JPH01299092A - Ic card - Google Patents

Abstract

PURPOSE:To fix a card substrate and an IC module without using an adhesive and to make the contact pattern of the IC module flush with the surface of the card substrate, by a method wherein the IC module is fixed to the card substrate by respectively arranging the pattern part and outer peripheral part of said module to the substrate holding part and groove part of the card substrate and engaging a fixing member with the groove part so as to grasp the outer peripheral part to fix the module. CONSTITUTION:An IC module 3 is received in the recessed pat 2a of a card substrate 2 from the upper surface thereof in such a state that a folded part 5e and an end part 5g are formed to an outer peripheral part 5b. The pattern part 5a of the IC module 3 is arranged on a substrate holding part 2b and the folded part 5e is arranged to an oblique surface 2c while the end part 5g is arranged to the bottom surface of a groove pat 2d in such a state that a hole part 5c is engaged with a projection 2e. Further, a frame body 4 is incorporated in the groove part 2d from the upper surface of the substrate 2 and the outer peripheral part 5b of the IC module 3 is strongly held between the frame body 4 and the card substrate 2. The frame body 4 and the card substrate 2 are strongly fixed by welding the respective contact surfaces of both of them by ultrasonic welding.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card, and particularly to a structure for storing and fixing an IC module in a card base.

[Conventional technology]

In recent years, the development of IC cards equipped with IC chips such as a CPU and memory has progressed rapidly. This IC card is
Its storage capacity is larger than that of conventional Shinki cards, so
The idea is to use it in place of bank passbooks and credit cards.

First, conventional IC cards and ICs stored in IC cards.
The module will be explained based on the diagram.

Fig. 5 is an external perspective view showing a conventional IC card, and Fig. 6 is an external perspective view showing a conventional IC card.
FIG. 7 is an external perspective view of a card base constituting the 1c card, FIG. 8 is an external perspective view of an IC module, and FIG. 9 is a sectional view of main parts of another conventional IC card.

In FIG. 5, the surface of the IC card 3o has a plurality of compact patterns 32C of the IC module 62, which will be described later.
The mark is set so that the mark is exposed.
i1J30a is provided. The overall card shape is determined by a plastic card base 61 shown in FIG. This card base 31 includes an IC module 6
A substrate recess 31a and a sealing recess 31b for storing 2.
is formed. The card base 31 is made of ABS, for example.
It is formed by injection molding resin. The IC module 62 has an IC chip 63 on the circuit board 32a as shown in FIG.
is bonded to form a sealing portion 32b on the IC chip 33 with sealing resin, and a contact pattern 32C shown in FIG. 5 is formed on the back side of the circuit board 32a.

As shown in FIG. 6, the IC module 32 has its sealing portion 32b accommodated in the sealing recess 61b of the card base 31, and
The circuit board 32a is housed in the board recess 31a with its outer periphery being restricted. At this time, the IC module 32 is housed so that the surface of the contact pattern 32C and the surface of the card base 31 are flush with each other. Further, an adhesive (not shown) is applied between the circuit board 32a and the sealing part 32b and the board recess 31a and the sealing recess 31b, and the IC module 62 is attached to the card base 31 by heating and curing the adhesive. It's stuck.

In general, the IC card 60 has a thickness of approximately 0.02 mm, and must have flexibility to withstand bending to a certain extent in order to avoid being destroyed by external forces received during carrying or use. Therefore, it is essential that the card base 31 has flexibility, that the sealing portion 32b of the IC module 62 has rigidity, and that the IC module 62 and the card base 31 are firmly fixed.

However, since the materials of the circuit board 32a and the sealing part 32b that constitute the IC module 32 are different from those of the card base 31, it is difficult to obtain an adhesive that can reliably bond the two, and the adhesive strength varies widely. In the case of the above-described 3° IC card, there is a problem in that when the card base 31 is bent, peeling occurs at the bonded portion between the card base 31 and the IC module 32, and the IC module 32 falls off.

Also, when heating and curing the adhesive, the amount of adhesive applied and the position of the adhesive may affect the circuit board 32 of the IC module 62.
There was a problem in that the adhesive leaked out from the gap between the card base 610 and the card base 610, staining the surface of the card base 610 on which the print 30a was formed.

Further, there was a problem in that the card base 61 was easily changed by the heat generated when the adhesive was heated and cured.

Furthermore, since adhesives are difficult to handle and work with, it is possible to store IC modules into card bases without using adhesives.
A card structure was desired. Therefore, an IC card structure in which an IC module is fixed to a card base without using an adhesive has been proposed in Japanese Patent Laid-Open No. 61-204788.

This IC card structure will be explained in detail based on FIG. 9. IC
A through hole 40a is formed in the card base 40 constituting the card, and an IC module 41 is housed in the through hole 40a via a ring-shaped connecting member 44. Furthermore, the IC module 41 is placed on the front and back sides of the IC module 41.
The reinforcing members 42 and 43 are arranged so as to sandwich the card and are fixed to the card base 40. Furthermore, the IC module 41
A hole 42a for exposing the contact pattern 41a is formed in the reinforcing member 42 on the side of the contact pattern 41a.

According to the above IC card structure, when the reinforcing members 42, 43 and the connecting member 44 are made of metal materials, they can be firmly joined to each other by soldering or the high frequency welding method.
There is no need to integrally bond the card base and IC module with adhesive as in the past.

[Problem to be solved by the invention]

However, the structure of the IC card described above causes the following problems.

In other words, the contact pattern of conventional IC cards is configured to be flush with the surface of the card base in order to securely connect with the data reading/writing device R/W (!J-Darwriter). In the above IC card, since the reinforcing member 42 is thicker than the contact pattern 41a, the contact pattern 41a is provided at a position lower than the surface of the card base 40. Therefore! (There was a problem with the connection with /W becoming unstable.

Furthermore, if even the slightest error occurs in the outer dimensions of the IC module 41, the inner and outer diameter dimensions of the connecting member 44, and the inner diameter dimensions of the through hole 40a, the fixation of the IC module 41 will become unstable and the contact pattern 41a may become misaligned. I had something to wake up. Moreover, this IC card structure has a reinforcing member 42.
46 and the connecting member 44, the card base 40 and the IC module 41 are not firmly fixed.Therefore, there is a problem that the positions of the two may be misaligned and the contact pattern 41a may be misaligned when being carried. be. Therefore, in order to solve this problem, there was a problem in that it was necessary to partially bond the IC module 41 and the card base 40 with adhesive, similar to the IC card shown in FIG. .

It is an object of the present invention to solve the problems of the above-mentioned conventional examples, to be able to firmly bond the card base of an IC card and the IC module without using an adhesive, and to connect the contact pattern of the IC module to the card base. An object of the present invention is to provide an IC card structure in which the front surface can be made flush with the surface of the IC card.

[Means to solve the problem]

In order to achieve the above object, the present invention has the following configuration. That is, an IC is formed by having a contact pattern on one side of a circuit board and mounting an IC chip on the other side.
C module, a card base having a recess for accommodating the IC module, and a card base having a recess for accommodating the IC module;
IC having a fixing member for fixing the C module
In the card, the circuit board of the IC module is composed of a pattern portion on which the contact pattern is formed, and an outer peripheral portion formed by bending from the pattern portion, and the recessed portion of the card base is formed on the IC module. a substrate holder for holding the pattern portion so that the contact pattern is substantially flush with the surface of the card base; and a substrate holder provided on the outer periphery of the substrate holder for holding the outer periphery of the IC module. The IC module has the pattern part and the outer circumferential part disposed in the substrate holding part and the groove part of the card base, respectively, and the fixing member is arranged in the engagement part in the groove part so as to sandwich the outer circumferential part. Furthermore, the circuit board of the IC module is characterized in that the hole formed in the outer circumference engages with the protrusion formed in the groove of the card base and is positioned.

〔Example〕

Embodiments of the present invention will be described below based on the drawings. 1st
The figure is a cross-sectional view of the main parts of an IC card according to the first embodiment of the present invention, FIG. 2 (ta) is a cross-sectional view of the frame, and FIG.
FIG. 2 is a sectional view of the C module (C1 is a sectional view of the main part of the card base, and FIG. 3 is a perspective view of the IC card according to the first embodiment of the present invention. The external appearance is the same as that shown in FIG. 5 for the conventional example, so a description thereof will be omitted.

First, each component constituting the IC card of this embodiment will be explained based on the drawings.

In FIG. 1, an IC card 1 includes a plastic card base 2 made by injection molding ABS resin, etc.
It is composed of a module 3 and a frame 4 which is a fixing member, and printing 8 is formed on the surfaces of the card base 2 and the frame 40.

As shown in FIG. 2(C), a recess 2a for accommodating the IC module 6 is formed in the card base 2. As shown in FIG. A trapezoidal substrate holder 2b is formed in the center of this recess 2a, and furthermore, in the center of this substrate holder 2b,
A sealing recess 2f is formed. A groove portion 2d is formed on the outer periphery of the substrate holding portion 2b, and a slope 2C is formed from the top surface of the substrate holding portion 2b to the bottom surface of the groove portion 2d. Further, a plurality of protrusions 2e are formed on the bottom surface of the groove portion 2d.

Next, as shown in FIG. 2(b), the IC module 6 is composed of a flexible circuit board 5 and an IC chip 6. The IC chip 6 is bonded to the lower surface of the circuit board 5 and protected by a sealing portion 8 made of sealing resin. The circuit board 5 is composed of a pattern portion 5a and an outer peripheral portion 5b, and a contact pattern 5d is formed on the upper surface side of the pattern portion 5a, and the outer peripheral portion 5
A hole 5c for engaging with the protrusion 2e of the card base 2 is formed in b. From the pattern portion 5a to the outer peripheral portion 5b
Two folds are made along the length to form an end portion 5g and a bent portion 5e. The shape of the bent portion 5e is
It is formed to match the shape of the slope 2C of the card base 2. As mentioned above (because the circuit board 5 has a flexible property, the end portion 5g and the bent portion 5e
The bending process is performed while heating the outer circumferential portion 5b.

Note that when heating the outer peripheral part 5b, if it is too hot, the circuit board 5
Since the pattern part 5a is easily damaged, a bending turn 5f is formed on the back side from the pattern part 5a to the outer peripheral part 5b. The bending pattern 5f is the contact pattern 5d.
Similarly, the copper foil is formed with turns and easily accumulates heat when heated. Therefore, by forming the bending pattern 5f, even a small amount of heating can prevent the edges of the circuit board 5 from getting hot. 5g and the bent portion 5e can be easily formed.

Furthermore, the bending pattern 5f can increase the strength at the folded portion.

Next, as shown in FIG. 2(a), the frame body 4 is formed by injection molding the same plastic material as the card base body 2. An opening 4a is formed in the frame 4 to expose the contact pattern 5d of the IC module B.

Next, the assembly structure of the IC card 1 will be explained.

As shown in FIG. 3, the IC module 3 is inserted into the recess 2a from the upper surface of the card base 2, with a bent portion 5e and an end portion 5g formed on the outer peripheral portion 5b.

The pattern portion 5a of the IC module B is placed on the substrate holding portion 2b, the bent portion 5e is placed on the slope 2CIC, and the end portion 5g is placed on the bottom surface of the groove portion 2d with the hole portion 5C engaged with the protrusion 2e. Placed. Furthermore, from the top,
The frame 4 is assembled into the groove 2d, and the IC is inserted into the groove 2d as shown in FIG.
The outer peripheral part 5b of module B is connected to this frame 4 and card base 2.
It is firmly held between 0 and 0. And frame body 4 and card base 2
The surfaces that are in contact with each other are firmly fixed together by ultrasonic welding. In this embodiment, in order to ensure that the frame 4 and the card base 2 are fixed together, as shown in FIG.
, a protrusion 4b is provided on the frame 4, and the protrusion 4b is inserted into the groove 2.
Ultrasonic welding is performed by making sure to contact the surface of d. Finally, the IC card 1 is completed by applying printing 8, hard coating, and antistatic treatment (none of which are shown) to the front and back sides.

Therefore, in the IC card 1 of this embodiment, the IC module 6
The pattern portion 5a can be configured to be flush with the surface of the card base 2, and an adhesive can be used (both
The IC module 3 can be firmly fixed to the card base 2.

Next, an IC card according to a second embodiment of the present invention will be explained based on FIG. Note that the same components as those in the first embodiment are given the same numbers, and their explanations will be omitted.

In this embodiment, only the first structure is such that one fold is formed on the IC module 30 circuit board 5 to form a bent portion 5e, and a protrusion provided on the bent portion 5e is engaged with a protrusion 9a of the card base 9. This is different from the example. The IC card structure of this embodiment also allows the IC module 3 to be securely fixed to the card base 9 similarly to the first embodiment.

〔Effect of the invention〕

As is clear from the above description, according to the IC card structure of the present invention, the contact 1 of the IC module and the pattern portion on which the pattern is formed are placed in the substrate holding portion formed in the recess of the card base, and The outer peripheral part formed by bending from the pattern part is arranged in the groove provided on the outer periphery of the substrate holding part, and the fixing member for fixing the IC module is engaged into the groove so as to sandwich the outer peripheral part of the IC module. Because they are fixed, the contact pattern and the surface of the card base can be configured on the same plane, and the IC module can be firmly attached to the card base by simply fixing the card base and fixing member using ultrasonic welding, etc., without using adhesives. can be fixed to.

In addition, by positioning the engaging portion formed on the outer periphery of the IC module to engage with the protrusion formed in the groove of the card base, assembly work can be easily performed, and the card base and fixing member can be connected through the engaging portion. Since they are fixed, the fixing force between them and the fixing force of the IC module can be increased.

Furthermore, since a folding pattern is formed from the pattern portion to the outer circumferential portion of the IC module, creases can be easily formed and the strength of the easily damaged fold portions can be sufficiently increased.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the main parts of an IC card according to the first embodiment of the present invention, Fig. 2 fa) is a sectional view of the frame, and Fig. 2 [b]
2(C) is a sectional view of the main part of the card base, FIG. 3 is a perspective view of the IC card according to the first embodiment of the present invention, and FIG. 5 is an external perspective view showing a conventional IC card, FIG. 6 is a sectional view taken along line A-A in FIG. 5, and FIG. 7 is a sectional view of the IC card according to the second embodiment. FIG. 8 is an external perspective view of the card base, FIG. 8 is an external perspective view of the IC module, and FIG. 9 is a cross-sectional view of main parts of another conventional IC card. 1...IC card, 2...card base, 2a...recess, 2b...
...Substrate holding part, 2d...Groove part, 2
e...protrusion, 2f...sealing recess,
3...IC module, 4...frame, 5...circuit board, 5a...
・Pattern part, 5b...Outer periphery part, 5C...
...Hole part, 5d...Contact pattern, 5f...Bending pattern, 6...IC chip, 7...Sealing part, 8. ·····printing. Fig. 1 Fig. 4 '6' Ja / b l:lb
LlaFigure 5Figure 6Figure 7Figure 9

Claims (2)

[Claims] (1) An IC module having a contact pattern on one side of a circuit board and an IC chip mounted on the other side, a card base having a recess for accommodating the IC module, and the recess. In an IC card having a fixing member for fixing the IC module housed therein, the circuit board of the IC module includes a pattern portion on which the contact pattern is formed, and a pattern portion formed by bending from the pattern portion. The concave portion of the card base includes a substrate holding portion for holding the pattern portion so that the contact pattern of the IC module is substantially flush with the surface of the card base; and a groove provided on the outer periphery of the substrate holder to hold the outer periphery of the module, and the IC module has a pattern portion and an outer periphery arranged in the substrate holder and the groove of the card base, respectively. Further, the IC card is characterized in that the fixing member is engaged and fixed in the groove portion so as to sandwich the outer peripheral portion. (2) The IC card according to claim 1, wherein the circuit board of the IC module is positioned by a hole formed on the outer periphery engaging with a projection formed in a groove of the card base.