JPH01302834A - Manufacture of electrically connected member and electrical circuit member - Google Patents

Manufacture of electrically connected member and electrical circuit member

Info

Publication number
JPH01302834A
JPH01302834A JP63133403A JP13340388A JPH01302834A JP H01302834 A JPH01302834 A JP H01302834A JP 63133403 A JP63133403 A JP 63133403A JP 13340388 A JP13340388 A JP 13340388A JP H01302834 A JPH01302834 A JP H01302834A
Authority
JP
Japan
Prior art keywords
electrical connection
metal
holder
electric circuit
connection member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63133403A
Other languages
Japanese (ja)
Inventor
Tetsuo Yoshizawa
吉沢 徹夫
Hiroshi Kondo
浩史 近藤
Takashi Sakaki
隆 榊
Masaaki Imaizumi
昌明 今泉
Hideyuki Nishida
秀之 西田
Yasuteru Ichida
市田 安照
Masaki Konishi
小西 正暉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63133403A priority Critical patent/JPH01302834A/en
Priority to EP89108882A priority patent/EP0355273B1/en
Priority to DE68917231T priority patent/DE68917231T2/en
Publication of JPH01302834A publication Critical patent/JPH01302834A/en
Priority to US08/620,393 priority patent/US5606263A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/83886Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To enable the number of connection parts at the edge part of electrical circuit parts to be increased so as to obtain an electrically connected member to be used for an electrical circuit member facilitating high density and cost reduction by connecting two or more specific electrical connection members and by connecting one or both connection parts of the metal member or wiring pattern together by metallizing and/or formation of alloy. CONSTITUTION:This member has a retainer 111 consisting of insulating materials and a plurality of metal members 107 embedded into retainer 111 and electrically connected members 125 and 128 which have one wiring pattern 300 of two or more electrically connected members 125 and 128 where one edge of the metal member 107 is exposed on one surface of the retainer 111 and the other edge of the metal member 107 is exposed on one surface of the retainer 111 are laminated. Then, one or more connection parts of either or both of the metal member 107 or the wiring pattern 300 of the electrically connected member 125 and one or more connection parts of one or both of the metal member 107 or wiring pattern 300 of the other electrically connected member 128 are connected by metallizing and/or formation of alloy to produce and electrically connected member.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、電気的接続部材の製造方法および電気回路部
材に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an electrical connection member and an electrical circuit member.

[従来技術] 従来、電気回路部品同士を電気的に接続して構成される
電気回路部材に関する技術としては以下に述べる技術が
知られている。
[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■ワイヤボンディング方法 第9図および第10図はワイヤボンディング方法によっ
て接続され、封止された半導体装置の代表例を示してお
り、以下、第9図および第10図に基づきワイヤボンデ
ィング方法を説明する。
■Wire bonding method Figures 9 and 10 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on Figures 9 and 10. .

この方法は、Agペースト3等を用いて半導体素子4を
素子搭載部2に固定支持し、次いで、半導体素子4の接
続部5と、リードフレーム1の所望の接続部6とを金等
の極細金属線7を用いて電気的に接続部する方法である
In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of making electrical connections using metal wires 7.

接続後は、トランスファーモールド法等の方法でエポキ
シ樹脂等の熱硬化性樹脂である樹脂8を用いて半導体素
子4とリードフレーム1を封止し、その後、樹脂封止部
品から外に伸びたリードフレーム1の不要部分を切断し
、所望の形に曲げ半導体装置9を作る。
After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as epoxy resin by a method such as transfer molding, and then the leads extending outward from the resin-sealed parts are sealed. A semiconductor device 9 is made by cutting unnecessary parts of the frame 1 and bending them into a desired shape.

■T A B (Tape Automated Bo
nding )法(例えば、特開昭59−139636
号公報)第11図はTAB法により接続され封止された
半導体装置の代表例を示す。
■T A B (Tape Automated Bo
nding) method (for example, Japanese Patent Application Laid-Open No. 139636-1983)
11 shows a typical example of a semiconductor device connected and sealed by the TAB method.

この方法は、テープキャリア方式による自動ボンディン
グ法である。すなわち、第11図に基づいて説明すると
、キャリアフィルム基板16と半導体素子4とを位置決
めした後、キャリアフィルム基板16のインナーリード
部17と半導体素子4の接続部5とを熱圧着することに
より接続する方法である。接続後は、エポキシ樹脂等の
熱硬化性樹脂である樹脂20乃至樹脂21で封止し半導
体装置9とする。
This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 11, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead portion 17 of the carrier film substrate 16 and the connecting portion 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resin 20 and resin 21, which are thermosetting resins such as epoxy resin.

■CCB (Controlled Co11apse
 Bonding )法(例えば、特公昭42−209
6号公報、特開昭60−57944号公報) 第12図はCCB法によって接続され封止された半導体
装置の代表例を示す。この方法を第16図に基づき説明
する。なお、本方法はフリップチップボンディング法と
も言われている。
■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 12 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 16. Note that this method is also called a flip chip bonding method.

半導体素子4の接続部5に予め半田バンブ31を設け、
半田バンブ31が設けられた半導体素子4を回路基板3
2上に位置決めして搭載する。
A solder bump 31 is provided in advance on the connection portion 5 of the semiconductor element 4,
The semiconductor element 4 provided with the solder bumps 31 is mounted on the circuit board 3.
Position and mount it on 2.

その後、半田を加熱溶解することにより回路基板32と
半導体素子4とを接続させ、フラックス洗浄後封止して
半導体装置9を作る。
Thereafter, the circuit board 32 and the semiconductor element 4 are connected by heating and melting the solder, and after cleaning with flux, the semiconductor device 9 is sealed.

■第13図および第14図に示す方法 すなわち、第1の半導体素子4の接続部5以外の部分に
ポリイミド等よりなる絶縁膜71を形成せしめ、接続部
5にはAu等よりなる金属材70を設け、次いで、金属
材70および絶縁膜71の露出面73.72を平らにす
る。一方、第2の半導体素子4°の接続部5°以外の部
分にポリイミド等よりなる絶縁膜71゛を形成し、接続
部5′にはAu等よりなる金属材70°を設け、次いで
、金属材70°および絶X1li!71°の露出面73
’ 、72°を平坦にする。
■The method shown in FIGS. 13 and 14, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 71 made of Au or the like is formed on the connection portion 5. , and then the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion of the second semiconductor element 4' other than the connecting part 5', and a metal material 70' made of Au or the like is provided at the connecting part 5'. Material 70° and absolute X1li! 71° exposed surface 73
' , flatten 72°.

しかる後、第14図に示すように第1の半導体素子4と
第2の半導体素子4°とを位置決めし、位置決め後、熱
圧着することにより第1の半導体素子4の接続部5と第
2の半導体素子4゛の接続部5゛を、金属材70.70
’ を介して接続する。
Thereafter, as shown in FIG. 14, the first semiconductor element 4 and the second semiconductor element 4 degrees are positioned, and after positioning, the connection part 5 of the first semiconductor element 4 and the second The connecting portion 5'' of the semiconductor element 4'' is made of a metal material 70.70 mm.
' to connect via.

■第15図に示す方法 すなわち、第1の回路基材75と第2の回路基材75′
の間に、絶縁物質77中に導電粒子79を分散させた異
方性導電膜78を介在させ、第1の回路基材75と第2
の回路基材75′を位置決めしたのち、加圧もしくは、
加圧・加熱し、第1の回路基材75の接続部76と第2
の回路基材75°の接続部76″を接続する方法である
■The method shown in FIG. 15, that is, the first circuit substrate 75 and the second circuit substrate 75'
An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit base material 75 and the second circuit base material 75.
After positioning the circuit board 75', pressurize or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting the connecting portion 76'' of the circuit board at 75°.

■第16図″に示す方法 すなわち、第1の回路基材75と第2の回路基材75°
の間に、Fe、Cu等よりなる金属線82が一定方向に
向けて配されいる絶縁物質81からなるエラスチックコ
ネクター83を介在させ、第1の回路基材75と第2の
回路基材75′を位置決めした後加圧し、第1の回路基
材75の接続部76と第2の回路基材75′の接続部7
6°を接続する方法である。
■The method shown in FIG. 16″, that is, the first circuit substrate 75 and the second circuit substrate
An elastic connector 83 made of an insulating material 81 in which metal wires 82 made of Fe, Cu, etc. are arranged in a certain direction is interposed between the first circuit base material 75 and the second circuit base material 75'. After positioning, pressure is applied to connect the connecting portion 76 of the first circuit substrate 75 and the connecting portion 7 of the second circuit substrate 75'.
This is a method of connecting 6 degrees.

[発明が解決しようとする問題点コ ところで上記した従来のボンディング法には次のような
問題点がある。
[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

■ワイヤボンディング法 ■半導体素子4の接続部5を半導体素子4の内部にくる
ように設計すると、極細金属線7は、その線径が極めて
小さいために、半導体素子4の外周縁部10あるいはリ
ードフレーム1の素子搭載部2の外周縁部11に接触し
易くなる。極細金属線7がこれら外周縁部10乃至11
に接触すると短絡する。さらに、極細金属線7の長さを
長くせざるを得す、長さを長くすると、トランスファー
モールド成形時に極細金属線7が変形しやすくなる。
■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame 1. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and if the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

従)て、半導体素子4の接続部5は半導体装置4上の周
辺に配置する必要が生じ、回路設計上の制限を受けざる
を得なくなる。
Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor device 4, which imposes restrictions on circuit design.

■ワイヤボンディング法においては、隣接する極細金属
線7同士の接触等を避けるためには半導体素子4上の接
続部5のピッチ寸法(隣接する接続部の中心間の距m)
としである程度の間隔をとらざるを得ない。従って、半
導体素子4の大きさが決まれば必然的に接続部5の最大
数が決まる。
■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (distance between the centers of adjacent connecting parts)
We have no choice but to maintain a certain amount of distance between each other. Therefore, once the size of the semiconductor element 4 is determined, the maximum number of connection portions 5 is necessarily determined.

しかるに、ワイヤボンディング法では、このピッチ寸法
が通常0.2mm程度と大きいので、接続部5の数は少
なくせざるを得なくなる。
However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■半導体素子4上の接続部5から測った極細金属線7の
高さhは通常0.2〜0.4mmであるが、0.2mm
以下にし薄型化することは比較的困難であるので薄型化
を図れない。
■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■ワイヤボンディング作業に時間がかかる。特に接続点
数が多くなるとボンディング時間が長くなり生産効率が
悪くなる。
■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

■何らかの要因でトランスファーモールド条件範囲を越
すと、極細金属線7が変形したり最悪の場合には切断し
たりする。
- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

また、半導体素子4上の接続部5においては、極細金属
線7と合金化されないA1が露出しているためA℃腐食
が生じ易くなり、信頼性の低下が生じる。
Further, in the connection portion 5 on the semiconductor element 4, since A1 that is not alloyed with the ultrafine metal wire 7 is exposed, A° C. corrosion is likely to occur, resulting in a decrease in reliability.

■高圧で樹脂8を注入すると、極細金属線7の変形、切
断が生じるため、高圧で注入する必要がある熱可塑性樹
脂は使用できなく、樹脂に制約を受ける。
(2) If the resin 8 is injected at high pressure, the ultrafine metal wire 7 will be deformed or cut, so thermoplastic resins that need to be injected at high pressure cannot be used, and there are restrictions on the resin.

■TAB法 ■半導体素子4の接続部5を半導体素子4の内側にくる
ように設計すると、キャリアフィルム基板16のインナ
ーリード部17の長さ1が長くなるため、インナーリー
ド部17が変形し易くなりインナーリード部を所望の接
続部5に接続できなかったり、インナーリード部17が
半導体素子4の接続部5以外の部分に接触したりする。
■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length 1 of the inner lead part 17 of the carrier film substrate 16 becomes longer, so the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

これを避けるためには半導体素子4の接続部5を半導体
素子4上の周辺に持ってくる必要が生じ、設計上の制限
を受ける。
In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■TAB法においても、半導体素子4上の接続部のピッ
チ寸法は0.09〜0.15mm程度にとる必要があり
、従ってワイヤボンディング法の問題点■で述べたと同
様に、接続部数を増加させることはむずかしくなる。
■ In the TAB method as well, the pitch dimension of the connecting parts on the semiconductor element 4 must be set to about 0.09 to 0.15 mm, and therefore, as mentioned in the problem of the wire bonding method (■), the number of connected parts must be increased. Things become difficult.

■キャリアフィルム基板16のインナーリード部17が
半導体素子4の接続部5以外の部分に接触しないように
させるためには、そのためのインナーリード部17の接
続形状が要求されるためコスト高となる。
(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with parts other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

■半導体素子4の接続部5とインナーリード部17とを
接続するためには、半導体素子4の接続部5またはイン
ナーリード部17の接続部に金バンブをつけなければな
らずコスト高になる。
(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, a gold bump must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■半導体素子4の熱膨張係数が、樹脂20乃至樹脂21
の熱膨張係数と異なるため、半導体装置9に熱が加わっ
た場合、熱応力が発生し、半導体素子4の特性劣化を生
じる。さらには半導体素子4または樹脂20乃至樹脂2
1に割れが生じ、装置の信頼性が低下する。かかる現象
は半導体素子4の大きさが大きい場合顕著となる。
■The thermal expansion coefficient of the semiconductor element 4 is between resin 20 and resin 21.
Since the coefficient of thermal expansion is different from that of , when heat is applied to the semiconductor device 9 , thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, the semiconductor element 4 or the resin 20 or the resin 2
1 will crack, reducing the reliability of the device. This phenomenon becomes remarkable when the size of the semiconductor element 4 is large.

■CCB法 ■半導体素子4の接続部5に半田Rンブ31を形成させ
なければならないためコスト高になる。
(2) CCB method (2) Solder grooves 31 must be formed on the connecting portions 5 of the semiconductor element 4, resulting in high costs.

■バンブの半田量が多いと隣接、する半田Rノブ間にブ
リッジ(隣接する半田バンブ同士が接触する現象)が生
じ、逆にバンブの半田量が少なし\と半導体素子4の接
続部5と基板32の接続部33が接続しなくなり電気的
導通がとれなくなる。すなわち、接続の信頼性がイにく
なる。さらに、半田量、接続の半田形状が接続の信頼性
に影響する(”Geometric  Optimiz
ation  of  (:ontrolledCol
lapse  Interconnections’、
  L、S、Goldman。
■If there is a large amount of solder on the bumps, a bridge (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between the adjacent solder R knobs, and conversely, if the amount of solder on the bumps is too small, the connecting portion 5 of the semiconductor element 4 will The connection portion 33 of the board 32 is no longer connected and electrical continuity is no longer established. In other words, the reliability of the connection becomes low. Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection ("Geometric Optimiz
ation of (:trolledCol
lapse Interconnections',
L., S., Goldman.

IBM J、 RES、 DEVELOP、 1969
 MAY、 pp251−265゜”Re1labll
ity of Controlled Co11aps
e Inter−connections”、 K、C
,Norris、^、H,Landzberg。
IBM J, RES, DEVELOP, 1969
MAY, pp251-265゜"Re1labll
property of Controlled Co11aps
e Inter-connections”, K, C
, Norris, ^, H, Landzberg.

IBMJ、 RES、 DEVELOP、 1969.
MAY、 pp266−271゜ろう接技術研究会技術
資料、No、017−’84、ろう接技術研究会発行)
という問題がある。
IBMJ, RES, DEVELOP, 1969.
MAY, pp266-271゜Brazing Technology Research Group Technical Data, No. 017-'84, Published by Brazing Technology Research Group)
There is a problem.

このように、半田バンブの量の多少が接続の信頼性に影
響するため半田バンプ31の量のコントロールが必要と
されている。
As described above, since the amount of solder bumps 31 affects the reliability of the connection, it is necessary to control the amount of solder bumps 31.

■半田バンブ31が半導体素子4の内側に存在すると接
続が良好に行なわれたか否かの目視検査が難しくなる。
(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■半導体素子の放熱性が悪い(参考資料;Electr
onic Packaging Technology
 1987.1゜(Vol、3. No、1) P、6
6〜71. NIKKEI MICRODEVICES
1986.5月、 P、97〜108)ため、放熱特性
を良好たらしめるために多大な工夫が必要とされる。
■Poor heat dissipation of semiconductor elements (reference material: Electr
onic Packaging Technology
1987.1゜(Vol, 3. No, 1) P, 6
6-71. NIKKEI MICRO DEVICES
(May 1986, P, 97-108), therefore, great efforts are required to improve heat dissipation characteristics.

■第13図および第14図に示す技術 ■絶縁膜71の露出面72、金属材70の露出面73あ
るいは絶縁膜71°の露出面72°と金属材70°の露
出面73゛とを平らにしなければならず、そのための工
夫が増し、コスト高になる。
■Technique shown in FIGS. 13 and 14■ Flatten the exposed surface 72 of the insulating film 71, the exposed surface 73 of the metal material 70, or the exposed surface 72° of the insulating film 71° and the exposed surface 73′ of the metal material 70°. This requires more effort and costs.

■絶縁膜71の露出面72と金属材70の露出面73あ
るいは絶縁膜71°の露出面72゛と金属材70°の露
出面73゛に凹凸があると金属材70と金属材70’ 
とが接続しなくなり、信頼性が低下する。
■ If there is unevenness on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70 or on the exposed surface 72' of the insulating film 71° and the exposed surface 73' of the metal material 70°, the metal material 70 and the metal material 70'
connection will be lost, and reliability will decrease.

■第15図に示す技術 ■位置決め後に、接続部76と接続部76°とを加圧し
て接続する際に、圧力が一定はかかりにくいため、接続
状態にバラツキが生じ、その結果、接続部における接触
抵抗値のバラツキが大きくなる。そのため、接続の信頼
性が乏しくなる。
■Technology shown in Fig. 15■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76°, it is difficult to apply a constant pressure, resulting in variations in the connection state, resulting in The variation in contact resistance value increases. Therefore, the reliability of the connection becomes poor.

また、多量の電流を流すと、発熱等の現象が生じるので
、多量の電流を流したい場合には不向きである。
In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■圧力が一定にかけられたとしても、異方性導電膜78
の導電粒子79の配列により抵抗値のバラツキが大きく
なる。そのため、接続の信頼性に乏しくなる。また、多
量の電流を流したい場合には不向きである。
■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for cases where a large amount of current needs to flow.

■隣接する接続部のピッチ(接続部に隣接する接続部中
心間の距離)を狭くすると隣接する接続部の間の抵抗値
が小さくなることから高密度な接続には不向きである。
(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■回路基材75,75°の接続部76.76’の出っ張
りfx h Iのバラツキにより抵抗値が変化するため
、h、バラツキ量を正確に押さえることが必要である。
(2) The protrusion of the circuit board 75, 75° connection portion 76, 76' fx h Since the resistance value changes due to variations in I, it is necessary to accurately control the amount of variation in h.

■さらに異方性導電膜を、半導体素子と回路基材の接続
、また、第1の半導体素子と第2の半導体素子との接続
に使用した場合、上記■〜■の欠点の他、半導体素子の
接続部にバンプを設けなければならなくなり、コスト高
になるという欠点が生じる。
■Furthermore, when an anisotropic conductive film is used for connecting a semiconductor element and a circuit substrate, or for connecting a first semiconductor element and a second semiconductor element, in addition to the above-mentioned drawbacks, the semiconductor element It is necessary to provide bumps at the connecting portions of the connectors, which has the disadvantage of increasing costs.

■第16図に示す技術 ■加圧が必要であり、加圧治具が必要となる。■Technology shown in Figure 16 ■Pressure is required, and a pressure jig is required.

■エラスチックコネクタ83の金属線82と第1の回路
基材75の接続部76、また、第2の回路基材75°の
接続部76゛との接触抵抗は加圧力および表面状態によ
り変化するため、接続の信頼性に乏しい。
■Because the contact resistance between the metal wire 82 of the elastic connector 83 and the connection part 76 of the first circuit base material 75 and the connection part 76' of the second circuit base material 75° changes depending on the pressing force and surface condition. , the connection is unreliable.

■エラスチックコネクタ83の金属線82は剛体である
ため、加圧力が犬であるとエラスチックコネクタ83、
第1の回路基材75、第2の回路基材75°の表面が破
損する可能性が大きい。また、加圧力が小であると、接
続の信頼性が乏しくなる。
■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
There is a high possibility that the surfaces of the first circuit substrate 75 and the second circuit substrate 75° will be damaged. Moreover, if the pressing force is small, the reliability of the connection will be poor.

■さらに、回路基材75,75°の接続部76.76°
の出っ張り量h2、またエラスチックコネクタ83の金
属線82のの出っ張り量り。
■Furthermore, the connection part of the circuit board 75, 75° is 76.76°
The amount of protrusion h2, and the amount of protrusion of the metal wire 82 of the elastic connector 83.

とそのバラツキが抵抗値変化および破損に影響を及ぼす
ので、バラツキを少なくする工夫が必要とされる。
Since this variation affects resistance value changes and damage, it is necessary to devise ways to reduce this variation.

■さらに、エラスチックコネクターを半導体素子と回路
基材の接続、また、第1の半導体素子と第2の半導体素
子との接続に使用した場合、■〜■と同様な欠点を生ず
る。
(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

本発明は、以上のような問題点をことごとく解決し、高
密度、高信頼性であり、しかも、低コストの新電気回路
装置を提案するものであり、従来の接続方式及び封止方
式を置き変え得ることはもちろん、高密度多点接続が得
られ、熱特性その他の諸特性を向上させ得るものである
The present invention solves all of the above problems and proposes a new electric circuit device that is high density, highly reliable, and low cost, and replaces the conventional connection method and sealing method. Of course, it is possible to obtain high-density multi-point connections and improve thermal and other properties.

[課題を解決するための手段] 本発明の第1の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の金属部材とを有し、
該金属部材の一端が該保持体の一方の面において露出し
ており、また、該金属部材の他端が該保持体の他方の面
において露出している2つ以上の電気的接続部材の少な
くとも1つに配線パターンを有する電気的接続部材を積
層する工程と; 電気的接続部材の金属部材又は配線パターンの一方又は
両方の1以上の接続部と別の電気的接続部材の金属部材
又は配線パターンの一方又は両方の1以上の接続部を金
属化及び/又は合金化により接続する工程と; を少なくとも有することを特徴とする電気的接続部材の
製造方法にある。
[Means for Solving the Problems] A first aspect of the present invention includes a holder made of an electrically insulating material, and a plurality of metal members embedded in the holder,
At least one of two or more electrical connection members, one end of the metal member being exposed on one surface of the holder, and the other end of the metal member being exposed on the other surface of the holder. a step of laminating one electrical connection member having a wiring pattern; one or more connection portions of one or both of the metal member or wiring pattern of the electrical connection member and the metal member or wiring pattern of another electrical connection member; A method for manufacturing an electrical connection member, comprising at least the following steps: connecting one or more connection portions of one or both of the above by metallization and/or alloying.

本発明の第2の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の金属部材とを有し、
該金属部材の一端が該保持体の一方の面において露出し
ており、また、該金属部材の他端が該保持体の他方の面
において露出している2つ以上の電気的接続部材の少な
くとも1つに配線パターンを有する電気的接続部材を積
層し、電気的接続部材の金属部材又は配線パターンの一
方又は両方の1以上の接続部と別の電気的接続部材の金
属部材又は配線パターンの一方又は両方の1以上の接続
部を金属化及び/又は合金化により接続した2つ以上の
電気的接続部材で構成された電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該電気的接続部材に露出している該金属部材のうちの少
なくとも1つおよび/又は該配線パターンと保持体の一
方又は両方の面で接続されている少なくとも1以上の電
気回路部品と;を少なくとも有していることを特徴とす
る電気回路部材にある。
A second aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
At least one of two or more electrical connection members, one end of the metal member being exposed on one surface of the holder, and the other end of the metal member being exposed on the other surface of the holder. One electrical connection member having a wiring pattern is laminated, one or more connection parts of one or both of the metal member or the wiring pattern of the electrical connection member and one of the metal member or the wiring pattern of another electrical connection member. or an electrical connection member composed of two or more electrical connection members in which one or more connection parts of both are connected by metallization and/or alloying; In,
at least one of the metal members exposed to the electrical connection member and/or at least one or more electric circuit components connected to the wiring pattern and one or both surfaces of the holder; An electric circuit member having the following features:

本発明の第3の要旨は、本発明の第2の要旨において、
該電気回路部品の接続部と該金属部材のうちの少なくと
も1つとは金属化および/または合金化により接続され
ていることを特徴とする電気回路部材にある。
The third gist of the present invention is that in the second gist of the present invention,
The electrical circuit member is characterized in that the connecting portion of the electrical circuit component and at least one of the metal members are connected by metallization and/or alloying.

本発明の第4の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の金属部材とを有し、
該金属部材の一端が該保持体の一方の面において露出し
ており、また、該金属部材の他端が該保持体の他方の面
において露出している2つ以上の電気的接続部材の少な
くとも1つの少なくとも保持体の1つの面に配線パター
ンを有する電気的接続部材を積層する工程と;電気的接
続部材の金属部材又は配線パターンの一方又は両方の1
以上の接続部と別の電気的接続部材の金属部材又は配線
パターンの一方又は両方の1以上の接続部を金属化及び
/又は合金化により接続する工程と; を少なくとも有することを特徴とする電気的接続部材の
製造方法にある。
A fourth aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
At least one of two or more electrical connection members, one end of the metal member being exposed on one surface of the holder, and the other end of the metal member being exposed on the other surface of the holder. a step of laminating an electrical connection member having a wiring pattern on at least one surface of one holder; one or both of the metal member and the wiring pattern of the electrical connection member;
Connecting one or more of the above connection parts and one or both of the metal members or wiring patterns of another electrical connection member by metallization and/or alloying; A method for manufacturing a connecting member.

本発明の第5の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の金属部材とを有し、
該金属部材の一端が該保持体の一方の面において露出し
ており、また、該金属部オイの他端が該保持体の他方の
面において露出している2つ以上の電気的接続部材の少
なくとも1つの少なくとも保持体の1つの面に配線パタ
ーンを有する電気的接続部材を積層し、電気的接続部材
の金属部材又は配線パターンの一方又は両方の1以上の
接続部と別の電気的接続部材の金属部材又は配線パター
ンの一方又は両方の1以上の接続部を金属化及び/又は
合金化により接続した2つ以上の電気的接続部材で構成
された電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該電気的接続部材に露出している該金属部材のうちの少
なくとも1つおよび/又は該配線パターンと保持体の一
方又は両方の面で接続されている少なくとも1以上の電
気回路部品と;を少なくとも有していることを特徴とす
る電気回路部材にある。
A fifth aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
One end of the metal member is exposed on one surface of the holder, and the other end of the metal member is exposed on the other surface of the holder. An electrical connection member having a wiring pattern is laminated on at least one surface of at least one holder, and one or more connection portions of one or both of the metal member or the wiring pattern of the electrical connection member and another electrical connection member. an electrical connection member composed of two or more electrical connection members in which one or more connection parts of one or both of the metal members or wiring patterns are connected by metallization and/or alloying; at least one or more connections; and at the connecting portion,
at least one of the metal members exposed to the electrical connection member and/or at least one or more electric circuit components connected to the wiring pattern and one or both surfaces of the holder; An electric circuit member having the following features:

本発明の第6の要旨は、本発明の第5の要旨において、
該電気回路部品の接続部と該金属部材のうちの少なくと
も1つとは金属化および/または合金化により接続され
ていることを特徴とする電気回路部材にある。
The sixth gist of the present invention is, in the fifth gist of the present invention,
The electrical circuit member is characterized in that the connecting portion of the electrical circuit component and at least one of the metal members are connected by metallization and/or alloying.

(以下余白) 以下に本発明の構成要件を個別的に説明する。(Margin below) The constituent elements of the present invention will be individually explained below.

(電気回路部品) 本発明における電気回路部品としては、例えば、樹脂回
路基板、セラミック基板、金属基板、シリコン基板等の
回路基板(以下単に回路基板ということがある)や、半
導体素子、リードフレーム等が挙げられる。
(Electrical circuit components) Examples of the electrical circuit components in the present invention include circuit boards (hereinafter simply referred to as circuit boards) such as resin circuit boards, ceramic boards, metal boards, and silicon boards, semiconductor elements, lead frames, etc. can be mentioned.

なお、電気的接続部材に接続される電気回路部品は、保
持体の1つの面に1つだけ存在してもよいし、複数個存
在してもよい。
Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

電気回路部品として接続部を有する部品が本発明の対象
となる。接続部の数は問わないが、接続部の数が多けれ
ば多いほど本発明の効果が顕著となる。
The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

また、接続部の存在位置も問わないが、電気回路部品の
内部に存在するほど本発明の効果は顕著となる。
Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

なお、接続部は電気的導電材料である。Note that the connecting portion is an electrically conductive material.

(電気的接続部材) 本発明に係る電気的接続部材は、電気絶縁材料からなる
保持体に複数の金属部材が埋設され、保持体の両面に金
属部材が露出している2つ以上の電気的接続部材の少な
くとも1つに配線パターンを有する電気的接続部材を積
層し、電気的接続部材の金属部材又は配線パターンの一
方又は両方の1以上の接続部と別の電気的接続部材の金
属部材又は配線パターンの一方又は両方の1以上の接続
部とを金属化及び又は合金化により接続したものである
。埋設されている個々の金属部材と配線パターンは電気
的に接続されていてもよいし、接続されていなくてもよ
い。なお、配線パターンを有する電気的接続部材の配線
パターンは保持体の中に埋設されてもよいし、保持体の
片面又は両方に存在していてもよいし、それらを複合さ
せたものでもよい。配線パターンの材質は金属材料に限
らず、他の導電材料でもよい、積層する複数の電気的接
続部材の保持体材料は同種でもよいし、異種のものでも
よい、また、金属部材も同種でも異種でもよい。積層す
る複数の電気的接続部材の接続部以外の面は接続部を補
強する意味で接着、融着等の方法で接合されていた方が
よい。
(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of metal members embedded in a holder made of an electrically insulating material, and two or more electrical connection members in which the metal members are exposed on both sides of the holder. An electrical connection member having a wiring pattern is laminated on at least one of the connection members, and one or more connection parts of one or both of the metal member or wiring pattern of the electrical connection member and the metal member of another electrical connection member or One or more connection parts of one or both of the wiring patterns are connected by metallization and/or alloying. The individual buried metal members and the wiring pattern may or may not be electrically connected. Note that the wiring pattern of the electrical connection member having a wiring pattern may be embedded in the holder, may be present on one or both sides of the holder, or may be a combination thereof. The material of the wiring pattern is not limited to metal materials, but may be other conductive materials. The holder materials of the multiple electrical connection members to be laminated may be of the same type or different types, and the metal members may be of the same type or different types. But that's fine. It is preferable that the surfaces of the plurality of stacked electrical connection members other than the connection portions be joined by adhesive, fusion, etc. in order to reinforce the connection portions.

また、積層された電気的接続部材で露出している電気回
路部品との接続部以外の場所に電気的絶縁材料を貼り付
ける、塗布する等の方法で電気的に絶縁させてもよい、
電気回路部品が電気的に接続される電気的接続部材の接
続部は、配線パターン上でもよいが、好ましくは金属部
材が埋設されている位置で、しかも接続部は凸状になっ
ている方がよい。また、電気的接続部材同士の接続部も
凸状になっている方が接続し易い。
In addition, electrical insulation may be achieved by pasting or coating an electrically insulating material on a portion of the stacked electrical connecting member other than the exposed connection portion with the electrical circuit component.
The connection part of the electrical connection member to which the electric circuit component is electrically connected may be on the wiring pattern, but it is preferable that the connection part be in a position where the metal member is buried and that the connection part has a convex shape. good. Further, it is easier to connect the electrical connection members if the connection portions are also convex.

さらに、電気的接続部材は2層以上の多層であるが、複
数の電気的接続部材の大きさが異なる場合、部分的に一
層の部分も存在する場合がある。
Further, although the electrical connection member is multilayered with two or more layers, if the plurality of electrical connection members are different in size, there may be a partial single layer portion.

(金属部材) 金属部材は金属材料が一般的であるが、金属材料以外に
も超電導性を示す材料等でもよい。
(Metal member) The metal member is generally a metal material, but other than metal materials, it may also be a material exhibiting superconductivity.

金属部材の材料としては、金が好ましいが、金以外の任
意の金属あるいは合金を使用することもできる。例えば
、Ag、Bet Ca、Mg。
Gold is preferred as the material for the metal member, but any metal or alloy other than gold may also be used. For example, Ag, Bet Ca, Mg.

Mo、  Ni、  W、  Fe、  Ti、  I
n、  Ta。
Mo, Ni, W, Fe, Ti, I
n, Ta.

Zn、Cu、An、Sn、Pb−3n等の金屑あるいは
合金が挙げられる。
Examples include gold scraps or alloys such as Zn, Cu, An, Sn, and Pb-3n.

また、金属部材及び合金部材は、同一の電気的接続部材
において同種の金属が存在していてもよいし、異種の金
属が存在していてもよい。さらに、電気的接続部材の金
屑部材及び合金部材の1個が同種の金属ないし合金でで
とていてもよいし、異種の金属ないし合金でで討ていて
もよい。
In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Further, one of the metal scrap member and the alloy member of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys.

さらに、金属部材の断面は円形、四角形その他任意の形
状とするができる。
Furthermore, the cross section of the metal member can be circular, square, or any other shape.

また、金属部材の太さは特に限定されない。電気回路部
材の接続部のピッチを考慮して、例えば20μmφ以上
あるいは20μmφ以下にしてもよい。
Further, the thickness of the metal member is not particularly limited. In consideration of the pitch of the connecting portions of the electric circuit members, the pitch may be set to, for example, 20 μmφ or more or 20 μmφ or less.

なお、金属部材の露出部は保持体と同一面としてもよい
し、また、保持体の面から突出させてもよい。この突出
は片面のみでもよいし両面でもよい。さらに、突出させ
た場合はバンブ状にしてもよい。好ましくは接続部は凸
状にしておいた方がよい。
Note that the exposed portion of the metal member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. Furthermore, if it is made to protrude, it may be shaped like a bump. Preferably, the connecting portion should be convex.

また、金属部材の間隔は、電気回路部品の接続部同士の
間隔と同一間隔としてもよいし、それより狭い間隔とし
てもよい。狭い間隔とした場合には電気回路部品と電気
的接続部材との位置決めを要することなく、電気回路部
品と電気的接続部材とを接続することが可能となる。
Furthermore, the spacing between the metal members may be the same as the spacing between the connecting portions of the electric circuit components, or may be narrower than that. When the interval is narrow, it becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the electric circuit component and the electrical connection member.

また、金属部材は保持体中に垂直に配する必要はなく、
保持体の一方の面側から保持体の他方の面側に向って斜
行していてもよい。
In addition, the metal member does not need to be arranged vertically in the holder;
It may run obliquely from one side of the holder to the other side of the holder.

(保持体) 保持体は、電気的絶縁材料からなる。(Holding body) The holder is made of electrically insulating material.

電気的絶縁材料ならばいかなるものでもよい。Any electrically insulating material may be used.

電気的絶縁材料としては有機材料、無機材料が挙げられ
る。また、金属部材同士が電気的に絶縁されるように処
理を施した金属又は合金材料でもよい。さらに、有機材
料中に、粉体、繊維、板状体、棒状体、球状体等所望の
形状をした、無機材料、金属材料、合金材料の一種か又
は複数種を分散させて保有せしめてもよい。さらに、無
機材料中に、粉体、繊維、板状体、棒状体、球状体等所
望の形状をした、有機材料、金属材料、合金材料の一種
か又は複数種を分散させて保有せしめてもよい。また、
金属材料中に、粉体、繊維、板状体、棒状体、球状体等
所望の形状をした、無機材料、有機材料の一種か又は複
数種を分散させて保有せしめてもよい。なお、保持体が
金属材料よりなる場合は、例えば、金属部材と保持体と
の間に樹脂等の電気的絶縁材料を配設すれ、ばよい。
Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the metal members are electrically insulated from each other. Furthermore, one or more types of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the organic material. good. Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the inorganic material. good. Also,
One or more kinds of inorganic materials and organic materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the metal material. In addition, when the holding body is made of a metal material, for example, an electrically insulating material such as resin may be disposed between the metal member and the holding body.

ここで、有機材料としては、例えば、絶縁性の樹脂を用
いればよく、樹脂としては、熱硬化性樹脂、紫外線硬化
樹脂、熱可塑性樹脂のいずれでもよい。例えば、ポリイ
ミド樹脂、ポリフェニレンサルファイド樹脂、ポリエー
テルサルフオン樹脂、ポリエーテルイミド樹脂、ポリス
チレン樹脂、フッ素樹脂、ポリカーボネート樹脂、ポリ
ジフェニールエーテル樹脂、ポリベンジルイミダゾール
樹脂、ポリアミドイミド樹脂、ポリプロピレン樹脂、ポ
リ塩化ビニル樹脂、ポリスチレン樹脂、メタクリル酸メ
チル樹脂、ポリフェニレンオキサイド樹脂、フェノール
樹脂、メラニン樹脂、エポキシ樹脂、尿素樹脂、メタク
リル樹脂、塩化ビニリデン樹脂、アルキッド樹脂、シリ
コーン樹脂その他の樹脂を使用することができる。
Here, as the organic material, for example, an insulating resin may be used, and the resin may be a thermosetting resin, an ultraviolet curing resin, or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used.

なお、これらの樹脂の中から、熱伝導性のよい樹脂を使
用すれば、半導体素子が熱を持ってもその熱を樹脂を介
して放熱することができるのでより好ましい、さらに、
樹脂として、回路基板と同じかあるいは同程度の熱膨張
率を有するものを選択し、また、有機材料中に少なくと
も1ケの穴あるいは複数の気泡を存在せしめれば、熱膨
張・熱収縮に基づく、装置の信頼性の低下を一層防止す
ることが可能となる。
Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin.
If you select a resin that has the same or similar coefficient of thermal expansion as the circuit board, and if there is at least one hole or multiple bubbles in the organic material, it will be possible to , it becomes possible to further prevent a decrease in reliability of the device.

また、金属材料や合金材料として具体的には、例えば、
Ag、Cu、Au、Al1.Be、Ca。
In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, Al1. Be, Ca.

Mg、Mo、Fe、Ni、St、Co、Mn。Mg, Mo, Fe, Ni, St, Co, Mn.

W、Cr、Nb、Zr、Ti、Ta、Zn。W, Cr, Nb, Zr, Ti, Ta, Zn.

Sn、Pb−3n等の金属又は合金が挙げられる。Examples include metals or alloys such as Sn and Pb-3n.

無機材料としては、例えば、5i02゜B203.AJ
220s 、Na2o、に20゜Cab、ZnO,Ba
d、PbO,Sbz Os 。
Examples of inorganic materials include 5i02°B203. A.J.
220s, Na2o, 20°Cab, ZnO, Ba
d, PbO, SbzOs.

AS203.La、Os 、Zr、02 、Bad。AS203. La, Os, Zr, 02, Bad.

P20.、Tie、、MgO,SiC,Bed。P20. , Tie, , MgO, SiC, Bed.

B P、 BN、 Aj2N、 B4 C,TaC,T
 L B2゜CrB2 、TiN、S i3N4 、T
a2 os等のセラミック、ダイヤモンド、ガラス、カ
ーボン、ボロンその他の無機材料が挙げられる。
B P, BN, Aj2N, B4 C, TaC, T
L B2゜CrB2, TiN, Si3N4, T
Examples include ceramics such as a2 os, diamond, glass, carbon, boron, and other inorganic materials.

(接続;金属化及び/又は合金化による接続)電気的接
続部材の端と電気回路部品の接続との接続としては下記
の2つの構成が考えられる。
(Connection; Connection by metallization and/or alloying) The following two configurations can be considered for the connection between the end of the electrical connection member and the connection of the electrical circuit component.

なお、1個の電気的接続部材の少なくとも片面に、1個
または2個以上の電気回路部品が接続されていてもよい
が、その接続された電気回路部品のうちの少なくとも1
個が下記の構成による接続がなされていればよい。
Note that one or more electric circuit components may be connected to at least one side of one electrical connection member, but at least one of the connected electric circuit components
It suffices if they are connected according to the following configuration.

■保持体の面に露出している複数の電気的接続部材の接
続部と、電気回路部品の複数の接続部とが、金属化及び
/又は合金化することにより接続されている構成。
(2) A structure in which the connection parts of the plurality of electrical connection members exposed on the surface of the holder and the plurality of connection parts of the electric circuit components are connected by metallization and/or alloying.

■保持体の面に露出している複数の電気的接続部材の接
続部と、電気回路部品の複数の接続部とが、金属化及び
/又は合金化以外の方法により接続されている構成。
(2) A structure in which the connection parts of the plurality of electrical connection members exposed on the surface of the holder and the plurality of connection parts of the electric circuit components are connected by a method other than metallization and/or alloying.

次に上記の金属化及び/又は合金化による接続体につい
て述べる。
Next, the connection body formed by the above metallization and/or alloying will be described.

接続しようとする金属部材と接続部とが同種の純金属よ
りなる場合には、金属化により形成される接続体は金属
部材あるいは接続部と同種の結晶構造となる。なお、金
属化の方法としては、例えば、金属部材の端とその端に
対応する接続部とを接触させた後、適宜の温度に加熱す
ればよい。加熱により接触部近傍において原子の拡散等
が生じ、拡散部が金属化状態となり接続層が形成される
When the metal member to be connected and the connecting portion are made of the same type of pure metal, the connecting body formed by metallization has the same type of crystal structure as the metal member or the connecting portion. Note that, as a method of metallization, for example, an end of a metal member and a connecting portion corresponding to the end may be brought into contact with each other, and then heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a connection layer.

接続しようとする金属部材と接続部が異種の純金属より
なる場合には、形成される接続層は両金属の合金よりな
る0合金化の方法としては、例えば、金属部材の端とそ
の端に対応する接続部とを接触させた後、適宜の温度に
加熱すればよい。加熱により接触部近傍において原子の
拡散等が生じ接触部近傍に固溶体あるいは金属間化合物
よりなる層が形成される。
When the metal member to be connected and the connection part are made of different types of pure metals, the connecting layer formed is an alloy of both metals. After bringing the corresponding connection parts into contact, it may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and a layer made of a solid solution or an intermetallic compound is formed in the vicinity of the contact portion.

なお、電気的接続部材の金属部材にAuを使用し、電気
回路部品の接続部にAfLを使用した場合には、200
〜350℃の加熱温度が好ましい。
In addition, when Au is used for the metal member of the electrical connection member and AfL is used for the connection part of the electric circuit component, 200
A heating temperature of ~350°C is preferred.

接続しようとする金属部材と接続部の一方が純金属より
なり他方が合金よりなる場合、あるいは両者が同種ある
いは異種の合金よりなる場合には、接続界面は合金より
なる。
When one of the metal members to be connected and the connecting portion is made of a pure metal and the other is made of an alloy, or when both are made of the same or different types of alloys, the connecting interface is made of an alloy.

1個の電気的接続部材中における複数の金属部材同士に
ついてみると、それぞれの金属部材が同種の金属あるい
は合金よりなる場合、それぞれが異種の金属あるいは合
金からなる場合、また、さらに1個の金属部材で、同種
の金属あるいは合金、異種の金属あるいは合金よりなる
場合、その他の場合があるが、そのいずれの場合であっ
ても上記の金属化あるいは合金化が行なわれる。−方、
接続部についても同様である。
Regarding multiple metal members in one electrical connection member, if each metal member is made of the same kind of metal or alloy, if each is made of different kinds of metal or alloy, or if one metal member is made of different kinds of metal or alloy, The above-mentioned metallization or alloying is performed in cases where the members are made of the same kind of metal or alloy, different kinds of metal or alloy, or in other cases. - way,
The same applies to the connection portion.

加熱方法としては、熱圧着等の方法のほかに超音波加熱
法、高周波誘導加熱法、高周波誘電加熱法、マイクロ波
加熱法等の内部加熱法や他の外部加熱法を用いてもよく
、各々を併用させてもよい。いずれの加熱法も直接又は
間接的に接続部を加熱させて接続する。
As a heating method, in addition to methods such as thermocompression bonding, internal heating methods such as ultrasonic heating method, high frequency induction heating method, high frequency dielectric heating method, microwave heating method, etc., and other external heating methods may be used. may be used together. In either heating method, the connection is made by directly or indirectly heating the connection part.

また、接続される部分の表面に合金化しやすい金属ある
いは合金よりなるめっき層を設けておいてもよい。
Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

上記の金属化あるいは合金化以外の接続を行なうには、
例えば電気回路部品と電気的接続部材の金属部材とを押
圧して接続すればよい。
To make connections other than metallization or alloying as described above,
For example, the connection may be made by pressing the electric circuit component and the metal member of the electrical connection member.

なお、積層する電気的接続部材同士の接続を金属化/及
び又は合金化により行なう際も上述した手法により行な
えばよい、ただし、この場合の接続は■金属部材同士の
場合、■金属部材と配線パターンの場合、■配線パター
ン同士の場合がある。
In addition, when connecting electrical connection members to be laminated together by metallization/or alloying, the above-mentioned method may be used. In the case of patterns, ■ There are cases where the wiring patterns are mutual.

(封止材) 本発明では、電気回路部材を封止してもよい。(Encapsulant) In the present invention, the electric circuit member may be sealed.

封止は電気的接続部材又は電気回路部品の一方又は両方
の少なくとも一部分を埋め込んで封止する。
Sealing is performed by embedding at least a portion of one or both of the electrical connection member or the electrical circuit component.

封止は、1つの電気回路部品にのみ行ってもよいし、複
数の電気回路部品に行フてもよい。
Sealing may be applied to only one electrical circuit component or to multiple electrical circuit components.

(封止材の材料) 本発明では、封止材の材料としては熱可塑性樹脂を用い
ることができる。熱可塑性樹脂としては、例えば、ポリ
イミド樹脂、ポリフェニレンサルファイド樹脂、ポリエ
ーテルサルフォン樹脂、ポリエーテルイミド樹脂、ポリ
スチレン樹脂、フッ素樹脂、ポリカーボネート樹脂、ポ
リジフェニールエーテル樹脂、ポリベンジルイミダゾー
ル樹脂、ポリアミドイミド樹脂、ポリプロピレン樹脂、
ポリ塩化ビニル樹脂、ポリスチレン樹脂、メタクリル酸
メチル樹脂その他の樹脂を使用することができる。
(Material of Encapsulant) In the present invention, thermoplastic resin can be used as the material of the encapsulant. Examples of thermoplastic resins include polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, and polypropylene. resin,
Polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin and other resins can be used.

また、封止材は上記の樹脂でもよいし、上記熱可塑性樹
脂に粉体、繊維、板状体、棒状体、球状体等任意の形状
の、金属、合金、無機材料の1種又は複数種を分散した
ものでもよい。分散の仕方は、樹脂中に粉体、繊維、板
状体、棒状体、球状体等を添加し、樹脂を攪拌すればよ
い。もちろん、かかる方法によることなく、他の任意の
方法で樹脂中に粉体、1aia、板状体、棒状体、球状
体等を分散せしめてもよい。
The sealing material may be the above-mentioned resin, or one or more of metals, alloys, and inorganic materials in any shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies can be added to the above-mentioned thermoplastic resin. It may also be a dispersed version. Dispersion can be achieved by adding powder, fibers, plates, rods, spheres, etc. to the resin and stirring the resin. Of course, the powder, laia, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may be dispersed in the resin by any other method other than this method.

上記金属又は合金としては、例えば、Ag。Examples of the metal or alloy include Ag.

Cu、Au、Afl、Be、Ca、Mg、Mo。Cu, Au, Afl, Be, Ca, Mg, Mo.

Fe、Ni、Si、Co、Mn、W等の金属又は合金が
挙げられる。
Examples include metals or alloys such as Fe, Ni, Si, Co, Mn, and W.

無機材料としては、例えば、5in2゜B203 、A
j2203 、Na2O,に20゜Cab、ZnO,B
ad、PbO,5b20s 。
Examples of inorganic materials include 5in2°B203, A
j2203, Na2O, 20°Cab, ZnO, B
ad, PbO, 5b20s.

As、O,、La2 o3.ZrO2,Bad。As, O,, La2 o3. ZrO2, Bad.

P20S 、 Tf 02 、 MgO,S t C,
Bed。
P20S, Tf02, MgO, S t C,
Bed.

BP、 BN、 A42N、 B4 C,TaC,T 
i B2゜CrB2 、TiN、Si3 N4 、Ta
z os等のセラミック、ダイヤセンド、ガラス、カー
ボン、ボロンその他の無機材料が挙げられる。
BP, BN, A42N, B4 C, TaC, T
i B2゜CrB2, TiN, Si3 N4, Ta
Examples include ceramics such as ZOS, diamonds, glass, carbon, boron, and other inorganic materials.

分散せしめる粉体、1a維、板状体、棒状体、球状体等
の大きさ、形状、また絶縁体中における分散位置、数量
は、任意である。また粉体、ia維、板状体、棒状体、
球状体等は絶縁体の外部に露出していてもよいし、露出
していなくてもよい、また、粉体、繊維、mia、板状
体、棒状体、球状体等は互いに接触していてもよいし、
接触していなくてもよい。
The size and shape of the powder, 1a fiber, plate-shaped body, rod-shaped body, spherical body, etc. to be dispersed, as well as the dispersed position and quantity in the insulator are arbitrary. In addition, powder, IA fiber, plate-shaped body, rod-shaped body,
Spherical bodies, etc. may or may not be exposed to the outside of the insulator, and powders, fibers, mias, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may be in contact with each other. It's good too,
They don't have to be in contact.

(封止方法) なお、封止材を封止する方法としては、型のキャビティ
ー内に電気回路部材(電気的接続部材とそれに接続され
た電気回路部品からなる部材)を入れ、インジェクショ
ンモールドでキャビティーに封止材を挿入することによ
り封止すればよい、また、かかるインジェクションモー
ルド、押出成形法、中型法、中空成形法その他いかなる
方法で電気回路部材を封止してもよい。
(Sealing method) The method for sealing with the sealing material is to place an electrical circuit member (a member consisting of an electrical connection member and the electrical circuit components connected to it) into the cavity of the mold, and then use injection molding. The electric circuit member may be sealed by inserting a sealing material into the cavity, or may be sealed by injection molding, extrusion molding, medium molding, blow molding, or any other method.

さらに上記封止材と板(板は封止材と異なる材質)を併
用してもよい、かかる封止形態としては、封止材の少な
くとも一方の面の少なくとも一部に板が接合されている
場合、電気的接続部材に接続されている電気回路部品の
電気的接続部材とは反対側の面に接合されている板又は
電気回路部品の一方又は両方の少なくとも一部が埋め込
まれている場合、及び封止材により電気回路部品の1つ
又は複数の側面近傍に配設された板の少なくとも一部が
埋め込まれている場合がある。
Furthermore, the above-mentioned sealing material and a plate (the plate is made of a different material from the sealing material) may be used in combination. In such a sealing form, the plate is bonded to at least a portion of at least one surface of the sealing material. In this case, at least a portion of one or both of the plate and the electrical circuit component connected to the electrical circuit component connected to the electrical connection member is embedded in the surface opposite to the electrical connection member, At least a portion of the plate disposed near one or more side surfaces of the electric circuit component may be embedded in the sealing material.

(板) 板の材質は、封止材の材質と異なっていればいかなるも
のでもよい。
(Plate) The material of the plate may be any material as long as it is different from the material of the sealing material.

板厚としては、例えばステンレス板の場合、0.05〜
0.5mmが好ましい。
For example, in the case of a stainless steel plate, the plate thickness is 0.05~
0.5 mm is preferred.

接合する場合の接合方法には特5限寞されない、たとえ
ば、接着剤等を用いて貼り付ければよいし、その他の方
法であってもよい。
There are no particular limitations on the joining method when joining, for example, it may be pasted using an adhesive or the like, or other methods may be used.

(キャップ) 本発明では、電気回路部品をキャップ封止しいてもよい
(Cap) In the present invention, the electric circuit component may be sealed with a cap.

ここでキャップ封止どは、電気回路部品を包み込み、内
部に中空部が存在するように電気回路部品を封止するこ
とである。
Here, the term "cap sealing" refers to wrapping an electric circuit component and sealing the electric circuit component so that a hollow portion exists inside.

キャップは、1つの電気回路部品にのみ設けてもよいし
、複数の電気回路部品に設けてもよい。
The cap may be provided on only one electrical circuit component, or may be provided on multiple electrical circuit components.

なお、キャップ封止する場合、電気回路部品が電気的接
続部材にしっかり保持されるように封止することが好ま
しい。たとえば、キャップの内部の面を、電気回路部品
の外側の表面形状に対応する形状とし、その面が電気回
路部品の外側の表面に当接するようにキャップ封止すれ
ばよい。
In addition, when sealing with a cap, it is preferable to seal so that the electric circuit component is firmly held on the electrical connection member. For example, the inner surface of the cap may be shaped to correspond to the outer surface shape of the electric circuit component, and the cap may be sealed such that the inner surface of the cap comes into contact with the outer surface of the electric circuit component.

なお、キャップは、接着剤による貼り付は方法、機械的
方法、溶着による方法その他の任息の方法により、接合
すればよい。また、複数の電気回路部品を複数のキャッ
プで封止してもよい。
Note that the cap may be joined by any method such as an adhesive method, a mechanical method, a welding method, or any other method. Further, a plurality of electrical circuit components may be sealed with a plurality of caps.

(キャップ封止の材X) キャップの材質は有機材料、無機材料、金属材料、又は
これらの複合材料でもよい。
(Cap Sealing Material X) The material of the cap may be an organic material, an inorganic material, a metal material, or a composite material thereof.

封止形態は電気回路部品1ケ又は複数を同一キャップで
封止してもよい。また、キャップが電気回路部品を押圧
するように封止してもよいし、保持するように封止して
もよい。
As for the sealing form, one or more electric circuit components may be sealed with the same cap. Further, the cap may be sealed so as to press against the electric circuit component, or may be sealed so as to hold the electric circuit component.

さらに電気回路部品とキャップの間に部材を介在させて
封止してもよい。この場合、複数の電気回路部品を同一
キャップで封止した方が効果が顕著となる。
Furthermore, a member may be interposed between the electric circuit component and the cap for sealing. In this case, the effect will be more pronounced if a plurality of electrical circuit components are sealed with the same cap.

キャップと電気回路部品その他との接合はいかなる方法
でもよい。
Any method may be used to join the cap to the electric circuit components and the like.

(調整用部材) 本発明ではキャップと電子回路部品との間に調整用部材
を介在せしめてもよい。
(Adjustment member) In the present invention, an adjustment member may be interposed between the cap and the electronic circuit component.

調整用部材の材料は、金属材料、無機材料、有機材料の
うちどれでもよいが、弾力性のある材料であることが好
ましい。。
The material for the adjustment member may be any metal, inorganic, or organic material, but is preferably an elastic material. .

また、形状は、電気回路部品の高さ方向の寸法が調整で
きれば、どのような形状でもよい。
Further, the shape may be any shape as long as the dimension in the height direction of the electric circuit component can be adjusted.

[作用] (請求項1) 本発明の請求項1によれば以下に述べる請求項2の電気
回路部材に使用する電気的接続部材を製造することがで
きる。
[Operation] (Claim 1) According to Claim 1 of the present invention, it is possible to manufacture an electrical connection member used in the electric circuit member of Claim 2 described below.

(請求項2) ■本発明では、上記した電気的接続部材を使用して1個
以上の電気回路部品を接続すると、電気回路部品の接続
部を外周縁部はもとより内部に配置することも可能とな
り、接続部の数を増加させることができ、ひいては高密
度化が可能となる。
(Claim 2) ■In the present invention, when one or more electrical circuit components are connected using the electrical connection member described above, it is possible to arrange the connecting portions of the electrical circuit components not only on the outer periphery but also inside. Therefore, the number of connection parts can be increased, and higher density can be achieved.

■また、電気的接続部材を薄くすることが可能であり、
この面からも電気回路部材の薄型化が可能となる。
■Also, it is possible to make the electrical connection member thinner,
Also from this point of view, it is possible to make the electric circuit member thinner.

■さらに、電気的接続部材に使用する金属部材の量は少
ないため、例え、高価である金を金属部材として使用し
たとしてもコスト低減が可能となる。
(2) Furthermore, since the amount of metal members used for electrical connection members is small, costs can be reduced even if expensive gold is used as the metal member.

■電気的接続部材は複数の電気的接続部材を積層した構
成をとっていることにより、高密度で多層な回路基板を
作製することができ、しかも安価に作製することが可能
となる。
(2) Since the electrical connection member has a structure in which a plurality of electrical connection members are laminated, a high-density, multilayer circuit board can be manufactured, and it can be manufactured at low cost.

■また、さらに複数の電気的接続部材の保持体を異種の
材料構成にすると様々な効果が得られる。例えば、比誘
電率が高い材料を挟み込むとコンデンサーが得られ、ま
た、強磁性材料を分散させた材料を挟み込むと特性の良
いコイルが得られる等、様々な機能性基板が得られる。
(2) Further, various effects can be obtained by using different materials for the holders of the plurality of electrical connection members. For example, by sandwiching a material with a high dielectric constant, a capacitor can be obtained, and by sandwiching a material in which a ferromagnetic material is dispersed, a coil with good characteristics can be obtained, and various other functional substrates can be obtained.

しかも、電気回路部品とりわけ半導体素子を直接に、し
かも容易に電気的接続部材に接続できるため、工数が低
減し、安価な半導体装置を得ることが可能となる。
Moreover, since electrical circuit components, particularly semiconductor elements, can be directly and easily connected to electrical connection members, the number of man-hours can be reduced, and it is possible to obtain an inexpensive semiconductor device.

(請求項3、請求項6) ■電気回路部品が、電気的接続部材に、金属化及び/又
は合金化により接続されていると、電気回路部品が強固
(強度的に強く)かつ確実に接続されるので、接続抵抗
値は小さく、そのバラツキも小さく、さらに機械的に強
く、不良率の極めて低い電気回路部材を得ることができ
る。
(Claim 3, Claim 6) ■When the electric circuit component is connected to the electrical connection member by metallization and/or alloying, the electric circuit component is firmly (strong in terms of strength) and reliably connected. Therefore, it is possible to obtain an electrical circuit member that has a small connection resistance value, small variation thereof, is mechanically strong, and has an extremely low defect rate.

■また、電気回路部品を、電気的接続部材に金属化及び
/又は合金化により接続されていると、電気回路部材の
作成工程中及び作成後において、治具等を使用して電気
回路部品を保持する必要がなく、電気回路部材の作成及
び作成後の管理が容易である。
■In addition, if electrical circuit components are connected to electrical connection members by metallization and/or alloying, a jig or the like may be used to connect the electrical circuit components during or after the electrical circuit component creation process. There is no need to hold it, and it is easy to create the electric circuit member and manage it after it is created.

(請求項4) 本発明の請求項4によれば作製し易い電気的接続部材が
得られ、以下に述べる請求項5の電気回路部材に使用す
る電気的接続部材を安価に製造することができる。
(Claim 4) According to Claim 4 of the present invention, an electrical connection member that is easy to produce can be obtained, and the electrical connection member used in the electric circuit member of Claim 5 described below can be manufactured at low cost. .

(請求項5) ■請求項2の■■■■のばかに次のような作用を得る電
気的接続部材の配線パターンを有する電気的接続部材は
保持体の一方又は両方に配線パターンを有するため作製
しやすく、従って安価な電気的接続部材が得られる。ひ
いては、安価な電気回路部材が得られる。
(Claim 5) ■In addition to ■■■■ of Claim 2, an electrical connection member having a wiring pattern that obtains the following effect has a wiring pattern on one or both of the holders. An electrical connection member that is easy to produce and therefore inexpensive can be obtained. As a result, an inexpensive electric circuit member can be obtained.

本発明で、封止材を用いて封止する場合、電気的接続部
材は、金属部材が保持体中に埋め込まれて構成されてい
るため、封止材を注入したときの封止圧力、封止速度等
に影響されることが少なくなり、いかなる封止方法でも
用いることかできる。つまり、従来できなかった熱可塑
性樹脂のような非常に高圧な注入が要求されるものによ
る封止も可能となった。
In the present invention, when sealing is performed using a sealing material, since the electrical connection member is configured with a metal member embedded in a holder, the sealing pressure when the sealing material is injected, It is less affected by sealing speed, etc., and any sealing method can be used. In other words, it has become possible to seal with materials that require extremely high-pressure injection, such as thermoplastic resins, which were previously impossible.

また、本発明において、封止材の少なくとも一方の面の
少なくとも一部に板が接合されている場合、電気的接続
部材に接続されている電気回路部品の電気的接続部材と
は反対側の面に接合されている板又は電気回路部品の一
方又は両方の少なくとも一部が埋め込まれている場合、
又は、封止材により電気回路部品の1つ又は複数の側面
近傍に配設された板の少なくとも一部が埋め込まれてい
る場合には、装置に内部応力が発生したり外部から力が
加わったりしても応力集中を緩和でき、応力集中から生
ずることのある割れ等を防止することができる。また、
この板は外界から電気回路部品に至るまでの経路を長く
する作用もあり、そのため外部からの水等は電気回路部
品に浸入しにくくなる。従って装置の信頼性を高めるこ
とができる。
Further, in the present invention, when a plate is bonded to at least a part of at least one surface of the sealing material, the surface of the electrical circuit component that is connected to the electrical connection member on the opposite side to the electrical connection member If at least a part of one or both of the board or electric circuit component connected to the board is embedded,
Alternatively, if at least a portion of a plate disposed near one or more sides of an electrical circuit component is embedded in the encapsulant, internal stress may be generated in the device or external force may be applied to the device. However, stress concentration can be alleviated, and cracks, etc. that may occur due to stress concentration can be prevented. Also,
This plate also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water or the like to enter the electrical circuit components from the outside. Therefore, the reliability of the device can be improved.

なお、板の材質がステンレス等の金属、熱伝導性の良い
セラミック、カーボン、ダイヤモンド等である場合には
、電気回路部品から発生した熱を速やかに外界へ放熱す
ることかできるため、放熱特性の優れた電気回路部材が
得られる。さらに、板の材質が金属である場合には、外
界からのノイズを遮断でき、ノイズの影響を受けにくい
、また、電気回路部品から発生する電磁気ノイズを遮断
できる良好な特性の電気回路部材が得られる。
In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit member can be obtained. Furthermore, when the material of the plate is metal, it is possible to obtain electrical circuit members that can block noise from the outside world, are less susceptible to noise effects, and have good characteristics that can block electromagnetic noise generated from electrical circuit components. It will be done.

また、本発明においてキャップ封止する場合、電気回路
部材が中空になっているので熱が加わっても熱応力の発
生が少なく、信頼性の高い電気回路部材が得られる。ま
た、キャップと電気回路部品を当接し、キャップに熱伝
導性の良い材料を用いた場合、電気回路部品から発生し
た熱がキャップを介して迅速に外部に伝導するので、よ
り放熱特性が優れた電気回路部材を得られる。さらに、
キャップがノイズ遮蔽性の良い材料、特に鉄系等の金属
よりなる場合には、よりシールド効果が優れた電気回路
部材を得られる。また、キャップと電気回路部品の間に
調整用部材を介在させた場合、電気回路部品の高さのバ
ラツキが生じる場合でも効率よく組み立てを行うことが
可能となる。
Further, when sealing with a cap in the present invention, since the electric circuit member is hollow, there is little thermal stress generated even when heat is applied, and a highly reliable electric circuit member can be obtained. In addition, if the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components will be quickly conducted to the outside through the cap, resulting in better heat dissipation characteristics. Electric circuit members can be obtained. moreover,
When the cap is made of a material with good noise shielding properties, particularly a metal such as iron, an electric circuit member with a more excellent shielding effect can be obtained. Further, when an adjustment member is interposed between the cap and the electric circuit component, it is possible to assemble the electric circuit component efficiently even when the height of the electric circuit component varies.

なお、本発明において、電気的接続部材の絶縁体に熱伝
導性のよい材料を用いた場合、封止材に熱伝導性のよい
粉体、繊維、板状体、棒状体、球状体等が分散されてい
る場合、電気回路部品から発熱される熱がより早く外界
へ逃げ、熱放散性の良い電気回路部材が得られる。また
、電気的導電部材の絶縁体が電気回路部品の熱膨張係数
に近い材料を用いた場合、封止材に電気回路部品の熱膨
張係数が近い粉体、繊維、板状体、棒状体、球状体等の
一方ないし両方が分散されている場合、熱膨張係数が電
気回路部品の熱膨張係数に近づき、熱が加わった場合に
生ずることのある、封止材、電気回路部品の割れ、ある
いは電気回路部品の特性変化という、電気回路部材の信
頼性を損なう現象を防止でき、信頼性の高い電気回路部
材が得られる。
In addition, in the present invention, when a material with good thermal conductivity is used for the insulator of the electrical connection member, powder, fiber, plate-shaped body, rod-shaped body, spherical body, etc. with good thermal conductivity is used as the sealing material. When the heat is dispersed, the heat generated from the electric circuit components escapes to the outside world more quickly, and an electric circuit member with good heat dissipation properties can be obtained. In addition, when the insulator of the electrically conductive member is made of a material with a thermal expansion coefficient close to that of the electric circuit component, the sealing material may be a powder, fiber, plate-shaped body, rod-shaped body, etc. whose thermal expansion coefficient is close to that of the electric circuit component. If one or both of the spherical bodies etc. are dispersed, the coefficient of thermal expansion approaches that of the electrical circuit components, which may cause cracks in the encapsulant or electrical circuit components, which may occur when heat is applied. A phenomenon that impairs the reliability of an electric circuit member, such as a change in the characteristics of the electric circuit component, can be prevented, and a highly reliable electric circuit member can be obtained.

なお、電気回路部品のすべてが電気的接続部材を介して
金属化及び/又は合金化により形成された接続層により
接続されていると、電気回路部品相互の接触抵抗が、1
つの電気回路部品のみを接続した場合に比べてより小さ
くなる。
Note that if all of the electrical circuit components are connected via electrical connection members by connection layers formed by metallization and/or alloying, the contact resistance between the electrical circuit components will be 1.
It is smaller than when only one electrical circuit component is connected.

一方、少なくとも1以上の電気回路部品を金属化及び/
又は合金化による接続以外の接続により行なうと、金属
化及び/又は合金化時に生じる電気回路部品の熱による
劣化を防止することができる。また、用途によっては電
気回路部品を着脱自在にしておきたい場合があり、この
ような場合にその電気回路部品を金属化及び/又は合金
化による接続以外の接続層なえば、その要望に応じるこ
とが可能となる。
On the other hand, at least one or more electric circuit components are metallized and/or
Alternatively, if the connection is made by a connection other than the connection by alloying, it is possible to prevent the electric circuit components from deteriorating due to heat that occurs during metallization and/or alloying. Additionally, depending on the application, it may be necessary to make electrical circuit components removable, and in such cases, if the electrical circuit components have a connection layer other than metallized and/or alloyed connections, we can meet that request. becomes possible.

さらに、絶縁体としてシールド効果が大きい材料を選択
することにより、電気回路部品から外界に出る電磁気ノ
イズを減少させることができ、また、外界から電気回路
部品へ入るノイズを減少させることもできる。
Furthermore, by selecting a material with a high shielding effect as the insulator, it is possible to reduce electromagnetic noise that exits from the electrical circuit components to the outside world, and it is also possible to reduce noise that enters the electrical circuit components from the outside world.

(以下余白) [実施例コ (実施例1) 本発明の実施例1を第1図及び第2図に基づいて説明す
る。
(The following is a margin) [Example 1 (Example 1) Example 1 of the present invention will be described based on FIGS. 1 and 2.

本実施例に係る電気回路部材は、有機材料よりなる保持
体111と、保持体111中に埋設された複数の金属部
材107とを有し、金属部材107の一端が保持体11
1の一方の面において露出しており、また、金属部材1
07の他端が保持体111の他方の面において露出して
おり、かつ配線パターン300を有する2個の電気的接
続部材125,128を積層し、電気的接続部材125
の金属部材107と配線パターン300の接続部と電気
的接続部材128の金属部材107の接続部を金属化及
び/又は合金化により接続した電気的接続部材125,
128と: 複数の接続部102を有し、この接続部102において
、保持体111の面に露出している金属部材107の端
108と接続されている半導体素子101とを有してい
る。
The electric circuit member according to this embodiment includes a holder 111 made of an organic material and a plurality of metal members 107 embedded in the holder 111, with one end of the metal member 107 connected to the holder 111.
The metal member 1 is exposed on one side of the metal member 1.
The other end of 07 is exposed on the other surface of the holder 111, and the two electrical connection members 125 and 128 having the wiring pattern 300 are laminated to form the electrical connection member 125.
An electrical connection member 125 in which the connection portion between the metal member 107 and the wiring pattern 300 and the connection portion of the metal member 107 of the electrical connection member 128 are connected by metallization and/or alloying,
128: It has a plurality of connection parts 102, and in these connection parts 102, it has the semiconductor element 101 connected to the end 108 of the metal member 107 exposed on the surface of the holder 111.

なお、本例では半導体素子101が封止されている。Note that in this example, the semiconductor element 101 is sealed.

以下に本実施例をより詳細に説明する。This example will be explained in more detail below.

まず、電気的接続部材125の一製造例を説明しつつ電
気的接続部材125を説明する。
First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

第2図に一製造例を示す。FIG. 2 shows one manufacturing example.

まず、第2図(a)に示すように、20μmφのAu等
の金属あるいは合金よりなる金属線121を、ピッチ4
0μmとして棒122に巻き付け、巻き付は後、ポリイ
ミド等の樹脂123中に上記金属線121を埋め込む。
First, as shown in FIG. 2(a), metal wires 121 made of a metal such as Au or an alloy with a diameter of 20 μm are wired at a pitch of 4.
The metal wire 121 is wound around a rod 122 with a thickness of 0 μm, and after wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide.

埋め込み後上記樹脂123を硬化させる。硬化した樹脂
123は絶縁体となる。その後、点線124の位置でス
ライス切断し、電気的接続部材125を作成する。
After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125.

このようにして作成された電気的接続部材125を第2
図(b)、(c)に示す。
The electrical connection member 125 created in this way is
Shown in Figures (b) and (c).

その後電気的接続部材+25に配線パターン300を作
るために蒸着またはスパッタリング法で銅をつけ、不要
部分の銅をエツチングすることによりパターニングし、
ざらに金メツキをつける。
After that, in order to form a wiring pattern 300 on the electrical connection member +25, copper is applied by vapor deposition or sputtering, and patterning is performed by etching the copper in unnecessary parts.
Add gold plating to the surface.

このように作成された電気的接続部材125を第2図(
d)に示す。パターニングのために銅を蒸着し、パター
ニングし金メツキをつけると述べたが、この方法以外の
方法を用いてパターニングを行なってもよい。
The electrical connection member 125 created in this way is shown in FIG.
Shown in d). Although it has been described that copper is vapor-deposited, patterned, and gold-plated for patterning, a method other than this method may be used for patterning.

なお、電気的接続部材125は保持体111の両面に配
線パターン300を有している。
Note that the electrical connection member 125 has wiring patterns 300 on both sides of the holder 111.

このように作成された電気的接続部材125において、
金属線121が金属部材107を構成し、樹脂123が
保持体(絶縁体)111を構成する。
In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

また、本実施例では第1図(d)で示す電気的接続部材
125の他にもう1つの電気的接続部材128を用いる
。電気的接続部材128の製造法は電気的接続部材12
5の製造法と同じであるが、異なる点は金属部材107
の配置とパターニングの点である。パターニングは電気
的接続部材128の保持体111の片面について行ない
片面に配線パターンを有している。
Further, in this embodiment, another electrical connection member 128 is used in addition to the electrical connection member 125 shown in FIG. 1(d). The method for manufacturing the electrical connection member 128 is the method for manufacturing the electrical connection member 128.
The manufacturing method is the same as No. 5, but the difference is that the metal member 107
The key points are placement and patterning. The patterning is performed on one side of the holder 111 of the electrical connection member 128, so that one side has a wiring pattern.

次に2枚の電気的接続部材125,128を用意する。Next, two electrical connection members 125 and 128 are prepared.

その後、両者の接続部が合うように位置決めを行ない、
熱圧着により接続部を金属化及び/又は合金化を行ない
接続する。
After that, position the two so that the connecting parts match,
The connection is made by metallizing and/or alloying the connection part by thermocompression bonding.

なお、金属化及び/又は合金化するために熱圧着法を用
いると述べたが熱圧着法に限らず他の外部加熱法、内部
加熱法を用いてもよい。
Although it has been described that the thermocompression bonding method is used for metallization and/or alloying, the thermocompression bonding method is not limited to this, and other external heating methods and internal heating methods may be used.

この電気的接続部材125,128においては金属部材
となる金属線121同士は配線パターンを除くと、樹脂
123により電気的に絶縁されている。また、金属線1
21の一端は半導体素子101側に露出している。この
露出している部分は半導体素子101の接続部108と
なる。
In the electrical connection members 125 and 128, the metal wires 121 serving as metal members are electrically insulated from each other by the resin 123, except for the wiring pattern. Also, metal wire 1
One end of 21 is exposed to the semiconductor element 101 side. This exposed portion becomes the connection portion 108 of the semiconductor element 101.

次に、第1図(a)に示すように、半導体素子101、
電気的接続部材125,128を用意する。本例で使用
する半導体素子101はその内部に多数の接続部102
を有している。
Next, as shown in FIG. 1(a), a semiconductor element 101,
Electrical connection members 125 and 128 are prepared. The semiconductor element 101 used in this example has many connections 102 inside.
have.

なお、半導体素子101の接続部102は電気的接続部
材+25の接続部108に対応する位置に金属が露出し
ている。
Note that metal is exposed in the connection portion 102 of the semiconductor element 101 at a position corresponding to the connection portion 108 of the electrical connection member +25.

半導体素子101の接続部102と、電気的接続部材1
25の接続部108とが対応するように位置決めを行な
い、位置決め後、半導体素子101の接続部102のA
j2と電気的接続部材125の接続部10BのAuとを
金属化及び/又は合金化して接続する(第1図(b))
Connection portion 102 of semiconductor element 101 and electrical connection member 1
After positioning, A of the connecting portion 102 of the semiconductor element 101 is aligned so that the connecting portion 108 of the semiconductor element 101 corresponds to the
j2 and Au of the connection part 10B of the electrical connection member 125 are metallized and/or alloyed and connected (FIG. 1(b))
.

次に、以上のようにして作成した部材(電気回路部材)
の電気回路部品を封止した(第1図(C))。なお、本
例では半導体素子101を封止した。封止材170は5
i02よりなる粉末を配合させた熱可塑性樹脂を用い、
封止方法として滴下法を用いた。
Next, the parts created as described above (electric circuit parts)
The electrical circuit components were sealed (Fig. 1(C)). Note that in this example, the semiconductor element 101 was sealed. The sealing material 170 is 5
Using a thermoplastic resin mixed with powder made of i02,
A dropping method was used as the sealing method.

さらに電気的接続部材125の半導体素子101が接続
されている逆の面に電気的絶縁をするために絶縁シート
301を貼り付けた。
Further, an insulating sheet 301 was attached to the opposite surface of the electrical connection member 125 to which the semiconductor element 101 was connected for electrical insulation.

第1図(d)〜第1図(g)に他の封止方法を示す。第
1図(d)は第1図(C)の封止材170上に板151
を接合させた図を示し、第1図(e)は半導体素子10
1の電気的接続部材とは反対側に板151を接合させた
のち封止材170により封止した例を示し、第1図(f
)に半導体素子101の近傍に板151を配設させ封止
材170により封止した例を示し、第1図(g)はキャ
ップ155によりキャップ封止した例を示し、中空部1
58を有している。
Other sealing methods are shown in FIGS. 1(d) to 1(g). FIG. 1(d) shows a plate 151 on the sealing material 170 of FIG. 1(C).
FIG. 1(e) shows the semiconductor element 10 bonded together.
Fig. 1 (f
) shows an example in which a plate 151 is disposed near the semiconductor element 101 and sealed with a sealing material 170, and FIG. 1(g) shows an example in which the cap is sealed with a cap 155.
It has 58.

以上のように作製した電気回路装置につき、その接続部
の接続性を調べたところ、高い信頼性をもって接続され
ていた。さらに各種特性の信頼性も優れていた。
When the connectivity of the connection portions of the electrical circuit device manufactured as described above was examined, it was found that the connections were highly reliable. Furthermore, the reliability of various characteristics was also excellent.

(実施例2) 第3図に実施例2を示す。(Example 2) Example 2 is shown in FIG.

本例は、電気回路部品として接続部102以外の部分が
絶縁膜103で覆われている半導体素子101を使用し
ている例である。
In this example, a semiconductor element 101 whose portions other than the connecting portions 102 are covered with an insulating film 103 is used as an electric circuit component.

また、電気的接続部材125としては第4図に示すもの
を使用した。すなわち、第4図に示す電気的接続部材1
25は金属部材107の露出している部分が保持体(樹
脂絶縁体)111の面から突出している。
Further, as the electrical connection member 125, the one shown in FIG. 4 was used. That is, the electrical connection member 1 shown in FIG.
25, the exposed portion of the metal member 107 protrudes from the surface of the holder (resin insulator) 111.

このような電気的接続部材125の作製は、例えば、次
の方法によればよい。
Such electrical connection member 125 may be manufactured, for example, by the following method.

まず、実施例1で述べた方法により、第2図(b)、(
c)に示す電気的接続部材を用意する。次にこの電気的
接続部材の両面を、金属線121が、ポリイミド樹脂1
23から10μm程度突出するまでエツチングすればよ
い。
First, by the method described in Example 1, Fig. 2(b), (
Prepare the electrical connection member shown in c). Next, metal wires 121 are connected to both surfaces of this electrical connection member using polyimide resin 1.
Etching may be performed until it protrudes from 23 by about 10 μm.

なお、本実施例では金属線121の突出量を10μmと
したが、いかなる量でもよい。
Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but any amount may be used.

また、金属線121を突出させる方法としてはエツチン
グに限らず、他の化°学的な方法又はWUtIi的な方
法を使用してもよい。
Further, the method for protruding the metal wire 121 is not limited to etching, but other chemical methods or WUtIi methods may be used.

その後、第2図(d)に示すように保持体111の両面
に配線パターンを設け、第4図(a)、(b)に示す電
気的接続部材125を作製する。
Thereafter, wiring patterns are provided on both sides of the holder 111 as shown in FIG. 2(d), and the electrical connection member 125 shown in FIGS. 4(a) and 4(b) is produced.

さらに電気的接続部材128も同様の製造方法で作製す
る。異なる点は金属線121の配置、数量、配線パター
ン300である。配線パターン300は保持体111の
片面に設けた。
Furthermore, the electrical connection member 128 is also manufactured using the same manufacturing method. The differences are the arrangement and quantity of metal wires 121, and the wiring pattern 300. The wiring pattern 300 was provided on one side of the holder 111.

他の点は実施例1と同材である。The other points are the same as in Example 1.

なお、突出部を、電気的接続部材125を金属線121
の位置に凹部を持った型に挟み込み、金属線121の突
起126をつぶすことにより第5図に示すようなバンブ
150を形成してもよい。この場合金属線121は絶縁
体111から脱落しにくくなる。
Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 5 may be formed by inserting the metal wire 121 into a mold having a recess at the position and crushing the protrusion 126 of the metal wire 121. In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

なお、本例でも、金属線121が金属部材107を構成
し、さらに、樹脂123が絶縁体111を構成する。
Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

なお、バンブを作成するのには突起を熱で溶融させ、バ
ンブを作成してもよいし、他のいかなる方法でもよい。
Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

本例においても接続部は高い信頼性を持って接続されて
いた。
In this example as well, the connection section was connected with high reliability.

さらに、各種特性の信頼性も優れていた。Furthermore, the reliability of various characteristics was also excellent.

(実施例3) 第6図に実施例3を示す。(Example 3) Example 3 is shown in FIG.

実施例3は4枚の電気的接続部材を用い、3個の半導体
り子を接続させたものである。
In Example 3, four electrical connection members are used to connect three semiconductor gates.

電気的接続部材125,128,129゜130は実施
例2に示す保持体111より金属線121を突出させた
ものである。実施例2と異なる点は、金属線121の配
貨と数量と配線パターン、ざらに保持体111に5in
2よりなる粉末を配合した点である。
The electrical connection members 125, 128, 129.degree. 130 have metal wires 121 protruding from the holder 111 shown in the second embodiment. The difference from the second embodiment is the distribution and quantity of the metal wires 121, the wiring pattern, and the 5-inch wire on the holding body 111.
The point is that the powder consisting of 2 is blended.

また、本例の電気的接続部材125,128゜129.
130は前記実施例とは異なフている。
Further, the electrical connection members 125, 128°, 129.
Reference numeral 130 has a different design from the previous embodiment.

つまり、大きさ、金属線121の配置、数量、配線パタ
ーン300が異なっている。配線パターン300は電気
的接続部材129を除いては保持体111の片面に有し
ている。電気的接続部材129は両面に配線パターン3
00を有している。なお、配線パターンは接続部を除い
て絶縁皮膜が存在しており積層した時に互いに導通しな
いようにしである。
That is, the size, arrangement and quantity of metal wires 121, and wiring patterns 300 are different. The wiring pattern 300 is provided on one side of the holder 111 except for the electrical connection member 129. The electrical connection member 129 has wiring patterns 3 on both sides.
00. It should be noted that the wiring pattern has an insulating film except for the connecting portions, so that when the wiring patterns are laminated, they are not electrically connected to each other.

本実施例では半導体素子201,202゜203を電気
的接続部材に接続した。半導体素子201.203の接
続部204,206と電気的接続部材125,128,
130の接続部は熱圧着法により金属化及び/又は合金
化によって接続したが、半導体素子202の接続部20
5と電気的接続部材129の接続部とは押圧により接続
した。
In this embodiment, semiconductor elements 201, 202, and 203 were connected to electrical connection members. Connection parts 204, 206 of semiconductor elements 201, 203 and electrical connection members 125, 128,
The connection portion 130 of the semiconductor element 202 was connected by metallization and/or alloying by thermocompression bonding, but the connection portion 20 of the semiconductor element 202
5 and the connection portion of the electrical connection member 129 were connected by pressing.

なお、半導体素子203は2つの電気的接続部材128
,130にまたがって接続されている。
Note that the semiconductor element 203 has two electrical connection members 128.
, 130.

さらに、電気的接続部材129の半導体素子202の側
の一部の面には電気的絶縁を図るために絶縁シート30
1を接着剤により接着させた。
Further, an insulating sheet 30 is provided on a part of the surface of the electrical connection member 129 on the semiconductor element 202 side for electrical insulation.
1 was adhered with an adhesive.

その他の点は実施例2と同様である。The other points are the same as in the second embodiment.

本例においても接続部は高い信頼性を持って接続されて
いた。
In this example as well, the connection section was connected with high reliability.

さらに、各種特性の信頼性も優れていた。Furthermore, the reliability of various characteristics was also excellent.

(実施例4) 第7図に実施例4に使用する電気的接続部材125を示
す。
(Example 4) FIG. 7 shows an electrical connection member 125 used in Example 4.

第7図(a)は電気的接続部材の製造途中の断面図、第
7図(b)は上記電気的接続部材の斜視図、第7図(C
)は上記の断面図である。
FIG. 7(a) is a sectional view of the electrical connection member during manufacture, FIG. 7(b) is a perspective view of the electrical connection member, and FIG.
) is the above sectional view.

予めアルミナセラミックよりなる保持体127に、20
μmφより大ぎい径の穴142をあけておく。次に穴1
42に20μmφのAu等の金属あるいは合金よりなる
金属線121を通し、樹脂123を保持体127と金属
線121との間に入れ、樹脂123を硬化させる。硬化
した樹脂123は介在物となる。その後、金属線121
を点線124の位置でスライス切断し、電気的接続部材
125を作成する。このようにして作成した電気的接続
部材125を第7図(b)、(c)に示す。
A holder 127 made of alumina ceramic has 20
A hole 142 with a diameter larger than μmφ is drilled. Next hole 1
A metal wire 121 made of a metal such as Au or an alloy having a diameter of 20 μm is passed through 42, a resin 123 is placed between the holder 127 and the metal wire 121, and the resin 123 is hardened. The hardened resin 123 becomes an inclusion. After that, the metal wire 121
is cut into slices at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 7(b) and 7(c).

さらに配線パターン300を保持体の両面に設けた図を
第7図(d)に示す。同様にして作製した別の電気的接
続部材の接続部を接続させ電気的接続部材とした。
Furthermore, a diagram in which wiring patterns 300 are provided on both sides of the holder is shown in FIG. 7(d). The connection portions of another electrical connection member produced in the same manner were connected to obtain an electrical connection member.

さらに配線パターン300を保持体の両面に設けた図を
第7図(d)に示す。同様にして作製した別の電気的接
続部材の接続部を接続させ電気的接続部材とした。
Furthermore, a diagram in which wiring patterns 300 are provided on both sides of the holder is shown in FIG. 7(d). The connection portions of another electrical connection member produced in the same manner were connected to obtain an electrical connection member.

また、本例の電気的接続部材を加工して、第4図に示す
ように突起を設けてもよいし、第5図に示すようにバン
ブ150を設けてもよい。
Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 4, or a bump 150 as shown in FIG. 5.

他の点は実施例1と同様である。Other points are the same as in Example 1.

本例においても接続部は高い信頼性を持って接続されて
いた。
In this example as well, the connection section was connected with high reliability.

さらに、各種特性の信頼性も優れていた。Furthermore, the reliability of various characteristics was also excellent.

(実施例5) 第8図に実施例5を示す。(Example 5) Example 5 is shown in FIG.

本例においては、電気的接続部材125は、実施例2に
示した電気的接続部材と異なる。すなわち、本例の電気
的接続部材125においては、金属部材同士のピッチが
実施例2で示したものよりも狭くなっている。すなわち
、本例では、半導体素子101の接続部の間隔よりも狭
い間隔に金属部材107同士のピッチを設定しである。
In this example, the electrical connection member 125 is different from the electrical connection member shown in the second embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the second embodiment. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the connecting portions of the semiconductor element 101.

つまり、実施例2では、半導体素子101と電気的接続
部材125の接続位置を配置したため、電気的接続部材
125の正確な位置決めが必要であったが、本例では、
半導体素子101と電気的接続部材125との位置決め
は正確でなくともよい。さらに電気的接続部材125,
128との位置決めも粗略でよい。そのため、半導体素
子101の接続寸法(dll、pH)と電気的接続部材
の接続寸法(cz2.pH2)を適切な値に運ぶことに
より略正確な位置決めで接続することも可能である。
That is, in the second embodiment, since the connection position between the semiconductor element 101 and the electrical connection member 125 was arranged, it was necessary to accurately position the electrical connection member 125, but in this example,
The positioning of the semiconductor element 101 and the electrical connection member 125 does not have to be accurate. Furthermore, the electrical connection member 125,
The positioning with 128 may also be rough. Therefore, by adjusting the connection dimensions (dll, pH) of the semiconductor element 101 and the connection dimensions (cz2.pH2) of the electrical connection member to appropriate values, it is also possible to connect with approximately accurate positioning.

他の点は実施例2と同様である。The other points are the same as in the second embodiment.

本例においても接続部は高い信頼性を持って接続されて
いた。
In this example as well, the connection section was connected with high reliability.

さらに、各種特性の信頼性も優れていた。Furthermore, the reliability of various characteristics was also excellent.

[発明の効果] 本発明は以上のように構成したので次の数々の効果が得
られる。
[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

(請求項1) 本発明の請求項1によれば以下に述べる請求項2の電気
回路部材に使用する電気的接続部材を製造することがで
きる。
(Claim 1) According to Claim 1 of the present invention, it is possible to manufacture an electrical connection member for use in the electric circuit member of Claim 2 described below.

(請求項2) ■半導体素子と回路基板リードフレーム等の電気回路部
品の接続に関し、信頼性の高い接続が得られる。従って
、従来用いられていたワイヤホンディング方式、TAB
方式、CCB方式と置き代えることが可能となる。
(Claim 2) (2) A highly reliable connection can be obtained with respect to the connection between a semiconductor element and an electric circuit component such as a circuit board lead frame. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

■本発明では、上記した電気的接続部材を使用して1個
以上の電気回路部品を接続すると、電気回路部品の接続
部を外周縁部はもとより内部に配置することも可能とな
り、接続部の数を増加させることができ、ワイヤホンデ
ィング方式、TAB方式よりもさらに多点接続が可能と
なり、多ビン接続向きの方式となる。さらに電気的接続
部材の隣接金属間に予め電気絶縁物質が存在することに
より隣接ピッチを狭くしても隣接金属間の電気的導通が
起こらないことよりCCB方式よりもされに多点接続が
可能となる。
■In the present invention, when one or more electrical circuit components are connected using the above-mentioned electrical connection member, it becomes possible to arrange the connection portion of the electrical circuit component not only on the outer periphery but also inside the connection portion. The number of connections can be increased, making it possible to connect more points than the wire honding method and the TAB method, making it a method suitable for multi-bin connections. Furthermore, since an electrically insulating material exists between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect multiple points more easily than with the CCB method. Become.

■また、電気的接続部材を薄くすることが可能であり、
この面からも電気回路部材の薄型化が可能となる。
■Also, it is possible to make the electrical connection member thinner,
Also from this point of view, it is possible to make the electric circuit member thinner.

■さらに、電気的接続部材に使用する金属部材の量は少
ないため、例え、高価である金を金属部材として使用し
たとしてもコスト低減が可能となる。
(2) Furthermore, since the amount of metal members used for electrical connection members is small, costs can be reduced even if expensive gold is used as the metal member.

■電気的接続部材は複数の電気的接続部材を積層した構
成をとっていることにより、高密度で多層な回路基板を
作製することができ、しかも安価に作製することが可能
となる。
(2) Since the electrical connection member has a structure in which a plurality of electrical connection members are laminated, a high-density, multilayer circuit board can be manufactured, and it can be manufactured at low cost.

■また、さらに複数の電気的接続部材の保持体を異種の
材料構成にすると様々な効果が得られる。例えば、比誘
電率が高い材料を挟み込むとコンデンサーが得られ、ま
た、強磁性材料を分散させた材料を挟み込むと特性の良
いコイルが得られる等、様々な機能性基板が得られる。
(2) Further, various effects can be obtained by using different materials for the holders of the plurality of electrical connection members. For example, by sandwiching a material with a high dielectric constant, a capacitor can be obtained, and by sandwiching a material in which a ferromagnetic material is dispersed, a coil with good characteristics can be obtained, and various other functional substrates can be obtained.

しかも、電気回路部品とりわけ半導体素子を直接に、し
かも容易に電気的接続部材に接続できるため、工数が低
減し、安価な半導体装置を得ることが可能となる。
Moreover, since electrical circuit components, particularly semiconductor elements, can be directly and easily connected to electrical connection members, the number of man-hours can be reduced, and it is possible to obtain an inexpensive semiconductor device.

(請求項3、請求項6) ■電気回路部品が、電気的接続部材に、金属化及び/又
は合金化により接続されていると、電気回路部品が強固
(強度的r;強く)かつ確実に接続されるので、接続抵
抗値は小さく、そのバラツキも小さく、さらに機械的に
強く、不良率の極めて低い電気回路部材を得ることがで
きる。
(Claim 3, Claim 6) ■ When the electric circuit component is connected to the electrical connection member by metallization and/or alloying, the electric circuit component is strong (strong) and reliable. Since they are connected, it is possible to obtain an electrical circuit member that has a small connection resistance value, small variation in connection resistance, is mechanically strong, and has an extremely low defect rate.

■また、電気回路部品を、電気的接続部材に金属化及び
/又は合金化により接続されていると、電気回路部材の
作成工程中及び作成後において、治具等を使用して電気
回路部品を保持する必要がなく、電気回路部材の作成及
び作成後の管理が容易である。
■In addition, if electrical circuit components are connected to electrical connection members by metallization and/or alloying, a jig or the like may be used to connect the electrical circuit components during or after the electrical circuit component creation process. There is no need to hold it, and it is easy to create the electric circuit member and manage it after it is created.

(請求項4) ■本発明の請求項4によれば作製し易い電気的接続部材
が得られ、以下に述べる請求項5の電気回路部材に使用
する電気的接続部材を安価に製造することができる。
(Claim 4) ■According to Claim 4 of the present invention, an electrical connection member that is easy to manufacture can be obtained, and the electrical connection member used in the electric circuit member of Claim 5 described below can be manufactured at low cost. can.

(請求項5) 請求項2の■■■■■の他に次のような効果が得られる
(Claim 5) In addition to ■■■■■ of claim 2, the following effects can be obtained.

■電気的接続部材の配線パターンを有する電気的接続部
材は保持体の一方又は両方に配線パターンを有するため
作製しやすく、従って、安価な電気的接続部材が得られ
、ひいては安価な電気回路部材が得られる。
■Electrical connection members with wiring patterns are easy to manufacture because they have wiring patterns on one or both of the holders, and therefore inexpensive electrical connection members can be obtained, and in turn, inexpensive electric circuit components can be obtained. can get.

本発明で、封止材を用いて封止する場合、電気的接続部
材は、全屈部材が保持体中に埋め込まれて構成されてい
るため、封止材を注入したとぎの封止圧力、封止速度等
に影響されることが少なくなり、いかなる封止方法でも
用いることができる。つまり、従来できなかった熱可塑
性樹脂のような非常に高圧な注入が要求されるものによ
る封止も可能となった。
In the present invention, when sealing is performed using a sealing material, since the electrical connection member is configured with a fully bent member embedded in a holding body, the sealing pressure after injecting the sealing material, It is less affected by sealing speed and the like, and any sealing method can be used. In other words, it has become possible to seal with materials that require extremely high-pressure injection, such as thermoplastic resins, which were previously impossible.

また、本発明において、封止材の少なくとも一方の面の
少なくとも一部に板が接合されている場合、電気的接続
部材に接続されている電気回路部品の電気的接続部材と
は反対側の面に接合されている板又は電気回路部品の一
方又は両方の少なくとも一部が埋め込まれている場合、
又は、封止材により電気回路部品の1つ又は複数の側面
近傍に配設された板の少なくとも一部が埋め込まれてい
る場合には、装置に内部応力が発生したり外部から力が
加ねフたりしても応力集中を緩和でき、応力集中から生
ずることのある割れ等を防止することかできる。また、
この板は外界から電気回路部品に至るまでの経路を長く
する作用もあり、そのため外部からの水等は電気回路部
品に浸入しにくくなる。従って装置の信頼性を高めるこ
とができる。
Further, in the present invention, when a plate is bonded to at least a part of at least one surface of the sealing material, the surface of the electrical circuit component that is connected to the electrical connection member on the opposite side to the electrical connection member If at least a part of one or both of the board or electric circuit component connected to the board is embedded,
Alternatively, if at least a portion of a plate disposed near one or more sides of an electrical circuit component is embedded in the encapsulant, internal stress may be generated in the device or external force may not be applied to the device. It is possible to alleviate stress concentration even if the stress concentration occurs, and it is possible to prevent cracks and the like that may occur due to stress concentration. Also,
This plate also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water or the like to enter the electrical circuit components from the outside. Therefore, the reliability of the device can be improved.

なお、板の材質がステンレス等の金属、熱伝導性の良い
セラミック、カーボン、ダイヤモンド等である場合には
、電気回路部品から発生した熱を速やかに外界へ放熱す
ることができるため、放熱特性の優れた電気回路部材が
得られる。さらに、板の材質が金属である場合には、外
界からのノイズを遮断でき、ノイズの影響を受けにくい
、また電気回路部品から発生する電磁気ノイズを遮断で
きる良好な特性の電気回路部材が得られる。
In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit member can be obtained. Furthermore, when the material of the plate is metal, it is possible to obtain an electrical circuit member with good characteristics that can block noise from the outside world, is less susceptible to the effects of noise, and can block electromagnetic noise generated from electrical circuit components. .

また、本発明においてキャラ1ブ封止する場合、電気回
路部材が中空になっているので熱が加わっても熱応力の
Il生が少なく、信頼性の高い電気回路部材が得られる
。また、キャップと電気回路部品を当接し、キャップに
熱伝導性の良い材料を用いた場合、電気回路部品から発
生した熱がキャップを介して迅速に外部に伝導するので
、より放熱特性が優れた電気回路部材を得られる。さら
に、キャップがノイズ遮蔽性の良い材料、特に鉄系等の
金属よりなる場合には、よりシールド、効果が優れた電
気回路部材を得られる。また、キャップと電気回路部品
の間に調整用部材を介在させた場合、電気回路部品の高
さのバラツキが生じる場合でも効率よく組み立てを行う
ことが可能となる。
Furthermore, in the case of sealing with a single tube in the present invention, since the electric circuit member is hollow, even if heat is applied, the generation of thermal stress is small, and a highly reliable electric circuit member can be obtained. In addition, if the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components will be quickly conducted to the outside through the cap, resulting in better heat dissipation characteristics. Electric circuit members can be obtained. Furthermore, if the cap is made of a material with good noise shielding properties, particularly metal such as iron, an electric circuit member with better shielding and effectiveness can be obtained. Further, when an adjustment member is interposed between the cap and the electric circuit component, it is possible to assemble the electric circuit component efficiently even when the height of the electric circuit component varies.

なお、本発明において、電気的接続部材の絶縁体に熱伝
導性のよい材料を用いた場合、封止材に熱伝導性のよい
粉体、繊維、板状体、棒状体、球状体等が分散されてい
る場合、電気!路部品から発熱される熱がより早く外界
へ逃げ、熱放散性の良い電気回路部材が得られる。また
、電気的導電部材の絶縁体が電気回路部品の熱膨張係数
に近い材料を用いた場合、封止材に電気回路部品の熱膨
張係数が近い粉体、繊維、板状体、棒状体、球状体等の
一方ないし両方が分散されている場合、熱膨張係数が電
気回路部品の熱膨張係数に近づき、熱が加わった場合に
生ずることのある、封止材、電気回路部品の割れ、ある
いは電気回路部品の特性変化という、電気回路部材の信
頼性を損なう現象を防止でき、信頼性の高い電気回路部
材が得られる。
In addition, in the present invention, when a material with good thermal conductivity is used for the insulator of the electrical connection member, powder, fiber, plate-shaped body, rod-shaped body, spherical body, etc. with good thermal conductivity is used as the sealing material. Electricity if distributed! The heat generated from the circuit components escapes to the outside world more quickly, and an electric circuit member with good heat dissipation properties can be obtained. In addition, when the insulator of the electrically conductive member is made of a material with a thermal expansion coefficient close to that of the electric circuit component, the sealing material may be a powder, fiber, plate-shaped body, rod-shaped body, etc. whose thermal expansion coefficient is close to that of the electric circuit component. If one or both of the spherical bodies etc. are dispersed, the coefficient of thermal expansion approaches that of the electrical circuit components, which may cause cracks in the encapsulant or electrical circuit components, which may occur when heat is applied. A phenomenon that impairs the reliability of an electric circuit member, such as a change in the characteristics of the electric circuit component, can be prevented, and a highly reliable electric circuit member can be obtained.

なお、電気回路部品のすべてが電気的接続部材を介して
金属化及び/又は合金化により形成された接続層により
接続されていると、電気回路部品相互の接触抵抗が、1
つの電気回路部品のみを接続した場合に比べてより小さ
くなる。
Note that if all of the electrical circuit components are connected via electrical connection members by connection layers formed by metallization and/or alloying, the contact resistance between the electrical circuit components will be 1.
It is smaller than when only one electrical circuit component is connected.

一方、少なくとも1以上の電気回路部品を金属化及び/
又は合金化による接続以外の接続により行なうと、金属
化及び/又は合金化時に生じる電気回路部品の熱による
劣化を防止することができる。また、用途によっては電
気回路部品を着脱自在にしておきたい場合があり、この
ような場合にその電気回路部品を金属化及び/又は合金
化による接続以外の接を1行なえば、その要望に応じる
ことが可能となる。
On the other hand, at least one or more electric circuit components are metallized and/or
Alternatively, if the connection is made by a connection other than the connection by alloying, it is possible to prevent the electric circuit components from deteriorating due to heat that occurs during metallization and/or alloying. Additionally, depending on the application, there may be cases where it is desired to make the electrical circuit components removable, and in such cases, the electrical circuit components can be met by making one connection other than metallization and/or alloying. becomes possible.

さらに、絶縁体としてシールド効果が大きい材料を選択
することにより、電気回路部品から外界に出る?a 6
T1気ノイズを減少させることができ、また、外界から
電気回路部品へ入るノイズを減少させることもできる。
Furthermore, by selecting a material with a high shielding effect as an insulator, the outside world can be removed from the electrical circuit components. a 6
T1 noise can be reduced, and noise entering the electrical circuit components from the outside world can also be reduced.

(以下余白)(Margin below)

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、第1図(b)、第1図(C)、第1図(
d)、第1図(e)、第1図(f)、第1図(g)は、
実施例1を示す断面図であり、第1図(a)は接続前、
第1図(b)は接続後、第1図(C)、第1図(d)、
第1図(e)、第1図(f)、第1図(g)封止後の状
態を示す。 第2図は、実施例1からに使用する電気的接続部材の一
製造方法例を説明するための図であり、第2図(a)は
断面図、第2図(b)は斜視図、第2図(C)、第2図
(d)は斜視図である。 第3図は、実施例2を示し、第3図(a)は接続前の状
態を示す断面図、第3図(b)は接続後の状態を示す断
面図である。 第4図および第5図は実施例2に使用する電気的接続部
材を示し、第4図(a)、第5図(a)は斜視図、第4
図(b)、第5図(b)は断面図である。 第6図は実施例3を示す断面図である。 第7図は実施例4に係る電気的接続部材の一製造例を示
し、第7図(a)、第7図(c)は断面図、第7図(b
)、第7図(d)は斜視図である。 第8図も実施例5を示し、第8図(a)は接続前の状態
を示す断面図、第8図(b)は接続後の状態を示す断面
図である。 第9図乃至第16図までは従来例を示し、第10図を除
ぎ断面図であり、第10図は平面透視図である。 (符号の説明) 1・・・リードフレーム、2・・・リードフレームの素
子搭載部、3・・・銀ペースト、4,4°・・・半導体
素子、5,5゛・・・半導体素子の接続部、6・・・リ
ードフレームの接続部、7・・・極11を属線、8・・
・樹脂、9・・・半導体装置、10・・・半導体素子の
外周縁部、11・・・リードフレームの素子搭載部の外
周縁部、16・・・キャリアフィルム基板、17・・・
キャリアフィルム基板のインナーリート部、20・・・
樹脂、21・・・樹脂、31・・・半田バンプ、32・
・・基板、33・・・基板の接続部、51・・・回路基
板、52・・・回路基板の接続部、54・・・電気的接
続部材の接続部、55・・・リードフレーム、70,7
0°・・・金属材、71.71・・・絶縁膜、72.7
2°・・・絶縁膜の露出面、73.73’・・・金属材
の露出面、75.75°・・・回路基材、76.76°
・・・回路基材の接続部、77・・・異方性導電膜の絶
縁物質、78・・・異方性導電膜、79・・・導電粒子
、81・・・エラスチックコネクタの絶縁物質、82・
・・エラスチックコネクタの金属線、83・・・エラス
チックコネクタ、101・・・半導体素子、102・・
・接続部、103・・・絶縁膜、107・・・金属部材
、108・・・接続部、111・・・保持体(絶縁体)
、121・・・金属線、122・・・棒、123・・・
樹脂、124・・・点線、125・・・電気的接続部材
、126・・・突起、127・・・保持体、128,1
29,130・・・電気的接続部材、142・・・穴、
150・・・バンブ、151・・・板、155・・・キ
ャップ、158・・・中空部、170・・・封止オイ、
201.202.203・・・半導体素子、204,2
05,206・・・接続部、300・・・配線パターン
、3−0.−1・・・絶縁シート。 第1図 第1図 第1図 第1図 第1図 第1図 第2図(a) 第2図(b) lll     ltj 第3図 (b) z1 第7図(a) 第7図(d) 第8図 (a) 第9図 第10図 第11図 第13図 第15図 第16図
Figure 1(a), Figure 1(b), Figure 1(C), Figure 1(
d), Figure 1(e), Figure 1(f), Figure 1(g),
FIG. 1 is a sectional view showing Example 1, and FIG. 1(a) shows the state before connection;
Figure 1(b) is after connection, Figure 1(C), Figure 1(d),
FIG. 1(e), FIG. 1(f), and FIG. 1(g) show the state after sealing. FIG. 2 is a diagram for explaining an example of a manufacturing method of an electrical connection member used from Example 1, in which FIG. 2(a) is a sectional view, FIG. 2(b) is a perspective view, FIG. 2(C) and FIG. 2(d) are perspective views. FIG. 3 shows Example 2, FIG. 3(a) is a sectional view showing the state before connection, and FIG. 3(b) is a sectional view showing the state after connection. 4 and 5 show electrical connection members used in Example 2, FIGS. 4(a) and 5(a) are perspective views, and FIG.
FIG. 5(b) and FIG. 5(b) are cross-sectional views. FIG. 6 is a sectional view showing the third embodiment. FIG. 7 shows an example of manufacturing an electrical connection member according to Example 4, FIG. 7(a) and FIG. 7(c) are cross-sectional views, and FIG.
), FIG. 7(d) is a perspective view. FIG. 8 also shows Example 5, with FIG. 8(a) being a sectional view showing the state before connection, and FIG. 8(b) being a sectional view showing the state after connection. 9 to 16 show conventional examples, except for FIG. 10, which is a sectional view, and FIG. 10 is a plan perspective view. (Explanation of symbols) 1...Lead frame, 2...Element mounting part of lead frame, 3...Silver paste, 4,4°...semiconductor element, 5,5゛...semiconductor element Connection part, 6... Lead frame connection part, 7... Pole 11 as a wire, 8...
- Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Outer periphery of element mounting portion of lead frame, 16... Carrier film substrate, 17...
Inner lead part of carrier film substrate, 20...
Resin, 21... Resin, 31... Solder bump, 32.
... Board, 33... Connection part of board, 51... Circuit board, 52... Connection part of circuit board, 54... Connection part of electrical connection member, 55... Lead frame, 70 ,7
0°...Metal material, 71.71...Insulating film, 72.7
2°...Exposed surface of insulating film, 73.73'...Exposed surface of metal material, 75.75°...Circuit base material, 76.76°
... Connection portion of circuit base material, 77 ... Insulating material of anisotropic conductive film, 78 ... Anisotropic conductive film, 79 ... Conductive particles, 81 ... Insulating material of elastic connector, 82・
...Metal wire of elastic connector, 83...Elastic connector, 101...Semiconductor element, 102...
- Connection part, 103... Insulating film, 107... Metal member, 108... Connection part, 111... Holder (insulator)
, 121...metal wire, 122...rod, 123...
Resin, 124... Dotted line, 125... Electrical connection member, 126... Protrusion, 127... Holder, 128, 1
29,130... Electrical connection member, 142... Hole,
150... Bump, 151... Plate, 155... Cap, 158... Hollow part, 170... Sealing oil,
201.202.203...Semiconductor element, 204,2
05,206... Connection portion, 300... Wiring pattern, 3-0. -1...Insulating sheet. Figure 1 Figure 1 Figure 1 Figure 1 Figure 1 Figure 2 (a) Figure 2 (b) lll ltj Figure 3 (b) z1 Figure 7 (a) Figure 7 (d ) Figure 8 (a) Figure 9 Figure 10 Figure 11 Figure 13 Figure 15 Figure 16

Claims (8)

【特許請求の範囲】[Claims] (1)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の金属部材とを有し、該金属部材の一端
が該保持体の一方の面において露出しており、また、該
金属部材の他端が該保持体の他方の面において露出して
いる2つ以上の電気的接続部材の少なくとも1つに配線
パターンを有する電気的接続部材を積層する工程と; 電気的接続部材の金属部材又は配線パターンの一方又は
両方の1以上の接続部と別の電気的接続部材の金属部材
又は配線パターンの一方又は両方の1以上の接続部を金
属化及び/又は合金化により接続する工程と: を少なくとも有することを特徴とする電気的接続部材の
製造方法。
(1) It has a holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , laminating an electrical connection member having a wiring pattern on at least one of the two or more electrical connection members whose other ends are exposed on the other surface of the holder; Connecting one or more connection parts of one or both of the metal member or wiring pattern of a member and one or more connection parts of one or both of the metal member or wiring pattern of another electrical connection member by metallization and/or alloying. A method for manufacturing an electrical connection member, comprising at least the steps of:
(2)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の金属部材とを有し、該金属部材の一端
が該保持体の一方の面において露出しており、また、該
金属部材の他端が該保持体の他方の面において露出して
いる2つ以上の電気的接続部材の少なくとも1つに配線
パターンを有する電気的接続部材を積層し、電気的接続
部材の金属部材又は配線パターンの一方又は両方の1以
上の接続部と別の電気的接続部材の金属部材又は配線パ
ターンの一方又は両方の1以上の接続部を金属化及び/
又は合金化により接続した2つ以上の電気的接続部材で
構成された電気的接続部材と;少なくとも1以上の接続
部を有し、該接続部において、該電気的接続部材に露出
している該金属部材のうちの少なくとも1つおよび/又
は該配線パターンと保持体の一方又は両方の面で接続さ
れている少なくとも1以上の電気回路部品と;を少なく
とも有していることを特徴とする電気回路部材。
(2) It has a holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , laminating an electrical connection member having a wiring pattern on at least one of the two or more electrical connection members whose other ends are exposed on the other surface of the holder; Metallizing and/or metallizing one or more connecting portions of one or both of the metal members or wiring patterns and one or more connecting portions of one or both of the metal members or wiring patterns of another electrical connection member.
or an electrical connection member composed of two or more electrical connection members connected by alloying; has at least one or more connection portion, and in the connection portion, the electrical connection member is exposed to the electrical connection member; An electric circuit comprising: at least one metal member and/or at least one or more electric circuit components connected to the wiring pattern and one or both surfaces of the holder. Element.
(3)請求項2において、該電気回路部品の接続部と該
金属部材のうちの少なくとも1つとは金属化および/ま
たは合金化により接続されていることを特徴とする電気
回路部材。
(3) The electric circuit member according to claim 2, wherein the connecting portion of the electric circuit component and at least one of the metal members are connected by metallization and/or alloying.
(4)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の金属部材とを有し、該金属部材の一端
が該保持体の一方の面において露出しており、また、該
金属部材の他端が該保持体の他方の面において露出して
いる2つ以上の電気的接続部材の少なくとも1つの少な
くとも保持体の1つの面に配線パターンを有する電気的
接続部材を積層する工程と; 電気的接続部材の金属部材又は配線パターンの一方又は
両方の1以上の接続部と別の電気的接続部材の金属部材
又は配線パターンの一方又は両方の1以上の接続部を金
属化及び/又は合金化により接続する工程と; を少なくとも有することを特徴とする電気的接続部材の
製造方法。
(4) A holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , an electrical connection member having a wiring pattern on at least one surface of the holder is laminated on at least one of the two or more electrical connection members, the other end of the metal member being exposed on the other surface of the holder; metallizing one or more connection parts of one or both of the metal members or wiring patterns of an electrical connection member and one or more connection parts of one or both of the metal members or wiring patterns of another electrical connection member; A method for manufacturing an electrical connection member, comprising at least the following steps: and/or connecting by alloying.
(5)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の金属部材とを有し、該金属部材の一端
が該保持体の一方の面において露出しており、また、該
金属部材の他端が該保持体の他方の面において露出して
いる2つ以上の電気的接続部材の少なくとも1つの少な
くとも保持体の1つの面に配線パターンを有する電気的
接続部材を積層し、電気的接続部材の金属部材又は配線
パターンの一方又は両方の1以上の接続部と別の電気的
接続部材の金属部材又は配線パターンの一方又は両方の
1以上の接続部を金属化及び/又は合金化により接続し
た2つ以上の電気的接続部材で構成された電気的接続部
材と; 少なくとも1以上の接続部を有し、該接続部において、
該電気的接続部材に露出している該金属部材のうちの少
なくとも1つおよび/又は該配線パターンと保持体の一
方又は両方の面で接続されている少なくとも1以上の電
気回路部品と;を少なくとも有していることを特徴とす
る電気回路部材。
(5) It has a holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , an electrical connection member having a wiring pattern on at least one surface of the holder is laminated on at least one of the two or more electrical connection members, the other end of the metal member being exposed on the other surface of the holder; and metallizing and/or metallizing one or more connection parts of one or both of the metal member or wiring pattern of an electrical connection member and one or more connection parts of one or both of the metal member or wiring pattern of another electrical connection member. or an electrical connection member composed of two or more electrical connection members connected by alloying; having at least one or more connection part, in the connection part,
at least one of the metal members exposed to the electrical connection member and/or at least one or more electrical circuit components connected to the wiring pattern and one or both surfaces of the holder; An electric circuit member comprising:
(6)請求項5において、該電気回路部品の接続部と該
金属部材のうちの少なくとも1つとは金属化および/ま
たは合金化により接続されていることを特徴とする電気
回路部材。
(6) The electric circuit member according to claim 5, wherein the connecting portion of the electric circuit component and at least one of the metal members are connected by metallization and/or alloying.
(7)電気回路部品は、半導体素子、回路基板、シリコ
ン基板又はリードフレームである請求項2、請求項3、
請求項5又は請求項6に記載の電気回路部材。
(7) Claims 2 and 3, wherein the electric circuit component is a semiconductor element, a circuit board, a silicon substrate, or a lead frame.
The electric circuit member according to claim 5 or 6.
(8)電気回路部品が接続される電気的接続部材の接続
部は凸状になっている請求項2、請求項3、請求項5、
請求項6、請求項7のいずれか1項に記載の電気回路部
材。
(8) Claims 2, 3, and 5, wherein the connection portion of the electrical connection member to which the electric circuit component is connected has a convex shape.
The electric circuit member according to claim 6 or 7.
JP63133403A 1988-05-18 1988-05-31 Manufacture of electrically connected member and electrical circuit member Pending JPH01302834A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63133403A JPH01302834A (en) 1988-05-31 1988-05-31 Manufacture of electrically connected member and electrical circuit member
EP89108882A EP0355273B1 (en) 1988-05-18 1989-05-17 Probe card, method for measuring part to be measured by use thereof and electrical circuit member
DE68917231T DE68917231T2 (en) 1988-05-18 1989-05-17 Probe card, method for measuring a part to be measured with the same and electrical circuit part.
US08/620,393 US5606263A (en) 1988-05-18 1996-03-22 Probe method for measuring part to be measured by use thereof and electrical circuit member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63133403A JPH01302834A (en) 1988-05-31 1988-05-31 Manufacture of electrically connected member and electrical circuit member

Publications (1)

Publication Number Publication Date
JPH01302834A true JPH01302834A (en) 1989-12-06

Family

ID=15103935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63133403A Pending JPH01302834A (en) 1988-05-18 1988-05-31 Manufacture of electrically connected member and electrical circuit member

Country Status (1)

Country Link
JP (1) JPH01302834A (en)

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