JPH0129793Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an apparatus for manufacturing electronic components, and more particularly to an apparatus for separating an electronic component intermediate structure using a lead frame into individual electronic components and bending and shaping the leads.

BACKGROUND OF THE INVENTION Electronic components such as semiconductor devices are manufactured in bulk using lead frames.

Fig. 6 shows an electronic component intermediate structure using a lead frame, and in the figure 1 is the lead frame;
A plurality of leads 1 are arranged around a mount portion 1a on which an electronic component body, for example a semiconductor pellet 2, is mounted.
Arrange one end of leads 1b, 1b, .
The middle part and the other end of b are connected to a tie bar (connection piece) 1c,
Connected by 1c, 1d, 1d, each tie bar 1c, 1
Both ends of the hanging pins (connecting pieces) 1e, 1e extending from the mount portion 1a are connected orthogonally to the frame pieces 1f, 1f extending in parallel. Although not shown, holes are bored in the main parts of the frame pieces 1f, 1f, and are used for positioning and feeding.

3, 3, ... are thin metal wires electrically connecting the electrodes (not shown) on the semiconductor pellet 2 mounted on the mount part 1a and the free ends of the leads 1b, 1b, and 4 is the metal wire that connects the semiconductor pellet 2 to the free end of the lead 1b. This shows the resin exterior that covers the main parts.

This electronic component intermediate structure 5 includes connecting pieces 1c, 1d,
Frame piece 1 is obtained by cutting and removing the undesired portion of 1e.
f, 1f and each lead 1b, 1
b, ... are made independent to obtain individual electronic components.

Then, the leads 1b, 1b, . . . are bent to obtain the electronic component 6 shown in FIG.

By the way, electronic component intermediate structures 5 to 7 in FIG.
To obtain electronic components, it is also possible to cut and remove the connecting pieces and bend the leads in the same position, but such manufacturing equipment has a complicated structure and requires complicated maintenance and inspection, so it is not commonly used. Specifically, the cutting position of the connecting piece and the bending position of the lead are separated.

FIGS. 8 and 9 show an example of a device that continuously cuts the connecting portion of the lead frame and bends and forms the leads. In the figures, 7 and 8 are integrated first・With the second upper and lower molds,
A punch 9 and a die 10 for cutting unnecessary parts of the lead frame 1 of the electronic component intermediate structure 5 are formed in the first upper and lower molds 7a and 8a, and the second upper and lower molds 7
b, 8b, the outer part 4 of the electronic component 6 is placed on the lower mold 8b.
A projecting wall 11 is formed for positioning the outer periphery of the upper mold 7b, and the upper mold 7b has a projecting part 12 for pressing and fixing the electronic component on the lower surface thereof, and rollers 13, 13 for pressing and bending the leads 1b, 1b. It is provided. 1
4 is a feeding device which has a holding part 14a for holding the electronic component intermediate structure 5 on the lower surface of the intermediate part in the longitudinal direction, and is movable vertically and horizontally. After lowering the intermediate structure 5 and holding it in the holding part 14a, the electronic components 6 which were first supplied between the first upper and lower molds 7a and 8a and separated into individual parts are pressed by the supply device 14, and then the electronic parts 6 are pressed into the second mold. horizontally so as to feed it between the upper and lower molds 7b and 8b. Therefore, a part of the projecting wall 11 is an inclined surface. Reference numeral 15 denotes a take-out device for taking out the electronic component 6 after lead molding from between the second upper and lower molds 7b and 8b onto a tray 16 or the like outside the mold, and in the illustrated example, it has a suction head 15a.

This operation will be explained below. First, 1st and 2nd
While using the upper and lower molds 7 and 8, the electronic component intermediate structure 5 is held by the supply device 14, moved onto the first upper and lower molds 7a and 8b, placed in a fixed position, and then supplied. The device 14 is evacuated. Then, unnecessary parts of the intermediate structure 5 are cut using the upper and lower molds 7 and 8, and the electronic components 6 are separated into individual electronic components 6. And upper and lower molds 7, 8
Open it and repeat the above operation. At this time, the electronic component 6 between the first and second upper and lower molds 7a and 8a is supplied to the supply device 1.
4 between the second upper and lower molds 7b and 8b, and a new electronic component intermediate structure 5 is supplied between the first and second upper and lower molds 7a and 8b. Then, the supply device 14 is retreated to the outside of the upper and lower molds, and the upper and lower molds 7 and 8 are operated to separate the intermediate structure 5 and bend and mold the leads of the electronic component 6. After that, the upper and lower molds 7 and 8 are opened to form the second upper and lower molds 7.
The suction part 15a of the take-out device 15 is positioned between 8b and 8b, and is moved vertically and horizontally in conjunction with the supply device 14 to transfer the lead-folded electronic component 6 to the tray 16.

Separation of electronic components and lead forming are performed continuously by repeating the vertical movement.

Problems to be Solved by the Invention Incidentally, this device transfers the individually separated electronic components 6 to the lead forming sections 7b and 8b by extrusion by the feeding device 14, and also 4 and the protruding wall 11, the electronic components at the second upper and lower molds 7b and 8b are misaligned, leading to defective lead molding as well as appearance defects such as peeling of the plating on the leads. Not only that, but the exterior part 4 may be damaged and become completely defective.
There was a crack that caused damage to the mold itself.

Means for solving the problems This invention was proposed in view of the above problems.
A first upper and lower mold that cuts the connecting piece of a workpiece having a lead integrated by a connecting piece and separates it into individual workpieces, and a first upper and lower mold that operates adjacent to the first upper and lower molds to bend and mold the lead of the workpiece. a second upper and lower mold to hold the workpiece, a supply device that supplies the workpiece between the first and upper molding molds, and a workpiece holding device that holds the workpiece at the interval between the workpiece placement positions of the first and second upper and lower molds at the tip or intermediate lower surface. and a transfer/discharge device whose tip portion reciprocates between the workpiece placement positions of the first and second upper and lower molds, the transfer and discharge device has a tip portion that is attached to the second upper and lower molds. The device is characterized in that it is configured to be held between the second upper and lower molds while holding the workpiece in position, thereby eliminating any misalignment of the workpiece relative to the mold.
The above problems can be solved.

Embodiments Examples of the present invention will be described below with reference to FIGS. 1 to 5. In the figure, the same reference numerals as in FIGS. 8 and 9 indicate the same parts, and the explanation will be omitted. What is different from the device shown in FIG. 8 is a supply device 17 and a transfer/discharge device 18.
The first and second upper and lower molds 7a, 8a,
While the electronic component intermediate structure 5 and the electronic component 6 are supplied between 7b and 8b, in the device of the present invention, the supply device 17 is the electronic component intermediate structure (workpiece with leads).
5 is only supplied between the first upper and lower molds 7a and 8a. Further, the take-out device 15 transfers the electronic component (work) 6 for which lead molding has been completed to the second upper and lower molds 7b,
In contrast, the transfer/discharge device 18 of the device of the present invention has a tip that moves horizontally between the first upper and lower molds 7a, 8a and the second upper and lower molds 7b, 8b. ,, the individually separated electronic components 6 are transferred to the second
At the same time when the electronic component 6 is transferred to the upper and lower molds 7b and 8b, the electronic component 6 whose lead molding has been completed by the second upper and lower molds 7b and 8b is held on the intermediate lower surface and taken out from the mold. , first upper and lower molds 7a,
After the electronic component 6 taken out from 8a is transferred to the second upper and lower molds 7b and 8b, the electronic component 6 is held at the tip so that it is held between the second upper and lower molds 7b and 8b. This is a major difference from conventional equipment.

As a result, the lower surface of the second upper mold 7b is recessed by the thickness of the transfer/discharge device 18.

The operation of this device will be explained below. It is assumed that in the upper and lower molds 7 and 8 there are an electronic component 6 from which the connecting portion of the lead frame has been removed, and an electronic component 6 that has been lead-molded. First, as shown in Figure 3,
The supply device 17 is lowered and held on the electronic component intermediate structure 5, and at the same time, the transfer/discharge device 18 between the upper and lower molds 7 and 8 is lowered to supply the first upper and lower molds 7a,
The individual electronic components 6 in 8a are held at the tip of the device 18, and the electronic components 6 whose lead molding has been completed in the second upper and lower molds 7b, 8b are held in the middle of the device 18, respectively. Then, as shown in FIG. 4, the supply device 17 and the transfer/discharge device 18 are moved up, horizontally, and lowered in conjunction with each other, and the intermediate structure 5 held by the device 17 is placed in a fixed position on the first lower mold 8a. The electronic component 6 held by the tip of the device 18 is placed in the second lower mold 8b.
The device 18 maintains the holding state and places it in a fixed position.
The electronic component 6 held at the intermediate portion is dropped into the tray 16 and accommodated. The device 17 withdraws the intermediate structure 5 from the molds 7 and 8 after supplying it. Then, as shown in FIG. 5, the upper mold 7 is lowered, and the connecting portions of the intermediate structure 5 are cut and removed to obtain individual electronic components 6. At the same time, leads of the electronic components 6 are formed.

At this time, since the electronic component 6 to be lead-molded is held by the transfer/discharge device 18, the molds 7b, 8b
Since it is positioned within the lead and does not move, there is no problem such as damage to the mold during lead molding.

Thereafter, the upper and lower molds 7 and 8 are opened, the transfer and discharge device 18 is released from its hold, and the electronic components are continuously manufactured by raising the molds and repeating the operations shown in FIGS. 3 to 5.

Effects As described above, according to the present invention, the individually separated electronic components are accurately positioned in the lead molding section, and there is no positional deviation during molding, so lead molding is performed well and lead plating is prevented. It is possible to eliminate appearance defects and product defects such as peeling and damage to the resin exterior, and it is also possible to prevent damage to the mold.

Furthermore, since the moving distance of the supply device and transfer/discharge device for moving the electronic component intermediate structure and electronic components into and out of the mold can be shortened compared to the conventional method, the index can be improved.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of the device according to the present invention, Fig. 2 is a view taken along the line XX in Fig. 1, Figs. 3 to 5 are explanatory diagrams of the operation of the device in Fig. FIG. 7 is a perspective view showing an example of an electronic component; FIG. 8 is a side sectional view showing an example of a conventional manufacturing device; FIG. - Shows a Y-plane view. 5...Electronic component intermediate structure (work with leads),
6...Electronic parts (work), 7a, 8a...1st
upper and lower molds, 7b, 8b...second upper and lower molds, 1
7... Feeding device, 18... Transferring and discharging device.

Claims (1)

[Scope of utility model registration request] A first upper and lower mold separates a lead-equipped workpiece integrated by a connecting piece into individual workpieces by cutting the connecting piece, and a first upper and lower mold works adjacent to the first upper and lower molds to bend and form the lead of the workpiece. a second upper and lower mold to
A supply device that supplies a workpiece between the first upper and lower molds, and a workpiece holder is formed at the lower surface of the first and second upper and lower molds from the tip end to the intermediate lower surface, and the front end portion is the first upper and lower molds. 1. A transfer/discharge device that reciprocates between the workpiece mounting positions of the second upper and lower molds, and the transfer/discharge device has a distal end that holds the workpiece at the second upper and lower mold positions. 1. A manufacturing device for a workpiece with a lead, characterized in that it is configured to be held between two upper and lower molds.