JPH01301242A - Phenol resin copper clad laminated sheet - Google Patents

Abstract

PURPOSE:To obtain a laminated sheet excellent in humidity resistance and having other characteristics in a well-balanced state, by using a glass fiber contained paper, wherein a glass fiber is contained in paper in a specific ratio, as a paper base material. CONSTITUTION:Glass fiber contained paper is prepared by mixing 3-5wt.% of a glass fiber with raw paper when a paper base material is prepared by a papermaking process. When the mixing ratio of the glass fiber is below 3wt.%, humidity resistance effect is not developed and, when exceeds 5wt.%, no pref. effect is obtained, because the other characteristics of the paper base material are damaged. This glass fiber contained paper is coated and impregnated with a phenol resin and dried to obtain a prepreg. A copper foil is superposed on at least the single surface of a predetermined number of the prepregs and the whole is pressed and integrated under hating to make it possible to obtain a phenol resin copper clad laminated sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Field of Industrial Application) The present invention relates to a phenolic resin copper-clad laminate that has excellent moisture resistance and is well balanced with other properties.

(Prior art) In recent years, consumer electronic devices have made remarkable progress, and in this field as well, there has been a trend toward smaller size, lighter weight, higher performance, and increased functionality. Self-cleaning parts are rapidly progressing.

For this reason, the filter paper-based phenolic resin printed circuit board used in this field is also required to have high electrical properties, high dimensional stability, and excellent workability. In particular, low-temperature punching workability and high moisture resistance and load characteristics are essential. It has become a condition.

The main cause of variations in the properties of paper-based phenolic resin printed circuit boards is heat, which is a factor up to the punching process, but the biggest factor after that is humidity.

That is, there are disadvantages in that the dimensions of the substrate expand due to moisture absorption and the electrical characteristics deteriorate significantly. Since this @ tension laminate is a composite material of a paper base material and a phenolic resin, the problem is how to prevent the paper base material itself from absorbing moisture, and how to prevent expansion due to moisture absorption. In order to solve this problem, various studies have been conducted on pre-treatment methods and impregnation methods for paper base materials, but none have been found to have a good balance between moisture resistance and other properties.

(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned drawbacks and problems, and aims to provide a phenolic resin steel F8A laminate that is excellent in moisture resistance and has well-balanced bending characteristics. That is.

[Structure of the Invention] (Means for Solving the Problems) As a result of extensive studies to achieve the above object, the inventors of the present invention have solved the above problems by using glass paper in which glass fibers are inserted into paper. The inventors have completed the present invention by discovering that the object can be achieved.

That is, the present invention provides a phenolic resin copper-clad laminate in which a paper base material is coated and impregnated with a phenolic resin and a copper foil is laminated and integrally formed under heat and pressure. This phenolic resin copper-clad laminate is characterized by using glass paper containing 3 to 5% fiber by weight relative to the paper.

As the phenolic resin used in the present invention, a wide variety of phenolic resins commonly used for laminates can be used, and there are no particular limitations.

The glass-incorporated paper used in the present invention is one in which glass fibers are injected into the paper base material at the time of papermaking, and 3 to 5% by weight of glass fibers are injected into the base paper. If the glass fiber content is less than 3% by weight, there is no effect on moisture resistance, and if it exceeds 5% by weight, other properties of the paper base material will be impaired, which is not preferable.

As the copper foil used in the present invention, a wide range of copper foils commonly used for laminates can be used, and there are no particular restrictions. The copper foil may be either an electrolytic copper foil or a rolled copper foil. , and its thickness is not particularly limited.

A prepreg is obtained by coating, impregnating, and drying the above-mentioned glass paper with a phenolic resin, and a predetermined number of prepreg sheets are overlaid with copper foil on at least one side, heated and pressed, and then made into wood and made into a phenolic resin copper-clad laminate. It can be done.
There are no particular restrictions on the method of manufacturing the laminate, and any method can be used to manufacture the laminate.

(Function) The phenolic resin copper-clad laminate of the present invention cannot obtain excellent moisture resistance due to the use of glass-incorporated paper as the paper base material. Since it has better moisture resistance than fibers, it improves moisture resistance when used as a copper-clad laminate. Also, it can be made into a phenolic resin copper clad laminate with balanced properties without compromising other properties.

(Example) Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited by the Examples.

Preparation of varnish Phenol 12.9J), Tung oil 10. Ok () and 0.027 kl of para-toluenesulfonic acid were charged into a reaction vessel, and after reacting at 100°C for 1 hour, the pH was neutralized to 7 with monomethylamine. Next, 15.6 kg of 37% formalin was added. In addition, after reacting at 100°C for 2 hours,
The mixture was dehydrated under reduced pressure and diluted with a mixed solvent of toluene:methanol=1:1 to prepare a varnish having a resin solid content of 55%, a viscosity of 2.0 poise (25°C), and a gelation time of 3 minutes (150°C).

EXAMPLE The varnish prepared above was coated with 10 mils glass paper (
Coated, impregnated and dried on a paper base (glass fiber made from kraft paper), resin content 150% by weight, microwave flow 8%.
prepreg was made. 8 sheets of this prepreg and 1 sheet of copper foil with adhesive were layered and heated at 170℃ for 100ka.
/cn2 conditions for 75 minutes by heating and pressurizing and molding.
A phenolic resin copper-clad laminate having a thickness of 1.611n+ was manufactured.

Comparative Example The varnish prepared above was applied, impregnated and dried on 10 mils kraft paper to produce a prepreg having a resin content of 50% by weight and a microwave flow of 8%. Layer 8 sheets of this prepreg and 1 sheet of copper foil with adhesive and heat at 170℃ for 100k.
A phenolic resin copper-clad laminate having a thickness of 1 and 611 mm was manufactured by integrally molding the product under heating and pressure for 75 minutes under the conditions of g/cn2.

The copper-clad laminates obtained in Examples and Comparative Examples were tested for water absorption, insulation resistance, and soldering heat resistance, and the results are shown in Table 1. All of the Examples showed excellent properties, and the effect of the present invention was confirmed (unit). [Effect of the Invention] As is clear from the above explanation and Table 1, the phenolic resin jF! Tensioned laminates are suitable for use in consumer electronics because they are moisture resistant, crushable, and have a good balance with other properties.

Claims (1)

[Claims] 1. In a phenolic resin copper-clad laminate in which a prepreg formed by applying and impregnating a phenolic resin onto a paper base material and a copper foil are laminated and integrally formed under heat and pressure, glass fiber is used as the paper base material against the paper. A phenolic resin copper-clad laminate characterized by using 3 to 5% by weight glass paper.