected in a batch process, a wide variety of electrical circuit devices can be produced in the same process.

Furthermore, since the electrical circuit components are held in the electrical circuit holding member, there is no need to use a jig or the like to hold the electrical circuit components during and after the production process of the electrical circuit device. Management during and after fabrication is easy.

Furthermore, by separating the electrical circuit components held by the electrical circuit holding members by function, it is possible to create functional blocks for each electrical circuit holding member holding the electrical circuit components. It becomes possible to produce a variety of electrical circuit devices in the same process.

In addition, in the present invention, when a material with good thermal conductivity is used for the electric circuit holding member and when a material with good thermal conductivity is used for the insulator of the electrically conductive member, This allows the heat to escape to the outside world more quickly, resulting in an electrical circuit device with good heat dissipation. In addition, if the insulator of the electrically conductive member uses a material with a thermal expansion coefficient close to that of the electrical circuit component, and if the electrical circuit holding member uses a material with a thermal expansion coefficient close to that of the electrical circuit component, the thermal expansion The coefficient of thermal expansion approaches the coefficient of thermal expansion of electrical circuit components, and when heat is applied, cracks in electrical circuit components or changes in the characteristics of electrical circuit components occur, a phenomenon that impairs the reliability of electrical circuit devices. A highly reliable electric circuit device can be obtained.

In the present invention, when both electrical circuit components are connected by a connecting body formed by metallization and/or alloying via an electrical connection member, the electrical circuit components are strong (strong in terms of strength). In addition, since the connection is reliable, it is possible to obtain an electrical circuit device that has a small connection resistance value, small variations in connection resistance, is mechanically strong, and has an extremely low defect rate.

In addition, when electrical circuit components are connected by a connecting body formed by metallization and/or alloying through an electrical connection member, the contact resistance between the electrical circuit components increases when the electrical circuit components are connected. is smaller than .

On the other hand, if electrical circuit components or other electrical circuit components are connected by a connection other than metallization and/or alloying, it is possible to prevent the electrical circuit components from deteriorating due to heat that occurs during metallization and/or alloying. . Additionally, depending on the application, it may be desirable to make electrical circuit components removable, and in such cases, this request can be met by connecting the electrical circuit components other than by metallization and/or alloying. It becomes possible.

(Margin below) [Example 1 (First Example) A first example of the present invention will be described based on FIGS. 1(a) and (b) and FIGS. 2(a) to (C).

In the cross-sectional view of FIG. 1(a), an electric circuit holding member 201 holding a plurality of semiconductor elements 101, which are electric circuit components,
This shows a state in which the electrical connection member 125 and the circuit board 104, which is another electrical circuit component, are not connected. The number of semiconductor elements 101 may be any number as long as it is one or more.

The electrical connection member 125 includes a holder 1 made of an organic material.
A metal member 107 that is an electrically conductive member is embedded in the holder 11, one end of the metal member 107 is exposed on one side of the holder 111, and the other end of the metal member 107 is exposed on the other side of the holder 111. exposed on the surface.

The electric circuit holding member 201 is a glass substrate, and holds at least one surface of the semiconductor element 101 other than the surface where the at least one connecting portion 102 is present by adhesive.

The semiconductor element 101 has a connection part 102, and the connection part 102
, it is alloyed and connected to one end of the metal member 107 exposed on one surface of the holder 111.

The circuit board 104 has a connecting portion 105, and at the connecting portion 105, the holder 11! It is alloyed and connected to the other end of the metal member 107 exposed on the other surface of the metal member 107 .

FIG. 1(b) is a cross-sectional view of the entire structure integrated by the above connections.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

A manufacturing example is shown in FIGS. 2(a) to 2(C).

First, as shown in FIG. 2(a), metal wires 121 made of metal or alloy such as gold and having a diameter of 20 μm are wired at a pitch of 40 μm.
After winding, the metal wire 121 is embedded in a resin 123 such as polyimide. After embedding, the resin 123 is cured. Hardened resin 1
23 is an insulator. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIG.
) and (c).

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the semiconductor element 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 to the semiconductor element 101 and the circuit board 104, respectively.

Next, as shown in FIG. 1(a), a glass substrate 201,
Semiconductor element 101, electrical connection member 125, circuit board 1
Prepare 04. The semiconductor element 101 and circuit board 104 used in this example have a large number of connection parts 102 and 10 inside.
5.

A connecting portion 102 of a semiconductor element 101 is formed on a glass substrate 201.
The semiconductor 101 is positioned so that the positional relationship between the semiconductor 101 and the connecting portion 105 of the circuit board 104 is the same as that at the time of connection, and is held on the glass substrate 201 with an adhesive. Glass substrate 201
After holding all the semiconductors 101 scheduled to be connected, the glass substrate 201 is inverted or the circuit board 104 is inverted so that the connection part 102 of the semiconductor 101 and the connection part 105 of the circuit board 104 face each other, and An electrical connection member 125 is inserted between them (FIG. 1(a)).

First, positioning is performed so that the connection portion 105 of the circuit board 104 and the connection portion 109 of the electrical connection member 125 correspond to each other, and then the glass substrate 201 and the circuit board 104 are positioned. Then, since the connecting portion 102 of the semiconductor element 101 held on the glass substrate 201 was positioned and held so that the positional relationship was equal to that of the connecting portion 105 of the circuit board 104, the connecting portion 102 of the semiconductor element 101 held on the glass substrate 201 was inevitably held. 1
05 position, that is, the connection part 1 of the electrical connection member 125
It matches the position of 08.

Therefore, connection is possible, and Afi of the connection part 102 of the semiconductor element 101 and the connection part 108 of the electrical connection member 125 are connected.
and Au of the connection part 105 of the circuit board 104.
Both u and Au of the connection part 109 of the electrical connection member 125 are connected by metal and/or alloying (see FIG. 1(b)
)).

Here, there are the following three methods for connecting the semiconductor element 101, the electrical connection member 125, and the circuit board 104 using metal and/or alloying, and any of these methods may be used.

■Glass substrate 201. ' After positioning the electrical connection member 125 and the circuit board +04, the connection part between the connection part 102 of the semiconductor element 101 and the electrical connection member 125! 08, and the connection portion 105 of the circuit board 104 and the electrical connection member 12.
Method 7 of connecting the connecting portion 109 of No. 5 by metallizing and/or alloying at the same time.

■ After positioning the glass substrate 201 and the electrical connection member 125 and alloying and connecting the connection part 102 of the semiconductor element 101 and the connection part 108 of the electrical connection member 125, the circuit board 104 is positioned and the electrical connection is made. A method of connecting the connecting portion 109 of the member 125 and the connecting portion 105 of the circuit board 104 by metallizing and/or alloying them (FIGS. 3(a) to 3(d))
).

■Position the circuit board 104 and the electrical connection member 125, and
After metallizing and/or alloying and connecting the connecting portion 109 of the electrical connection member 125 and the connecting portion 102 of the semiconductor element 101, the glass substrate 201 is positioned, and the connecting portion 108 of the electrical connecting member 125 and the connecting portion 102 of the semiconductor element 101 are metallized and/or alloyed. 4 (a) to (b)).

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Second example) A second embodiment is shown in FIGS. 5(a) to 5(d).

After positioning the connecting portions 102 of the individual semiconductor elements 101 and the connecting portions 108 of the individual electrical connecting members 125, they are metallized and/or alloyed and connected.

Note that as the electrical connection member 125, one having dimensions corresponding to the semiconductor element 4 was used.

Next, after positioning the semiconductor element 101 connected to the electrical connection member 125 so that the positional relationship between the connection part 109 and the connection part 105 of the circuit board 104 is equal, the semiconductor element 101 is held on the glass substrate 201 with an adhesive ( Figure 5(b)).

Next, the glass substrate 201 is reversed, and the electrical connection member 1
Connection part 109 of No. 25 and connection part of circuit board 104! 05 to face each other, and position the glass substrate 201 and the circuit board 104 (FIG. 5(C)). Then, in the present invention, the connection part 109 of the electrical connection member 125 and the connection part 105 of the circuit board 104 are necessarily positioned,
The connection becomes possible, metallized and/or alloyed, and connected (FIG. 5(d)).

Further, as shown in FIGS. 6(a) and 6(b), the circuit board 1
The electrical connection member 125 having dimensions corresponding to the semiconductor element 101 to be connected to the connection portion 1 of the electrical connection member 125 is
09 and the connecting portion 105 of the circuit board 104 are positioned, metallized and/or alloyed, and connected (see FIG. 6(a)
)). After that, the glass substrate 201 and the circuit board 104 are positioned, and the connection portion of the semiconductor element 101 held on the glass substrate 201 and the connection portion 108 of the electrical connection member 125 are metallized and/or alloyed to connect them. (6th
Figure (b)).

In this example as well, the connection portions were connected with high reliability.

(Third example) A third embodiment is shown in FIGS. 7(a) and 7(b).

Reference numeral 202 denotes an electric circuit holding member made of a ceramic substrate in which a portion for holding the semiconductor element 101 is processed into a concave shape. After positioning the semiconductor element 101 in the concave part of the ceramic substrate 202 so that the positional relationship between the connection part 102 and the connection part of the circuit board 104 is equal, the periphery is also held with resin 203. After that, the ceramic substrate 202 is reversed so that the connection part 102 of the semiconductor element 101 and the connection part 105 of the circuit board 104 are opposed to each other,
And an electrical connection member 125 is inserted between them (FIG. 7(a)).

After that, first, the connection portion of the circuit board 104 and the connection portion 109 of the electrical connection member 125 are positioned, then the ceramic substrate 202 and the circuit board 104 are positioned, and the connection portion 102 of the semiconductor element 101 and the connection portion 109 of the electrical connection member 125 are positioned. target connecting member 125
The connection portion 108 of the circuit board 104, the connection portion 105 of the circuit board 104, and the connection portion 109 of the electrical connection member 125 are both connected by metallization and/or alloying (FIG. 7(b)).

Furthermore, as shown in FIG. 8, the ceramic substrate 202 can hold any semiconductor element by making the concave shape match the semiconductor elements 101-a to 101-d to be held.

By matching the shape of the electric circuit holding member to the shape of the electric circuit component to be held as in this embodiment, high-density mounting can be freely performed and the degree of freedom in design is greatly expanded.

In addition, since the semiconductor element, which is an electric circuit component, is held on all surfaces outside the layout where the connection portion exists, the heat dissipation characteristics are extremely good.

Furthermore, in this example as well, the connection portions were connected with high reliability.

(Fourth example) A fourth embodiment is shown in FIGS. 9(a) to 9(d).

205 is a glass substrate for temporarily fixing the semiconductor element 101 and the outer frame 206. First, the outer frame 206 is temporarily fixed onto the glass substrate 205 using an adhesive.

Next, the semiconductor element 101 is connected to the connection portion 102 and the circuit board 10.
After positioning the semiconductor element 101 so that the positional relationship with the connection part 4 is equal, the semiconductor element 101 is temporarily fixed to the glass substrate 104 with an adhesive (FIG. 9(a)).

Thereafter, resin is injected into the portion surrounded by the outer frame 20B to hold the semiconductor element 101. After the resin has hardened, the glass substrate 205 is removed (FIG. 9(b)).

Invert the electric circuit holding member manufactured in this way,
The connecting portion 102 of the semiconductor element 101 and the connecting portion 105 of the circuit board 104 are arranged so as to face each other, and the electrical connecting member 125 is inserted between them (FIG. 9C). Connection part 1 between 109 and circuit board 104
05, then the electric circuit holding member 208 and the circuit board 104 are positioned, and the connecting portion 102 of the semiconductor element 101 and the connecting portion 108 of the electrical connecting member 125, and the connecting portion 105 of the circuit board 104 and the electric Both of the target connecting member 125 and the connecting portion 109 are connected by metallization and/or alloying (FIG. 9(d)).

In this embodiment, by holding the semiconductor element, which is an electric circuit component, from the lateral direction, it is possible to reduce the thickness of the semiconductor element.

Further, in this example as well, the connection portions were connected with high reliability.

(Fifth example) A fifth embodiment is shown in FIGS. 10(a) and 10(b).

A semiconductor element 101 held on a glass substrate 201 is connected to the circuit board 104 via an electrical connection member 125, and is further held on the glass substrate 201° by a similar method to this circuit board 104. Semiconductor element 101
Connect °.

In this embodiment, a glass substrate 20 which is an electric circuit holding member is used.
By dividing the semiconductor elements 101 and 101', which are electric circuit components held at 1,201 degrees, by function, unitization is achieved, and different types can be produced in the same process.

Further, as shown in FIGS. 11(a) and 11(b), it is also possible to form a relief in the shape of the electric circuit holding member 201° and connect it to the same circuit board.

Further, as shown in FIGS. 12(a) and 12(b), electric circuit holding members 201° and 201° are provided on both sides of the circuit board 104.
It is also possible to connect the semiconductor elements 101° to 101° by using.

In this example as well, the connection portions were connected with high reliability.

(6th example) A sixth embodiment is shown in FIGS. 13(a) and 13(b).

Semiconductor element 101.10 held on glass substrate 201
After aligning the connecting portion of the other semiconductor element 208 other than 1° and the connecting portion of the electrical connecting member 125, they are connected by metallization and/or alloying, and the other semiconductor element 208 is connected to the circuit board. 104 by metallization and/or alloying.

Next, the connection portion 102 of the semiconductor element 101, 101° and the connection portion 108 of the electrical connection member 125 connected on the other semiconductor element 208 connected to the circuit board 104.
The semiconductor element 101° and the semiconductor element 101° are held on the glass substrate 201 by an adhesive, with the semiconductor element 101° being positioned so as to have the same positional relationship with the glass substrate 201. Then, the glass substrate 201 is inverted, and the semiconductor element 101 is arranged so that the connection part 102 of the 101° and the connection part 108 of the electrical connection member 125 face each other,
After positioning the glass substrate 201 and the circuit board 104, they are connected by metallization and/or alloying.

According to this example, it became possible to easily connect another semiconductor element onto the semiconductor element, and the connection portion was also connected with high reliability.

(Seventh Example) A seventh embodiment is shown in FIGS. 14(a) and 14(b).

The seventh embodiment is an example in which a semiconductor element 101 and a circuit board 104 whose portions other than the connecting portions are completely covered with mfIIA 103° 106 are used as electric circuit components and other electric circuit components.

Further, FIG. 15(a) shows an electrical connection member.

The material shown in (b) was used. 15(a) is a perspective view, and FIG. 15(b) is a sectional view. Figure 15(a),
As shown in (b), in the electrical connection member 125, the exposed portion of the metal member 107 is connected to the holder (resin insulator) 1.
It protrudes from the 11th side. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
Prepare the electrical connection member shown in (c). Next, both surfaces of this electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 μm. Note that in this embodiment, the amount of protrusion of the metal wire 121 is set to 10.
Although it is expressed as μm, any amount may be used. In addition, the metal wire 12
The method for protruding 1 is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIGS. 16(a) and 16(b) may be formed by inserting the concave portion into a mold at the position shown in FIG. 16 and crushing the protrusion 126 of the metal wire 121. In this case, the metal wire 121 tends to fall off from the insulator 111.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection was sold with high reliability.

(Eighth example) An eighth embodiment is shown in FIGS. 17(a) and 17(b).

In this example, the electrical connection member 125 is different from the electrical connection member shown in the seventh embodiment. In the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the seventh example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the connecting portions of the semiconductor element.

That is, in the seventh embodiment, since the connection position of the electrical connection member 125 was arranged at the connection position between the semiconductor element 101 and the circuit board 104, it was necessary to position the electrical connection member 125, but in this example, Although it is necessary to position the semiconductor element 101 and the circuit board 104, the electrical connection member 1
Positioning with 25 becomes unnecessary. Therefore, the connection dimension (dz) between the semiconductor element 101 and the circuit board 104.

Pl,) and the connection dimension of the electrical connection member (d12°P12
) It is also possible to connect without positioning by selecting an appropriate value.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections can be obtained when connecting semiconductor elements and electrical circuit components such as circuit boards and lead frames.

Therefore, the conventionally used wire bonding method,
It becomes possible to replace the TAB method and CCB method.

2. According to the present invention, the connection part of the electric circuit component can be placed in any position (especially inside), so it is possible to connect more points than the wire bonding method or the TAB method, and it is suitable for connection with a large number of pins. This is the method. Roughly speaking, since there is an insulating material between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect more points than the CCB method. becomes.

3. Since the amount of the gold R member used in the gas connection member is tiny compared to the conventional one, even if an expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. Electric circuit devices such as high-density semiconductor devices can be obtained.

5. Since the electrical circuit components are connected after being held in the electrical circuit holding member, connections can be made regardless of the size, shape, or type of the electrical circuit components, allowing for flexible high-density mounting.
Therefore, the degree of freedom in design is greatly improved.

6. By dividing the electrical circuit components held by the electrical circuit holding member into functional blocks by function, a wide variety of electrical circuit devices can be obtained in the same process, and versatility is greatly improved.

7. Since connections can be made in batch processing, the more the number of connection points increases, the faster and more reliable connections can be obtained.

8. In claim 2 or claim 3, since the electrical circuit components or other electrical circuit components are connected by other than connection by metallization and/or alloying, the electricity generated during metallization and/or alloying is Deterioration of circuit components due to heat can be prevented. Additionally, depending on the application, it may be desirable to make electrical circuit components removable, and in such cases, this request can be met by connecting the electrical circuit components other than by metallization and/or alloying. It becomes possible.

9. In claim 4, both of the electrical circuit components are connected via the electrical connection member and the connection body formed by metallization and/or alloying, so that the electrical circuit components are firmly connected to each other. Since the connection is strong and reliable, it is possible to obtain an electrical circuit device that is mechanically strong and has an extremely low defective rate.

The holder of the electrical connection member may be made of one or more types of metal or inorganic materials having a desired shape and good thermal conductivity dispersed in an insulator, such as powder or fiber, or When a conductive member is made of a metal material or an inorganic material that has been treated to be insulated, heat generated from the electrical circuit component can be radiated to the outside via the electrical connection member or other electrical circuit components. , an electric circuit device with good heat dissipation properties can be obtained.

In addition, when the electric circuit holding member is made of a metal material or an inorganic material with good thermal conductivity, the heat generated from the electric circuit component can also be radiated to the outside through the electric circuit holding member. , an electric circuit device with extremely good heat dissipation can be obtained.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are cross-sectional views showing the first embodiment before and after connection, and FIGS. 2(a) to (C) are one of the electrical connection members used in the first embodiment. 3(a) to 3(d) are sectional views and perspective views illustrating an example of the manufacturing method. FIGS. 4(a) and 4(b) are cross-sectional views illustrating an example of the method (3) of metallizing and/or alloying shown in the first embodiment. FIGS. 5(a) and 5(b) are cross-sectional views showing before and after the individual semiconductor elements of the second embodiment are held in an electric circuit holding member after connecting the electrical connection members, and FIG. 5(C) , (d) are cross-sectional views showing before and after connection using the electrical circuit holding member of the second embodiment, and FIGS. 6(a) and (b) are electrical diagrams for each semiconductor element of the second embodiment. FIG. 3 is a cross-sectional view showing before and after connecting the electrical connection member to the circuit board and connecting it to the semiconductor element using the electric circuit holding member. 7(a) and 7(b) are sectional views showing the third embodiment before and after connection, and FIG. 8 is a sectional view showing the third embodiment after connection. FIG. 9(a) is a cross-sectional view showing the state temporarily fixed to the patch plate of the fourth embodiment, FIG. 9(b) is a cross-sectional view showing the state held by the resin of the fourth embodiment, and FIG. Figures (c) and (d) are cross-sectional views showing the fourth embodiment before and after connection. 10(a) and (b) are cross-sectional views showing before and after the second connection of the fifth embodiment is made; FIG. 11(a)
, (b) are cross-sectional views showing before and after the second connection of the fifth embodiment, and FIGS. 12(a) and (b) are cross-sectional views of the fifth embodiment.
FIG. 7 is a cross-sectional view showing before and after the second connection of the embodiment. FIGS. 13(a) and 13(b) are cross-sectional views showing the sixth embodiment before and after connection. 14(a) and 14(b) are sectional views showing the state before and after connection of the seventh embodiment, and FIGS. 15 and 16 also show the seventh embodiment, and FIG. a) and Figure 16(a)
is a perspective view, and FIG. 15(b) and FIG. 16(b) are sectional views. FIG. 17 is a sectional view showing the eighth embodiment, and FIG.
17(a) shows the state before connection, and FIG. 17(b) shows the state after connection. 18 to 25 show a conventional example, except for FIG. 19, which is a sectional view, and FIG. 19 is a plan perspective view. 1.55...Lead frame, 2...Element mounting part of lead frame, 3...Silver paste, 4.4°...
Semiconductor element, 5.5°... Connection part of semiconductor element, 6.
...Lead frame connection part, 7...Superfine metal wire, 8
゜20.123,203... Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Peripheral edge of element mounting portion of lead frame, 16... Carrier film Substrate, 17... Inner lead portion of carrier film substrate, 31... Solder bump, 32°51.
75,75°...Circuit board, 33,52°76.76
'... Connection portion of circuit board, 54... Connection portion of electrical connection member, 63... Sealing material, 70.70'... Metal material, 71.71', 103, 106...・Insulating film, 72
．． 72'...Exposed surface of insulating film, 73°73'...
Exposed surface of metal material, 77... Insulating material of anisotropic conductive film,
78... Anisotropic conductive film, 79... Conductive particles, 81.
...Insulating material of elastic connector, 82...Metal wire of elastic connector, 83...Elastic connector, 101, 101'...Electrical circuit parts (semiconductor element, circuit board), 102゜105.108,109・
... Connection portion, 104 ... Other electric circuit components (circuit board), 107 ... Electrically conductive member (metal member), 111
... Holder (insulator), 121 ... Metal wire, 122
... Bar, 124 ... Dotted line, 125 ... Electrical connection member, 204 ... Electric circuit holding member, 126 ... Protrusion, 201, 201° ... Electric circuit holding member (glass substrate) , 202... Electric circuit holding member (ceramic substrate), 205... Backing plate (glass plate), 206...
Outer frame, 207... Electric circuit holding member (resin), 208
...Other semiconductor elements. Figure 14 (0) Figure 14 (b) Figure 15 (a) Figure 15 (b) Figure 16 (a) Figure 16 (b) Figure 17 (o) Figure 17 (b) Figure 18 Figure 19 Figure 20 3131.5:5 Figure 22 Figure 24 Figure 25

Claims (4)

[Claims] (1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member in which the other end of the electrically conductive member is exposed on the other surface of the holder; an electric circuit holding member that holds at least one surface; has at least one connection portion;
at least one electrical circuit component held by the electrical circuit holding member to which one end of at least one of the electrically conductive members exposed on one surface of the holding body is connected; at least one other electrical conductor, to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected. An electric circuit device comprising at least a circuit component and; (2) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member in which the other end of the electrically conductive member is exposed on the other surface of the holder; an electric circuit holding member that holds at least one surface; has at least one connection portion;
at least one electrical circuit component held by the electrical circuit holding member to which one end of at least one of the electrically conductive members exposed on one surface of the holding body is connected; The other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected to the connecting portion, and the connecting portion is connected to the connecting portion. and at least one or more other electric circuit parts made by metallizing and/or alloying the part and the other end. (3) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member having the other end of the electrically conductive member exposed on the other surface of the holder. an electric circuit holding member that holds at least one surface of the electric circuit component other than the surface on which the at least one electrical connection portion is present;
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
the connection is made by metallizing and/or alloying the connection part and the one end; and at least one or more electric circuit components held by the electric circuit holding member; at least one connection part; and in the connection part,
The other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected to at least one or more other electrical circuit components. electrical circuit equipment. (4) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member in which the other end of the electrically conductive member is exposed on the other surface of the holder; an electric circuit holding member that holds at least one surface; has at least one connection portion;
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
the connection is made by metallizing and/or alloying the connection part and the one end; and at least one or more electric circuit components held by the electric circuit holding member; at least one connection part; and in the connection part,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connection portion and the other end, and at least one other electric circuit component; Device.