JPH0128047Y2 - - Google Patents

Description

[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) The present invention is a method for connecting and holding, storing or transporting multiple electronic components, especially electronic components having metal electrode terminals, in a band shape. Regarding the electronic components used.

(Prior art and its problems) A chip-type electronic component having a metal electrode terminal (hereinafter referred to as a chip component having a terminal) is a chip-type electronic component having a metal electrode terminal (hereinafter referred to as a chip component having a terminal), as shown in FIG. A pair of lead feet 3 are provided in a notch 2 formed at a predetermined interval along the longitudinal direction, protruding from both sides in the width direction toward the center of the notch 2, and are provided in the feed hole 4. Therefore, in a belt-shaped lead frame that is fed in pitches, a chip component 5 is placed on the upper surface of the opposite end of the lead foot 3.
After placing and fixing the lead foot 3 in sequence,
The lead frame 1 was molded by cutting both ends in the width direction and separating the lead legs 3 from the lead frame 1.

After the chip parts having the terminals formed in the above process are individually checked for their characteristics, in order to facilitate storage and transportation, the chip parts are shaped into a strip having a storage part 6 for the chip parts as shown in FIG. 2, for example. After sequentially storing electronic parts into a storage band 7 to form a series of electronic parts, the series of electronic parts was wound onto a reel or the like.

However, the chip components having the terminals separated from the lead frame 1 must be placed one by one into the storage sections 6 provided at predetermined intervals along the longitudinal direction of the storage band 7. In addition, a separate storage belt for storing the chip parts must be prepared, which is wasteful in terms of efficiency and economy.

In addition, as a known example, there is a technique described in Japanese Patent Publication No. 56-37637, in which a movable adhesive tape is placed below the lead frame, and after electronic components are placed on the lead frame, the lead legs are removed. After cutting, the cut electronic components with terminals are moved downward onto the adhesive tape below and taped. However, this technology requires a large number of parts because the lead frame and the storage member must be arranged in two stages, and also has problems such as requiring a large amount of work space because they are arranged vertically. And it's not desirable.

Still another known example is the technique described in Japanese Utility Model Application Publication No. 57-69297. In this case, an adhesive tape narrower than the distance between a pair of electrodes of an electronic component is separately arranged on a storage band, and an electronic component with electrode terminals obtained in a separate process is adhesively fixed thereon. However, with this technology, a lead frame for providing electrode terminals on electronic components and a storage band for the electronic components are prepared separately, and the electronic components with electrode terminals are manually transferred one by one onto the storage band. Since it has to be adhesively fixed onto the adhesive tape, there are problems in that it takes a lot of time and the number of parts increases.

Furthermore, since the conventional storage band does not use a member to cover the electronic components themselves, there is a problem in that the electronic components may come into contact with each other and be damaged when they are rolled up and stored.

The present invention uses the lead frame used when processing electronic components as an electronic component chain that can easily connect and hold components, thereby creating an extremely efficient and economical electronic component chain that prevents damage to the electronic components. The purpose is to provide.

[Structure of the invention] (Means for solving the problem) The present invention is a method for forming electronic parts using lead frames as they are by laying adhesive tape on the back side of lead frames used when forming electrode terminals (leads) of electronic parts. I try to use them as a group.

(Function) Since each electronic component is attached and supported by the adhesive tape on the back side of the lead frame, even if the lead portion is cut, it remains indirectly supported by the lead frame, and the lead frame can be used as it is as a series of electronic components.

(Example) Hereinafter, an electronic component series of the present invention will be specifically explained according to an example shown in the drawings.

FIG. 3 is a schematic explanatory diagram showing an embodiment of the electronic component series of the present invention, and FIG. 4 is a bottom view showing an embodiment of the electronic component series of the present invention. In FIG. 3, 11 is a strip-shaped lead frame used for attaching terminals in a chip component (electronic component) 15, and this has a feed hole 14 formed with a constant pitch on both sides, and a feed hole 14 formed with a constant pitch on both sides. Along with 14, there is a notch 12 formed along the longitudinal direction at a constant pitch in the center area of the lead frame in the width direction (direction orthogonal to the longitudinal direction); It consists of a pair of U-shaped lead legs 13 arranged therein. A chip component 15 is attached to the upper surface of each end of the pair of lead legs 13 on opposite sides.
The lead frame 11 is placed and fixed in a state where it is stretched between the lead frame 11 (properly molded), and furthermore, in the center area of the lower surface of the lead frame 11 in the width direction, as shown in FIG. An adhesive tape 17 is attached (laid) across both the bottom surface of the lead frame 15 and the lower surface of an intermediate plate 16 that partitions the notches 12 of the lead frame in the longitudinal direction. The width of this tape 17 is formed to be narrower than the distance between the tips of the pair of lead legs 13, 13. Further, the chip component 15 is molded so that its bottom surface is substantially flush with the bottom surface of the lead frame.

Therefore, when processing a chip component having terminals, the lead legs 13 fixed to the bottom surface of the chip component 15 are cut off from both ends to form the lead frame 1.
1, but at this time, the intermediate plate 16 that partitions the notch 12 of the lead frame 11 and the chip component 15 are adhesive tape 17 to their lower and bottom surfaces. Even after the lead legs 13, which become terminals, are cut from the lead frame 11, the chip component with the terminals is retained in the notch 12 of the lead frame 11 (Figures 3 and 4 show the state before cutting). (shown).

On the other hand, an electronic component series 10 connects and holds chip components having terminals using the lead frame 11 having the above structure.
When used as
A cover 18 for protecting chip components having terminals is placed over the electronic component series 10. This cover 18 is a band-shaped cover made of, for example, a plastic film, and has a recess 19 corresponding to a notch 12 formed in the lead frame 11 to accommodate a chip component having a terminal, and may be either transparent or opaque. Figures 3, 4 and 5
In the figure, reference numeral 14A indicates a feed hole bored on the side surface of the cover 18 in the form of a bag, and when the cover 18 is placed over the electronic component series 10, the lead frame 11
It is designed to coincide with the feed hole 14 provided in the. The feed holes 14 and 14A are used to form the electronic component series 1 during automatic mounting of chip components.
The cover 18 can be removed from the electronic component series 10, and the chip component having the terminal can be taken out from within the notch 12 by peeling it off from the adhesive tape 17, and the printed circuit board etc. can be loaded automatically.

As mentioned above, since the width of the adhesive tape 17 is made narrower than the distance between the pair of lead legs of the electronic component, it will not cause any interference during the process of cutting the lead legs, checking the characteristics of the electronic component, and during automatic mounting. It has the unique effect of not causing any concern.

[Effects of the invention] As described above, according to the invention, by simply modifying the lead frame used to attach terminals to chip components, it can be used as an electronic component chain for connecting and holding electronic components having terminals. This eliminates the need for the extra expense and effort of preparing a separate storage band and placing each chip component separately in the storage area, as in the past. Since it is covered with a cover to protect the electronic components, it is possible to prevent the electronic components from being damaged when the storage band is wound up, and it is possible to provide an extremely practical series of electronic components. In addition, it is possible to check the characteristics of individual electronic components in a series of electronic components, and this characteristic check can also be performed automatically during the manufacturing line.Furthermore, if a defective product is found in the above-mentioned characteristic checking process, it can be automatically checked. All you have to do is pull out the defective parts and place good ones in their place in a separate process, making it easy to replace defective parts with good ones.
This can contribute to improving work efficiency.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a lead frame for molding electronic parts having terminals, Fig. 2 is a perspective view showing an example of a conventional storage band for electronic parts, and Fig. 3 is a perspective view of a lead frame for molding electronic parts having terminals. FIG. 4 is a bottom view showing an embodiment of the electronic component series of the present invention, and FIG. 5 is a perspective view showing an embodiment of the electronic component series of the present invention. 10...Electronic component series, 11...Lead frame, 12...Notch, 13...Lead foot, 14,
14A...Spread hole, 15...Electronic parts (chip parts), 16...Intermediate plate, 17...Adhesive tape, 1
8...cover, 19...recess.

Claims (1)

[Scope of utility model registration request] An electronic component is hung over the opposing ends of a pair of lead legs that protrude from both sides in a direction perpendicular to the longitudinal direction of a notch formed at predetermined intervals along the longitudinal direction of a band-shaped metal lead frame. It has a width narrower than the distance between the pair of lead legs, and is adhered to both the bottom surface of the electronic component and the bottom surface of the intermediate plate located between the notch portions of the lead frame, so that the lead frame has a width narrower than the distance between the pair of lead legs. An electronic component series comprising an adhesive tape extending in the direction, both ends of each pair of lead legs being cut off, and a bag-shaped film cover covering the electronic component and lead frame. .