JPH01297229A - Mold clamping method and mold apparatus for resin sealing molding - Google Patents

Abstract

PURPOSE:To efficiently, smoothly and certainly perform opening action and clamping action, by a method wherein the positioning correction guide actions of both molds are mainly performed at the time of intermediate clamping and the return actions of the respective ejector plates arranged to both molds are almost simultaneously performed at the time of perfect clamping. CONSTITUTION:At the time of the perparatory intermediate clamping of both molds 13, 14, the positioning correction guide actions of both molds for moving an upper mold 13 on a freely slidable side in the direction of the fixing position of a lower mold 14 on a fixed side are performed through a positioning guide means 19. At the time of the perfect clamping of both molds, the return action of an ejector mechanism 22 is performed. That is, the clamping actions of both molds 13, 14 are performed by two actions of preparatory intermediate clamping and perfect clamping. At the time of the intermediate clamping, the positioning correction guide actions of both molds are mainly performed and, at the time of the perfect clamping, the return actions of the ejector plates 221 respectively arranged to both molds are almost simultaneously performed and, therefore, the positioning correction guide actions of both molds 13, 14 can be performed efficiently, smoothly and certainly.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mold clamping method in a mold apparatus for sealing and molding semiconductor elements and other electronic components with resin materials, and the resin material. This invention relates to improvement of a mold device for sealing molding.

[Conventional technology]

For example, as shown in FIGS. 5 and 6, a mold device for sealing and molding a semiconductor element or the like with a resin material has a mounting base 2 mounted on an upper mounting plate (fixed plate) 1. A fixed mold 3 is fixed to a lower mounting plate (movable plate) 4, and a movable mold 6 is fixed to a lower mounting plate (movable plate) 4 via a mounting base 5.

In addition, molding cavities are arranged facing each other on the P and L surfaces (parting line surfaces) of both molds (3 and 6).
Both cavities constitute a cavity portion for resin molding when both molds (3 and 6) are clamped.

Therefore, by clamping the two molds with the semiconductor element, etc. on the lead frame fitted and set in the two cavities, and injecting and filling the molten resin material into the two cavities, the semiconductor element, etc. can be sealed and molded into a resin molded body corresponding to both cavity shapes.

By the way, the purpose of resin sealing molding of semiconductor elements, etc. is to maintain airtightness and improve mechanical stability. If the upper and lower halves of the resin molded body are also molded in a shape and manner that corresponds to the positional deviation, the resin may be removed during post-processing steps such as bending the external lead terminals. The edges of the molded body may be missing, or
The sealing of semiconductor elements, wires, etc. with the resin material becomes insufficient, which impairs the moisture resistance of the product and causes molding defects.

Therefore, in order to achieve the above objective and deal with the above disadvantages, it is necessary to ensure that the molding cavity portion of the resin-sealed molded product is in a predetermined position when both molds (3 and 6) are clamped. and must be reliably aligned in a proper bonded state. For this reason, guide means for positioning the two molds (3 and 6) is provided between the two molds (3 and 6). This guide means usually includes a guide bin 71 on the movable die 6 side and a guide bin bushing 7□ on the fixed die 3 side, which are arranged opposite to each other between the P and L surfaces of the two dies (3 and 6). The means 7 or the convex taper block 8□ on the movable mold 6 side and the fixed mold 3
a guide means 8 consisting of a concave tapered block 82 on the side;
At the time of mold clamping of both molds 3 and 6) above,
The required positioning of both molds (3, 6) is performed by the guiding action caused by the fitting or engagement of the guide means (7, 8).

[Problem that the invention seeks to solve]

When positioning the molds (3 and 6) based on the fitting or engagement action of the guide means (7 and 8) described above, for example, some positional deviation occurs between the molds (3 and 6). Even when the molds are closed, the guiding action of the guide means has the effect of forcibly clamping both molds.

However, since the guide means (7, 8) are worn out in a short period of time due to the continuously repeated mold opening/clamping action, the positional deviation between the two molds (3, 6) can be effectively corrected. The mold clamping effect can no longer be obtained in a relatively short period of time,
As a result, there is a problem that mold clamping failures easily occur.

In addition, when positioning the molds (3 and 6) based on the fitting or engagement action of the guide means (7 and 8) described above, both molds (3 and 6) are attached via the bolts 9 and 9. Since they are fixed to the respective plates (fixed plate 1 and movable plate 4), there are the following serious problems.

That is, both types (3 and 6
) are fixed in a state in which both molds (3 and 6) are clamped, so that at this time, both molds are reliably aligned in a predetermined position and properly joined. however,
During resin molding, both molds (3 and 6) are heated to the resin molding temperature, and there is a temperature difference between the fixed platen 1 and the movable platen 4, and
Since the required fitting clearance is provided between the movable platen 4 and its guide tie bar 10, during the resin molding, the above-mentioned alignment of both molds (3 and 6) is ensured when the molds are clamped. It becomes extremely difficult to maintain this state for a long period of time. For this reason, both of the above types (
During the mold opening and mold clamping operations of 3 and 6), either one side of the fixed mold 3 or the movable mold 6 is guided by the guide means (7 and 6).
Since the other side is forcibly moved through the guide means 8), there are problems such as accelerated wear between the guide means or damage to the guide means.

The present invention addresses the above-mentioned conventional problems and enables efficient, smooth, and reliable mold opening and mold clamping actions between a fixed mold and a movable mold during resin seal molding. The object of the present invention is to provide a method for clamping a mold for resin encapsulation molding, and a mold device for the same.

Further, in the present invention, the mold clamping action of both molds is performed by two actions, preliminary intermediate mold clamping and complete mold clamping, and during the intermediate mold clamping, a position correction guide action is mainly performed for the two molds. In addition, when the molds are completely closed, the return action of each ejector plate disposed on both molds is performed almost simultaneously, thereby making the position correction guide action of both molds more efficient and smooth. It is an object of the present invention to provide a mold clamping method for a mold for resin sealing molding, which can be performed more reliably, and a mold apparatus therefor.

[Means for solving problems]

A mold clamping method according to the present invention for solving the above-mentioned conventional problems is to place one of a fixed mold and a movable mold equipped with an ejector plate for ejecting a product on its mounting board side. The return of the ejector plate is fixed to the other side, and the mold on the other side is slidably attached to the mounting board side, and each ejector plate is pushed back to a predetermined position when both molds are clamped. A mechanism has been established,
Furthermore, positioning guide means for the fixed mold and the movable mold are provided, and when the two molds are clamped, the positioning guide means moves the slidable mold toward the fixed position of the fixed mold. A mold clamping method that performs a position correction guide function for both molds to be corrected and moved, the method first performing a position correction guide function for both molds during intermediate mold clamping of the two molds, and then ,
The above-mentioned mold is completely clamped, and when both molds are completely clamped, the return mechanism performs a return action of each ejector plate to push each ejector plate back to a predetermined position. It is.

Furthermore, the mold apparatus according to the present invention for carrying out the above method includes a fixed mold and a movable mold each having an ejector plate for ejecting a product, and each ejector plate is set in a predetermined position when clamping both the fixed and movable molds. A mold apparatus for resin encapsulation molding, comprising: a return mechanism for pushing the molds back to the position; and a positioning guide means for guiding the positioning of both molds when the molds are clamped. The mold on either one side of the fixed mold or the movable mold is fixed to the mounting board side thereof, and the mold on the other side is slidably mounted on the mounting board side, and, The present invention is characterized in that it is configured to guide the positioning correction of both molds when the intermediate molds are clamped, and to push each ejector plate back to a predetermined position when the molds are completely clamped. It is.

[Effect]

According to the present invention, one of the movable mold and the fixed mold is fixed to the mounting plate side thereof, and the other mold is slidably mounted to the mounting plate side. Therefore, at least the mold on the slidable side is free with respect to the mounting board side. Therefore, the mold opening and clamping actions between the fixed mold and the movable mold during resin sealing molding can be performed efficiently, smoothly, and reliably.

In addition, the mold clamping action of both molds is performed by two actions: preliminary intermediate mold clamping and complete mold clamping, and during the intermediate mold clamping, a position correction guide action for both molds is performed, and during the complete mold clamping, a position correction guide action is performed for both molds. , the return action of each ejector plate disposed on both molds is performed substantially simultaneously. Therefore, for example, even in the case where the elasticity of a returning spring or the like is strengthened when the two molds are clamped, the positioning correction guide action of the two molds will not be effective during the intermediate clamping of the two molds. Since this has already been completed, both types of positioning correction guide functions described above can be performed more efficiently, smoothly, and more reliably, regardless of this fact.

Furthermore, even if, for example, there is a temperature difference between the two molds and their mounting board during resin molding, the two molds can be easily replaced regardless of this. It is.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

FIG. 1 shows the main parts of a mold apparatus for resin-sealing molding of semiconductor elements and the like according to the present invention.

This mold device includes a fixed upper mold (fixed mold) 13 that is removably attached to an upper mounting plate (fixed plate) 11 via a mounting base 12, and a fixed upper mold (fixed type) 13 that is removably attached to an upper mounting plate (fixed plate) 11, and a A movable lower mold (movable mold) 14 detachably mounted via a base is disposed opposite to the movable lower mold (movable mold) 14.

The upper mold 13 and its mounting base 12 are fixed together via a space block 15, but the mounting base 12 is given the necessary freedom with respect to the fixed platen 11, It is mounted freely vertically and horizontally.

That is, the mounting base 12 is attached to the fixed platen 11 via the L-shaped mounting means 16, and the required vertical clearance 17 is provided between the mounting base 12 and the fixed platen 11.
is configured, and a required horizontal clearance 18 is configured between the mounting base 12 and the L-shaped mounting means 16, so that the upper mold 13 can be attached to the fixed platen 11.
It is attached free to the side.

Further, the above-mentioned two molds (13 and 14) are provided with positioning guides for the two molds, which are composed of a convex taper block 191 on the lower mold side and a concave taper block 192 on the upper mold side, which are arranged opposite to the two molds. Means 19 are provided.

This one guide means positions the two dies (13, 14) at a predetermined position by the guiding action caused by the engagement of the two taper blocks (191, 192) when the two dies (13, 14) are clamped. It is provided so that the mold on the free side (upper mold 13) can be actively moved in the direction in which the mold on the fixed side (lower mold 14) is fixed.

That is, the concave taper block 192 is mounted on the upper mold 13 side so as to be able to slide vertically, and is pushed down by the required elasticity of the elastic member 193 when the mold is opened as shown in FIG. At the time of complete mold clamping as shown in FIG. 1, the convex taper block 191 on the lower mold 14 side is engaged with, and in this state, it is pushed up to a predetermined position.

At this time, both the above taper blocks (191 and 192)
The engagement action is performed while the lower mold 14 does not move up to the P and L planes with the upper mold 13, that is, until the pushing action of the convex taper block 191 against the concave taper block 192 starts. It is set up so that it can be used. Therefore, the position correction guide action of both molds (13 and 14) due to the engagement of both taper blocks (191 and 192) is as follows.
This is performed during the preliminary intermediate mold clamping described above, which is performed before the complete mold clamping operation of both molds.

Moreover, ejector machines tf422 for ejecting products molded in the upper and lower cavities 20 and 21 are respectively disposed in both molds (13 and 14). This ejector mechanism 22 includes an ejector plate 221 fitted in a configuration space between the upper mold 13 and its mounting base 12.
, an ejector turbine 222 provided on the ejector plate, and an elastic member 223 for pushing down the ejector plate 221 when the mold is opened as shown in FIG.
When the mold is clamped as shown in FIG. It is composed of a slanted return pin 224, etc., which is moved upward to the inner bottom surface position of the holder.

The ejector mechanism 23 on the lower mold 14 side basically has the same configuration and function as the ejector mechanism 22 on the upper mold 13 side described above, and when the mold is opened as shown in FIG. 1, it pushes up the ejector plate. The product part to be molded in the lower mold cavity 21 is ejected by the ejector turbine, and when the mold is clamped as shown in FIG. It is configured so that it can be moved down to the inner bottom position.

Moreover, between the fixed platen 11 and the mounting base 12,
A sliding auxiliary means 24 is provided to increase the sliding efficiency of the mounting base 12. This sliding auxiliary means 24 is
It consists of a holder 241 provided on the fixed platen 11 side and a ball 242 rotatably fitted into the holder and provided to elastically protrude downward.

Note that the sliding auxiliary means 24 may be configured to be interposed between the top surface of the mounting means 16 and the bottom surface of the mounting base 12, if necessary.

Further, the above-mentioned sliding auxiliary means 24 is not necessarily necessary and is provided auxiliaryly for the purpose of making the mounting base 12 slide smoothly, but this sliding auxiliary means may be used. When provided, for example, the mounting base 12
If it is formed in a normal rectangular shape, it is preferable to arrange it at four locations at the center of the edge at the front, back, left and right positions. In addition, the location and number of the sliding aids are determined by the shape of the mounting base 12, improvement of its sliding efficiency, etc.
It can be arbitrarily and appropriately selected depending on other needs.

In addition, positioning guide means 1 of both types (13 and 14) mentioned above.
9, and a configuration in which both types of positioning guide means consisting of a conventionally known guide bin and a guide bin bush are used in combination may be employed.

Furthermore, both the taper blocks (191 and 192) or the guide bin and guide bin bushing are mounted on a movable type (1
4) Or which side of the fixed mold (13) should be placed?
It can be arbitrarily and appropriately selected as necessary.

The mold clamping action of both the upper and lower molds (13 and 14) in the configuration of the above embodiment is performed as follows.

That is, when the upper mold 13 and the lower mold 14 are respectively installed at predetermined proper positions, the lower mold 14 moves upward with the upward movement of the movable plate, so that the two molds (13 and 14) The mold will be clamped smoothly and reliably at the appropriate position.

However, when the upper mold 13 is not installed in the proper position relative to the fixed position of the lower mold 14, that is, when there is a horizontal positional shift on the upper mold 13 side,
The upper mold 13 side, which is in a free state, is brought into a fixed state by the positioning correction guide action based on the engagement between the convex taper block 191 on the lower mold 14 side and the concave taper block 192 on the upper mold 13 side. The lower mold 14 is positively slid toward the fixed position. Furthermore, the position correction guide action of both dies (13 and 14) is performed during the preliminary intermediate clamping of both dies, as described above.

After the positioning of both dies (13 and 14) is corrected during the intermediate mold clamping described above, when the lower die 14 further moves upward, the lower die 14 pushes up the ejector plate 221 via the return bin 224. , and the lower end surface of the ejector turbine 222 is moved upward to the position of the inner bottom surface of the upper mold cavity 20. Therefore, at this time, both molds (13 and 14) are completely clamped with appropriate positioning corrections as shown in FIG.

As described above, according to the configuration of the above embodiment, both types (13
・During preliminary intermediate mold clamping in step 14), the position of both molds is such that the upper mold 13 on the free sliding side is moved toward the fixed position of the lower mold (14) on the fixed side via the positioning guide means 19. The ejector mechanism 22 can perform the above-mentioned return action when the molds are completely clamped after the mold correction guide action is performed.

That is, the mold clamping action of both molds (13 and 14) is performed by two actions: preliminary intermediate mold clamping and complete mold clamping, and during the intermediate mold clamping, the positioning of both molds is mainly corrected. When the molds are completely closed, the ejector plates 221 provided on both molds perform a return action almost simultaneously, so both molds (13
- The positioning correction guide action of 14) can be performed more efficiently, smoothly, and more reliably.

Therefore, even if a positional deviation or the like occurs between the two dies (13, 14), the positioning correction guide of the two dies can be efficiently, smoothly and reliably performed. For this reason, the positioning guide means 19, that is, both tapered blocks (191 and
19□) It is possible to efficiently prevent mutual wear and damage, and also to mold resin-sealed molded products such as semiconductor elements with high quality and high reliability.

Further, according to the configuration of the above embodiment, the mold clamping action of both molds is performed by two actions, preliminary intermediate mold clamping and complete mold clamping, and at the time of the intermediate mold clamping, the positioning correction guide action of both molds is performed. When the molds are completely clamped, the return actions of the ejector plates respectively disposed on both molds are performed almost simultaneously.

Therefore, when the two molds are completely clamped, the elasticity of the returning spring (that is, the elastic member 223) is strengthened, but the position correction guide action of the two molds is due to the preliminary There is no problem since the intermediate mold clamping has already been completed.

In other words, the elasticity of the returning spring is strengthened when both dies are clamped, thereby ensuring a reliable product ejecting function when the next mold is opened. When installed, the upper mold mounting base 12
Required vertical clearance 1 between and fixed plate 11
7, the upper mold mounting base 12 is fixed before the elasticity of the turning spring, which is strengthened when both molds are clamped, performs the above-mentioned position correction guide action of both molds. Push it up to the panel 11 side and attach it to the mounting panel 1.
By pressing it to 1, it is possible to prevent the problem that the sliding movement of the upper mold side becomes impossible.

In addition, even if there is a temperature difference between the above two types (13 and 14) and their mounting boards, the two types (13 and 14) are independent of this.
Since the replacement work, etc. of step 14) can be easily performed, highly efficient production of this type of resin-sealed molded product can be achieved.

FIG. 3 shows a second embodiment of the invention.

The structure of this embodiment, which is different from that of the previous embodiment, is that the upper part of the returning spring (elastic member 223) is placed freely in the fitting hole 25 formed in the upper die mounting base 12. However, the other configurations and effects are substantially the same as those of the previous embodiment.

According to the configuration of the second embodiment, even if the lower mold 14 moves upward and starts pushing up the ejector plate 221 during the process from intermediate mold clamping to complete mold clamping of both molds, even if the lower mold 14 starts to push up the ejector plate 221, the first embodiment The elastic member 223
Since the action of increasing the elasticity of the mold can be further delayed in time, it is possible to more reliably perform the position correction guide action of both dies at the time of intermediate mold clamping.

Also, at this time, the above-mentioned returning spring (223
) will be in pressure contact with the bottom surface of the mounting plate 11 when both molds are completely clamped, and therefore its elasticity can be increased to the required strength, so it can be ensured when the mold is opened next time. It is possible to ensure the product's outstanding functionality.

FIG. 4 shows a third embodiment of the present invention, in which the fixed platen 1
1 and the mounting base 12 for increasing the sliding efficiency of the mounting base 12.

That is, in the same figure, a slide is constructed of a convex taper block 261 protruding from the bottom surface of the fixed platen 11 and a recess 262 for engagement with the convex taper block 261 formed on the top surface of the mounting base 12. The motion assisting means 26 is shown.

Other configurations and effects are substantially the same as those of the first embodiment.

In each of the above embodiments, the preliminary intermediate mold clamping action and the complete mold clamping action of both dies are performed sequentially in terms of time.

However, for example, in order to more reliably perform the positioning correction guide action of both molds during the intermediate mold clamping, a required action interruption time is set between the intermediate mold clamping action and the complete mold clamping action. It may also be a two-step intervening action.

Further, the positioning guide means 19 may be a concave-convex block member having an arbitrary shape such as a square shape, an arc shape, or a hemispherical shape, in addition to the one shown in the embodiment drawings. In short, any material may be used as long as it can perform the positioning guide function described above by fitting or engaging the two members.

〔Effect of the invention〕

According to the present invention, when the intermediate molds are clamped, the positioning correction guide function of the two molds is performed to move the slidable mold toward the fixed position of the fixed mold through the positioning guide means. After that, both molds can be completely clamped.

Therefore, according to the present invention, the mold clamping and mold opening operations of both molds can be performed efficiently, smoothly, and reliably, and wear and damage of the positioning guide means of both molds can be efficiently prevented. Therefore, in the molding of this type of product, where high dimensional accuracy and reliable resin sealing function are particularly required, resin sealing of semiconductor elements etc. with high quality and high reliability is required. It is possible to form fixed molded products, and
This provides excellent practical effects such as providing a durable mold device for resin-sealing molding of semiconductor elements and the like.

Furthermore, for example, even if there is a temperature difference between the mounting plates (fixed plate and movable plate) or between both types and their mounting plates, the replacement work of both types can be simplified regardless of this. Since the process can be carried out in a number of steps, excellent effects such as high efficiency production of this type of resin-sealed molded product can be achieved.

[Brief explanation of the drawing]

1 and 2 show a first embodiment of the mold device according to the present invention, FIG. 1 is a partially cutaway schematic front view showing the main parts of the device, and FIG. FIG. 3 is a partially cutaway schematic front view showing the mold clamping state. FIG. 3 shows a second embodiment of the mold device according to the present invention, and is a partially cutaway schematic front view showing the main parts of the device. FIG. 4 shows a third embodiment of the mold device according to the present invention, and is a partially cutaway schematic front view showing the main parts of the device. FIG. 5 and FIG. 6 are a schematic front view showing a conventional mold device and a partially cutaway front view showing an enlarged view of its essential parts. [Explanation of symbols] 11...Mounting plate (fixed plate) 12...Mounting base 13...Upper mold 14...Lower mold 15...Space block 16...Mounting means 17... Clearance 18... Clearance 19... Guide means 191... Convex taper block 19□... Concave taper block 193... Elastic member 22... Ejector mechanism 221... Ejector plate 222... Eject turbine 223...Elastic member 224...Return bin 23...Ejector mechanism 24...Sliding auxiliary means 25...Fitting hole 26...Sliding auxiliary means

Claims (2)

[Claims] (1) Fix one side of the fixed type or the movable type equipped with an ejector plate for ejecting the product to the mounting board side, and fix the other side of the mold to the mounting board side. The ejector plate is slidably mounted, and is provided with an ejector plate return mechanism that pushes each ejector plate back to a predetermined position when both molds are clamped, and further includes positioning guide means for the fixed type and movable type. When the two molds are clamped, the positioning guide means performs a positioning correction guide function for moving the slidable mold toward the fixed position of the fixed mold. In this mold clamping method, first, during the intermediate mold clamping of the two molds, a position correction guide action is performed for the two molds, and then, both the molds are completely clamped, and the two molds are completely clamped. At the time of complete mold clamping,
A method for clamping a mold for resin sealing molding, characterized in that the return mechanism performs a return action of each ejector plate to push the ejector plate back to a predetermined position. (2) A fixed mold and a movable mold equipped with ejector plates for ejecting the product, a return mechanism that pushes each ejector plate back to a predetermined position when the fixed and movable molds are clamped, and a clamping mechanism for both the molds. A mold device for resin sealing molding, comprising a positioning guide means for the two molds that sometimes performs a positioning correcting guide function for the two molds, The mold is fixed to the mounting board side, and the other mold is slidably mounted to the mounting board side, and the positioning of both molds is corrected when the intermediate molds are clamped. A mold device for resin encapsulation molding, characterized in that it is configured to guide each ejector plate and to push each ejector plate back to a predetermined position when both molds are completely clamped.