JPH01286397A - Electronic circuit base board cooler - Google Patents

Abstract

PURPOSE:To improve cooling efficiency by circulating cooling liquid to a connection tube for connecting in a loop state a tank for containing the liquid to a plurality of cooling sections. CONSTITUTION:A cooler 4 is clamped at an electronic circuit board 7 to bring the cooling face of the cooler 4 into close contact with the upper face of a component such as an IC or the like mounted in high density on the board 7. When a connection tube is connected and a pump 2 is driven, cooling water which absorbs heat from the boards of stages is intaken from a tank 5 to a pump sucking tube 3, and dissipated by a radiator 1. Here, the cooled water is circulated through a connection tube 6A, a cooler 4A, a connecting tube 6B, coolers 4B... a connection tube 6F, the tank 5, a pump sucking tube 3 and the radiator 1. In cooling sections of the stages, the water fed from the inlet 8 of the cooler 4 absorbs heat from the base boards while passing through an inner zigzag tube and discharging from an outlet 9. Thus, an efficient cooling can be performed.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an electronic circuit board cooling device.

[Conventional technology]

2. Description of the Related Art Conventionally, for example, a forced air cooling type cooling device has been used to cool an electronic circuit board with relatively high power consumption in an electronic exchange by blowing air from a blower fan.

[Problem to be solved by the invention]

The conventional electronic circuit delicate cooling device described above is a forced air cooling type, and the refrigerant air has a thermal conductivity λ = 0.0221Kca.
l/m-h'c, heat transfer coefficient α=5×10K c a l
/m''·h°C, which limits its cooling efficiency, and it has the disadvantage that it cannot completely solve the problem of heat generation that accompanies high-density mounting of components on electronic circuit boards.

[Means to solve the problem]

The electronic circuit board cooling device of the present invention includes a liquid-cooled cooling unit that can be closely attached to the electronic circuit board, a tank that stores a cooling liquid, and a loop between this tank and the plurality of cooling units. It is characterized by comprising a connecting pipe and a circulation mechanism that circulates the cooling liquid through the connecting pipe.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an electronic exchange rack showing an embodiment of the electronic circuit board cooling device of the present invention.

In FIG. 1, in order to make it easier to see, only one electronic circuit board is mounted on each stage of the frame, and the bottom stage is not mounted. The cooling device in this embodiment is an electronic circuit board 7A.
, ~7E, cooling units 4A and ~4E are installed in close contact with each other.
, a radiator 1 and a pump 2 mounted on the top of the frame, a tank 5 for storing cooling water installed inside the bottom of the frame,
Pump suction pipe 3 and radiator 1. Electronic circuit board 7A, 7B
.

7C, 7D, 7E, and connecting pipes 6A, 6B, 6C, 6D, 6E, and 6F that connect the tank 5, respectively.

Figures 2 (a) and (b) are front and side views showing an example of the internal structure of the cooler in Figure 1, and Figure 3 is a perspective view showing an example of how to install the cooler in Figure 1. be.

As shown in FIG. 3, the cooler 4 is screwed onto the electronic circuit board 7, and the cooling surface of the cooler 4 is brought into close contact with the upper surface of components such as ICs mounted on the electronic circuit board 7 with high density. When the pump 2 is driven by connecting the connecting pipe to the predetermined location shown in FIG.
The heat is drawn into the pump suction pipe 3, and the heat is radiated by the radiator 1. The cooling water cooled here is connected to the connecting pipe 6A-cooler 4A-
Connecting pipe 6B-cooler 4B... Connection pipe 6F-tank 5-pump suction pipe 3-radiator 1 are circulated.

In each stage of the cooler, as shown in FIG. 2, the cooling water that flows in from the inlet 8 of the cooler 4 passes through an internal meandering pipe and is discharged from the outlet 9 while absorbing heat from the electronic circuit board. .

In this example, the refrigerant has a thermal conductivity of λ-α511Kc.
a I 7m -h'c, heat transfer coefficient cz=3X103
Although water with a temperature of Kcal/m"·h°C is used, it goes without saying that the liquid refrigerant is not limited to this and any liquid refrigerant may be selected.

〔Effect of the invention〕

As explained above, the present invention enables more efficient cooling by changing from forced air cooling using air with low thermal conductivity and heat transfer coefficient to forced liquid cooling using liquid refrigerant that has high thermal conductivity and high heat transfer coefficient. This has the effect of solving the heat problem caused by high-density packaging and improving the packaging limit.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic exchange rack showing an embodiment of the electronic circuit board cooling device of the present invention, and FIG. 2(a). (b) is a front view and a side view showing an example of the internal structure of the cooler in FIG. 1, and FIG. 3 is a perspective view showing an example of a method of attaching the cooler in FIG. 1. 1... Heat radiator, 2... Pump, 3... Pump suction pipe, 4.4A, ~4E... Cooler, 5... Tank,
6A. ~6F... Connection pipe, 7,7A, ~7E... Electronic circuit board, 8... Inlet, 9... Outlet. Shiba l Figures 7A, ~7E: lt + concave lily

Claims (1)

[Claims] a liquid-cooled cooling unit that can be closely attached to an electronic circuit board; a tank that stores a cooling liquid; a connecting pipe that connects the tank and the plurality of cooling units in a loop; An electronic circuit board cooling device comprising: a circulation mechanism that circulates a coolant.