JPH01302826A - Electrical circuit device - Google Patents

Electrical circuit device

Info

Publication number
JPH01302826A
JPH01302826A JP63133392A JP13339288A JPH01302826A JP H01302826 A JPH01302826 A JP H01302826A JP 63133392 A JP63133392 A JP 63133392A JP 13339288 A JP13339288 A JP 13339288A JP H01302826 A JPH01302826 A JP H01302826A
Authority
JP
Japan
Prior art keywords
electrical circuit
circuit parts
retainer
electrically connected
connection part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63133392A
Other languages
Japanese (ja)
Inventor
Hiroshi Kondo
Yoshimi Terayama
Takashi Sakaki
Shunichi Haga
Tetsuo Yoshizawa
Yasuteru Ichida
Masaki Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63133392A priority Critical patent/JPH01302826A/en
Priority claimed from EP89109709A external-priority patent/EP0344702B1/en
Publication of JPH01302826A publication Critical patent/JPH01302826A/en
Priority claimed from US08/043,629 external-priority patent/US5283468A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To enable high density and cost reduction to be achieved and a device which can be easily produced and can be easily managed after production to be obtained by providing specific electrically connected members, electrical circuit parts, electrical circuit retaining part members, and other electrical circuit parts and by allowing electrically connected members to be retained at the electrical circuit parts and one of electrical circuit parts while allowing the other to be mounted and removed.
CONSTITUTION: This device has an electrically connected member 125 where a plurality of conductive members 107 are embedded within a retainer 111 consisting of an insulating material and both edges are exposed on both surfaces of the retainer 111, an electrical circuit part 101 which has a connection part 102 where one edge of a conductive member 107 is connected to one surface of the retainer 111 at the connection part 102, an electrical circuit retaining member 201 which connects and/or retains a surface other than those where the connection part 102 of the electrical circuit parts 101 exists, and another electrical circuit parts 104 which has a connection part 105 where the other edge of the conductive member 107 exposed on the other surface of the retainer 111. Also, either of the electrical circuit parts 101 or other electrical circuit parts 104 retains an electrically connected member 125 and the other can be freely mounted or removed.
COPYRIGHT: (C)1989,JPO&Japio
JP63133392A 1988-05-31 1988-05-31 Electrical circuit device Pending JPH01302826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63133392A JPH01302826A (en) 1988-05-31 1988-05-31 Electrical circuit device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63133392A JPH01302826A (en) 1988-05-31 1988-05-31 Electrical circuit device
EP89109709A EP0344702B1 (en) 1988-05-30 1989-05-30 Electric circuit apparatus
DE68925922T DE68925922T2 (en) 1988-05-30 1989-05-30 Electrical circuit apparatus
US08/043,629 US5283468A (en) 1988-05-30 1993-04-08 Electric circuit apparatus

Publications (1)

Publication Number Publication Date
JPH01302826A true JPH01302826A (en) 1989-12-06

Family

ID=15103673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63133392A Pending JPH01302826A (en) 1988-05-31 1988-05-31 Electrical circuit device

Country Status (1)

Country Link
JP (1) JPH01302826A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153797A (en) * 2008-12-24 2010-07-08 Internatl Business Mach Corp <Ibm> Semiconductor interposer and manufacturing method thereof (silicon interposer testing for three dimensional chip stack)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153797A (en) * 2008-12-24 2010-07-08 Internatl Business Mach Corp <Ibm> Semiconductor interposer and manufacturing method thereof (silicon interposer testing for three dimensional chip stack)

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