JPH01286349A - Cooling device of integrated circuit - Google Patents
Cooling device of integrated circuitInfo
- Publication number
- JPH01286349A JPH01286349A JP63116646A JP11664688A JPH01286349A JP H01286349 A JPH01286349 A JP H01286349A JP 63116646 A JP63116646 A JP 63116646A JP 11664688 A JP11664688 A JP 11664688A JP H01286349 A JPH01286349 A JP H01286349A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- integrated circuit
- refrigerant
- heat
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 239000003507 refrigerant Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000010276 construction Methods 0.000 abstract 1
- 230000015654 memory Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子装置に使用される集積回路の冷却装置に関
し、特に記憶装置のように、１個の発熱量が低いが大量
にプリント配線板上に搭載される集積回路の冷却装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a cooling device for integrated circuits used in electronic devices, and in particular to cooling devices for integrated circuits used in electronic devices. The present invention relates to a cooling device for an integrated circuit mounted thereon.
電子装置の１部を構成する記憶装置に使用するプリント
配線板上には、ランタムアクセスメモリ（Ｒ，ＡＭ）等
のメモリ系やその制御系からなる複数種類の集積回路が
多数搭載される。そのような電子装置の中で、特に超大
型の電子装置では、制御系の集積回路の発熱量が強制空
冷方式による冷却の限界奮起えているため、水冷方式に
よる冷却装置の採用が活発に行われている。A large number of integrated circuits of a plurality of types including memory systems such as random access memories (R, AM) and their control systems are mounted on a printed wiring board used for a storage device that constitutes a part of an electronic device. Among such electronic devices, especially in ultra-large electronic devices, the amount of heat generated by the integrated circuits in the control system is pushing the limits of cooling using forced air cooling methods, so water-cooling cooling devices are being actively adopted. ing.
一方、１個１個の発熱量が低いが、１枚のプリント配線
板に搭載する数が多いメモリ系の集積回路の冷却方式に
ついては、強制空冷方式の冷却装置が効率の面から最も
適している。従って、制御系の集積回路には水冷方式の
冷却装置を、メモリ系の集積回路には空冷方式の冷却装
置を採用することが行われている。On the other hand, forced air cooling is the most suitable cooling system for memory-based integrated circuits, which generate a small amount of heat per unit but are mounted on a single printed wiring board in large numbers. There is. Therefore, a water cooling system is used for control system integrated circuits, and an air cooling system is used for memory system integrated circuits.
上述したように、一つの電子装置の中に制御系の集積回
路に対する水冷方式の冷却装［ｆｔと、メモリ系の集積
回路に対する空冷方式の冷却装置と全混在させることは
、水冷方式のメリットを失うこととなる。一方、搭載数
の多いメモリ系の集積回路に対して水冷方式の冷却装置
を採用すると、その構造が複雑となるため、コスト高の
要因となる。As mentioned above, by coexisting a water-cooling system [ft] for control system integrated circuits and an air-cooling system cooling system for memory system integrated circuits in one electronic device, the advantages of water cooling system can be realized. You will lose it. On the other hand, if a water-cooling system is used for a large number of memory-based integrated circuits, the structure becomes complicated, which increases costs.
本発明が解決しようとする課題、換言すれば本発明の目
的は、上述のような従来の集積回路の冷却装置の欠点全
解消して、同一電子装置内において水冷方式と空冷方式
との２方式全混在させず、しかもコスト全低減すること
のできる集積回路の冷却装置を提供することにある。The problem to be solved by the present invention, in other words, the purpose of the present invention is to eliminate all the drawbacks of the conventional integrated circuit cooling device as described above, and to provide two cooling methods, water cooling method and air cooling method, in the same electronic device. It is an object of the present invention to provide a cooling device for integrated circuits that does not require any mixing and can reduce the cost.
本発明の集積回路の冷却装置は、プリント配線板上に装
着した複数個の集積回路のそれぞれの上面に密着して設
けられ上面の中央部に直線状の溝と有する複数個のヒー
トシンクと、前記複数個のヒートシンクのうち同一列に
配設されているヒートシンクの前記溝に挿入され弾性を
有し熱伝導性のよい材料で形成された冷媒循環用管とを
備えている。The integrated circuit cooling device of the present invention includes a plurality of heat sinks provided in close contact with the upper surface of each of the plurality of integrated circuits mounted on a printed wiring board and having a linear groove in the center of the upper surface; The refrigerant circulation tube is inserted into the groove of the heat sink arranged in the same row among the plurality of heat sinks and is made of a material having elasticity and good thermal conductivity.
〔実施例〕 次に本発明の実施例について図面を参照して説明する。〔Example〕 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の斜視図、第２図は第１電冒
施例のＡＡｌｊ断面図である。FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is an AAlj sectional view of the first electrically operated embodiment.
第１図および第２図において、本実施例の集積回路の冷
却装置は、プリント配線板１の上に搭載して装着した初
数個の集積回路２のそれぞれの上面にヒートシンク６を
密着して装着している。各ヒートシンク６の上面の中央
には断面がほぼ円形の直線状の溝５が設けられており、
同一列上のヒートシンク６の溝５を貫通して冷媒循環用
管（管）４が配設されている。管４は、内部を通す冷媒
の圧力によって膨張可能な弾性を有し、熱伝導性のよい
材料で形成されている。管４の内部には冷却用の冷媒３
全充填しである。管４は、その両郊１部が冷媒３用の吸
入ロアと排出口８となっている。1 and 2, the integrated circuit cooling device of this embodiment has a heat sink 6 in close contact with the upper surface of each of the first several integrated circuits 2 mounted on a printed wiring board 1. I am wearing it. A linear groove 5 with a substantially circular cross section is provided in the center of the upper surface of each heat sink 6.
A refrigerant circulation pipe (pipe) 4 is disposed to pass through the groove 5 of the heat sink 6 on the same row. The tube 4 has elasticity that can be expanded by the pressure of the refrigerant passing therethrough, and is made of a material with good thermal conductivity. Inside the tube 4 is a refrigerant 3 for cooling.
Fully filled. The pipe 4 has a suction lower part and a discharge port 8 for the refrigerant 3 at both ends thereof.
上述のような構成を有する冷却装置において、管４の冷
媒の圧力を上けていくと、管４が膨張してヒートシンク
６の溝５と密着する。このため集積回路２と管４の内部
の冷媒３との間の熱伝導によって熱交換が行なわれ、集
積回路２が冷却される。In the cooling device having the above configuration, when the pressure of the refrigerant in the tube 4 is increased, the tube 4 expands and comes into close contact with the groove 5 of the heat sink 6. Therefore, heat exchange is performed by heat conduction between the integrated circuit 2 and the refrigerant 3 inside the tube 4, and the integrated circuit 2 is cooled.
以上説明したように、本発明の集積回路の冷却装置は、
プリント配′ＩＭ板上に光域された集積回路の上面に密
着して設けたヒートシンクの上面の溝の中に、直接に冷
媒循環用の管全通し、この管？流通する冷媒と集積回路
との熱交換を可能としたため、構造が簡単で効率のよい
冷却を行うことができる冷却装置が得られるという効果
がある。また、管を弾性を有する材料で形成しているた
め、集積回路の搭載数が多い場合でも、管が常にすべて
のヒートシンクと密着して熱交換全円滑に行うことがで
き、しかも上記のような構成を採用することによって水
冷方式のみを採用することができるという効果もある。As explained above, the integrated circuit cooling device of the present invention has the following features:
The coolant circulation tube is completely passed directly into the groove on the top surface of the heat sink, which is installed in close contact with the top surface of the integrated circuit that is optically distributed on the printed IM board. Since it is possible to exchange heat between the circulating refrigerant and the integrated circuit, it is possible to obtain a cooling device that has a simple structure and can perform efficient cooling. In addition, since the tube is made of an elastic material, even when a large number of integrated circuits are mounted, the tube always remains in close contact with all heat sinks, ensuring smooth heat exchange. By adopting this configuration, there is also the effect that only a water cooling method can be adopted.
第１図は本発明の一実施例を示す斜視図、第２図は第１
図の実施例のＡＡ線断面図である。
ｌ・・・・・・プリント配線板、２・・・・・・集積回
路、３・・・・・・冷媒、４・・・・・・管、５・・・
・・・溝、６・・・・・・ヒートシンク、７・・・・・
・吸入口、８・・・・・・排出口。
代理人 弁理士 内 原 音FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
FIG. 3 is a cross-sectional view taken along line AA of the illustrated embodiment. 1...Printed wiring board, 2...Integrated circuit, 3...Refrigerant, 4...Tube, 5...
...Groove, 6...Heat sink, 7...
・Intake port, 8...Exhaust port. Agent Patent Attorney Oto Uchihara
Claims (1)
ぞれの上面に密着して設けられ上面の中央部に直線状の
溝を有する複数個のヒートシンクと、前記複数個のヒー
トシンクのうち同一列に配設されているヒートシンクの
前記溝に挿入され弾性を有し熱伝導性のよい材料で形成
された冷媒循環用管とを備えることを特徴とする集積回
路の冷却装置。a plurality of heat sinks provided in close contact with the upper surface of each of the plurality of integrated circuits mounted on a printed wiring board and having a linear groove in the center of the upper surface; and a plurality of heat sinks arranged in the same row among the plurality of heat sinks. 1. A cooling device for an integrated circuit, comprising: a refrigerant circulation tube inserted into the groove of a heat sink provided therein and made of a material having elasticity and good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116646A JPH01286349A (en) | 1988-05-12 | 1988-05-12 | Cooling device of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116646A JPH01286349A (en) | 1988-05-12 | 1988-05-12 | Cooling device of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01286349A true JPH01286349A (en) | 1989-11-17 |
Family
ID=14692376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63116646A Pending JPH01286349A (en) | 1988-05-12 | 1988-05-12 | Cooling device of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01286349A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997015801A1 (en) * | 1995-10-24 | 1997-05-01 | Aavid Engineering, Inc. | Liquid cooled heat sink for cooling electronic components |
| US6351381B1 (en) | 2001-06-20 | 2002-02-26 | Thermal Corp. | Heat management system |
| WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
| US6773963B2 (en) * | 2002-01-16 | 2004-08-10 | Intel Corporation | Apparatus and method for containing excess thermal interface material |
| JP2013187396A (en) * | 2012-03-08 | 2013-09-19 | Daikin Ind Ltd | Power module |
| JP2013229363A (en) * | 2012-04-24 | 2013-11-07 | Daikin Ind Ltd | Power module |
| JP2017228105A (en) * | 2016-06-23 | 2017-12-28 | 富士通株式会社 | Information processor |
-
1988
- 1988-05-12 JP JP63116646A patent/JPH01286349A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5829516A (en) * | 1993-12-15 | 1998-11-03 | Aavid Thermal Products, Inc. | Liquid cooled heat sink for cooling electronic components |
| WO1997015801A1 (en) * | 1995-10-24 | 1997-05-01 | Aavid Engineering, Inc. | Liquid cooled heat sink for cooling electronic components |
| WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
| US6351381B1 (en) | 2001-06-20 | 2002-02-26 | Thermal Corp. | Heat management system |
| US6773963B2 (en) * | 2002-01-16 | 2004-08-10 | Intel Corporation | Apparatus and method for containing excess thermal interface material |
| JP2013187396A (en) * | 2012-03-08 | 2013-09-19 | Daikin Ind Ltd | Power module |
| JP2013229363A (en) * | 2012-04-24 | 2013-11-07 | Daikin Ind Ltd | Power module |
| JP2017228105A (en) * | 2016-06-23 | 2017-12-28 | 富士通株式会社 | Information processor |
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