JPH01298793A - Method of mounting chip component - Google Patents

Abstract

PURPOSE:To remove separation fall accidents of a chip component from a base board on the conduction circuit side, conduction trouble, etc., and to prevent adhesion of excessive adhesive and adhesive runout of surplus connection material, by coating a conductive connection material on the lead adhesion end of the chip component, and arranging the lead adhesion end of the component at the specified position of the conduction circuit. CONSTITUTION:A chip component 6 is provided with a lead 8 being a connection terminal. Conductive connection material 2 such as conductive adhesive, cream solder, etc., 5-500mu in thickness, is applied to each adhesion end 10 of this lead. And this coating can be executed in such a way that the lead adhesion end 10 of the chip component 6 once adheres onto an adhesion layer base which is constituted by providing the conductive connection material 2 in layer shape of the specified thickness on a separation base and then the adhesive 2 is separated only at necessary part and it is shifted to the bottom of the lead adhesion end 10 of the lead 8. Hereby, connection between the lead adhesion end low in adhesion effect and the conductive adhesion material can be surely started, so high reliability can be obtained as a whole.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a chip component in which the chip component can be mounted at a predetermined location on a conductive circuit while preventing conduction defects.

[Conventional technology]

A large number of ICs (integrated circuits), transistors, LEDs, and other chip components are mounted on the electronic circuit board.

When mounting this chip component, as shown in Figure 2,
Conductive connection materials such as conductive adhesives and cream solders 2
was first placed on the conductive circuit 3 side made of an edible conductive material such as silver or copper. Note that 4 is a film base made of polyester, polyimide, or the like. Next, in this arrangement, the lead adhesive end 10, which is the tip of the lead 8 of the chip component 6, is arranged in the portion.

[Problem that the invention seeks to solve]

However, according to such a mounting method, it is necessary to widely apply the conductive connecting material 2 around the area where the lead bonding end 10 of the chip component 6 will be located, which makes it possible to secure the chip. I was trying to mount part 6.

However, even with this method, the lead adhesive end lO of the chip component 6 may not be sufficiently positioned on the adhesive, resulting in accidents such as peeling and falling of the chip component 6, or poor conductivity, resulting in damage to the product. Confidence was poor. In addition, as a result of the conductive connecting material 2 being spread over and over a wide area, the adhesive protrudes into areas other than where it is needed, causing short circuits and other inconveniences, making it impossible to apply conventional connection techniques to fine patterns. It is. Furthermore, the use of extra adhesive material was extremely disadvantageous economically.

Therefore, an object of the present invention is to improve the various disadvantages mentioned above.

[Means for solving problems]

In order to achieve this object, the present invention applies a conductive connecting material to the lead bonding end of a chip component, and then arranges the lead bonding end of the chip component at a predetermined location of a conductive circuit. It is characterized by reliable implementation.

[Embodiments of the invention]

The present invention will be described in detail below based on the drawings.

In FIG. 1, a chip component 6 is provided with leads 8 which are connection terminals. A conductive connecting material 2 such as a conductive adhesive or cream solder is applied to each bonded end 10, . . . of the lead 8 to a thickness of 5 to 500 μm.

At this time, it is preferable to sufficiently press the connecting material 2 against the lead adhesive end 10 side so that the conductive connecting material 2 is sufficiently adhered to the lead adhesive end 10 and the adhesion is ensured. . As for the adhesion method, the lead adhesive end lO of the chip component 6 is once adhered to an adhesive layer stand formed by providing a layer of conductive connection material 2 of a predetermined thickness on a peeling table, and then the adhesive 2 is applied only to the necessary parts. This can be easily realized by peeling off the adhesive and transferring it to the lower surface of the lead adhesive end 10 of the lead 8. At this time, by using an adhesive with low viscosity and high fluidity, etc., the defective part of the conductive connecting material 2 that has been peeled off and transferred in the above-mentioned transfer process will, after a while, be affected by the flow of the surrounding connecting material 2. The mount may be configured in this way because it is buried and becomes a usable area again. Alternatively, it goes without saying that the configuration may be such that the adjacent locations are sequentially used for one-time use.

This invention was completed by focusing on the following phenomenon.

In other words, the adhesive end of the lead of the chip component is electrically and physically connected to the conductive circuit on the film base using a conductive adhesive material such as conductive adhesive or cream solder, but the conductive adhesive material is the substrate. Although it showed a high adhesive effect on the conductive circuit side of the film base, the adhesive effect was poor on the lead adhesive end side, which is a metal terminal.

This may be due to the characteristics of each material. However, it can also be said that the connecting material was not sufficiently supplied to the bonded ends of the leads, and that there was a lack of a process to ensure that the two were blended together.

〔Effect of the invention〕

As explained above, in this invention, a conductive connecting material is first applied to the adhesive end of the lead of a chip component, and then it is crimped to a predetermined location of the conductive circuit. The adhesion to the conductive circuit becomes reliable, and inconveniences such as the chip component peeling off from the base substrate on the conductive circuit side and poor conductivity, which conventionally occur, can be prevented with extremely high reliability.

In other words, since the connection between the lead adhesive end, which has a low adhesive effect, and the conductive adhesive material can be started reliably, high reliability can be exhibited as a whole.

■Since the conductive connecting material is applied only to the bonded ends of the leads of the chip components, adhesion of excess adhesive is prevented as much as possible, and as a result, the excess bonding material that previously occurred protrudes after bonding. Since this prevents chip components from being electrically conductively bonded to a fine pattern.

(2) Since the conductive connecting material only needs to be used on the bonded end surfaces of the leads, only a small enough amount is used, resulting in low manufacturing costs, which is extremely advantageous economically.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional side view showing an embodiment of the invention. FIG. 2 is a partially sectional side view showing a conventional example. In the figure, 2 is a conductive connection material, 6 is a chip component, and 8 is a conductive connection material.
is a lead, and 10 is a lead adhesive end. Patent applicant: Abisare Co., Ltd. Agent: Yoshimi Saigo

Claims (1)

[Claims] 1. The chip component is reliably mounted by applying a conductive connecting material to the adhesive end of the lead of the chip component, and then arranging the adhesive end of the lead of the chip component at a predetermined location of the conductive circuit. How to mount chip components.